MgB2 films with very high critical current densities due to strong grain boundary pinning

2004 ◽  
Vol 85 (14) ◽  
pp. 2842-2844 ◽  
Author(s):  
H. Kitaguchi ◽  
A. Matsumoto ◽  
H. Kumakura ◽  
T. Doi ◽  
H. Yamamoto ◽  
...  
Author(s):  
I-Fei Tsu ◽  
D.L. Kaiser ◽  
S.E. Babcock

A current theme in the study of the critical current density behavior of YBa2Cu3O7-δ (YBCO) grain boundaries is that their electromagnetic properties are heterogeneous on various length scales ranging from 10s of microns to ˜ 1 Å. Recently, combined electromagnetic and TEM studies on four flux-grown bicrystals have demonstrated a direct correlation between the length scale of the boundaries’ saw-tooth facet configurations and the apparent length scale of the electrical heterogeneity. In that work, enhanced critical current densities are observed at applied fields where the facet period is commensurate with the spacing of the Abrikosov flux vortices which must be pinned if higher critical current density values are recorded. To understand the microstructural origin of the flux pinning, the grain boundary topography and grain boundary dislocation (GBD) network structure of [001] tilt YBCO bicrystals were studied by TEM and HRTEM.


2014 ◽  
Vol 792 ◽  
pp. 21-26 ◽  
Author(s):  
Tatiana Prikhna ◽  
Michael Eisterer ◽  
Wolfgang Gawalek ◽  
Athanasios G. Mamalis ◽  
Artem Kozyrev ◽  
...  

The high pressure (50 MPa - 2 GPa) – high temperature synthesized MgB2 bulk materials are characterized by nearly theoretical density (1-2% porosity), 80-98% connectivity, extremely high critical current densities (e.g. at 20 K, in 0–1 T jc=1.3–1.0 MA·cm-2 (with 10% SiC) and jc= 0.92 – 0.73 MA·cm-2 (without doping)), large irreversibility fields (Birr(18.4 K) =15 T and Birr (0 K) = 32.5 T) and high upper critical fields (Bc2 (22 K) =15 T and Bc2(0 K) ~ 42.1 T). The transformation of grain boundary pinning to point pinning in MgB2-based materials with increasing manufacturing temperature (from 800 to 1050 oC) under pressures from 0.1 to 2 GPa correlates well with an increase in critical current density in low external magnetic fields caused by the redistribution of boron and the oxygen impurities in the material structure. As the manufacturing temperature increases, the discontinuous oxygen enriched layers transform into distinct Mg-B-O inclusions and the size and amount of inclusions of higher magnesium borides MgBX (X>4) are reduced. The effect of oxygen and boron redistribution can be enhanced by Ti or SiC additions.


2008 ◽  
Vol 97 ◽  
pp. 012080 ◽  
Author(s):  
G Fuchs ◽  
K Nenkov ◽  
G Krabbes ◽  
L Shlyk ◽  
R Weinstein ◽  
...  

1995 ◽  
Vol 51 (10) ◽  
pp. 6792-6795 ◽  
Author(s):  
T. Amrein ◽  
L. Schultz ◽  
B. Kabius ◽  
K. Urban

1987 ◽  
Vol 108 ◽  
Author(s):  
R. C. Frye

ABSTRACTNew, high temperature superconducting materials could eventually be used for interconnections in electronic systems. Such interconnections would undoubtedly cost more to implement than conventional ones, so the most likely applications would be for complex, high-speed systems that could benefit from the performance advantages of a resistance-free interconnecting medium. The problem with conventional conductors in these systems is that the resistance of wires increases quadratically as dimensions are scaled down. The most important advantage offered by superconductors is that they are not linked to this scaling rule. Their principal limitation is the maximum current density that they will support and this determines the range of applications for which they are superior to conventional conductors. An analysis will be presented which examines the relative advantages of superconductors for different critical current densities, wire dimensions and system sizes.If their critical current densities are adequate, and if they can statisfy a number of processing criteria, then superconductors could find useful applications in a number of high performance electronic systems. The most likely applications will be those demanding very high interconnection densities. Several of these systems will be discussed.


1999 ◽  
Vol 9 (2) ◽  
pp. 2244-2247 ◽  
Author(s):  
M. Bauer ◽  
R. Semerad ◽  
H. Kinder ◽  
J. Wiesmann ◽  
J. Dzick ◽  
...  

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