Structural, optical, and acoustic characterization of high-quality AlN thick films sputtered on Al2O3(0001) at low temperature for GHz-band electroacoustic devices applications

2004 ◽  
Vol 96 (5) ◽  
pp. 2610-2615 ◽  
Author(s):  
Cinzia Caliendo ◽  
Patrizia Imperatori
2017 ◽  
Vol 122 (8) ◽  
pp. 084103 ◽  
Author(s):  
E. Smirnova ◽  
A. Sotnikov ◽  
S. Ktitorov ◽  
H. Schmidt

2011 ◽  
Vol 26 (3) ◽  
pp. 140-145
Author(s):  
Christophe E Jackson ◽  
John T Tarvin ◽  
Paul A Richardson ◽  
Stephen A Watts ◽  
Paul F Castellanos

The negative effects of environmental noise on sound recordings are recognized in the professional literature. Sound booths and anechoic chambers are examples of controlled acoustical environments widely used in research. However, both enclosures are expensive, require substantial space, and are not portable. Our research has been directed to measuring vocal endurance and voice characteristics of singers before and after sustained voice use. Our desire to acquire high-quality onsite recordings necessitated the development of a portable recording environment. In this article, we report the design, construction, and acoustic characterization of a prototype portable sound box (PSB) to acquire high-quality voice recordings in a controlled, portable acoustical measurement. Simulations were conducted to model the intended use of the PSB by voice users, using two acoustic characterization procedures. The first method showed higher intensity variations by region and depth as frequency changed. For the modified method, intensity response was more uniform and displayed less variation with frequency change. Both methods enabled us to (1) refine the onsite recording procedure, (2) provide insight into potential sources of analysis errors, and (3) develop detailed analysis of frequency intensity response affected by equipment variability. We found that it is possible to construct a PSB for onsite high-quality voice recording.


1994 ◽  
Vol 34 (1-4) ◽  
pp. 549-555 ◽  
Author(s):  
S. Nonomura ◽  
T. Nishiwaki ◽  
E. Nishimura ◽  
S. Hasegawa ◽  
T. Itoh ◽  
...  

1987 ◽  
Vol 102 ◽  
Author(s):  
T. H. Chiu ◽  
E. F. Schubert ◽  
J. E. Cunningham ◽  
W. T. Tsang ◽  
B. Tell

ABSTRACTHigh quality GaAs layers have been grown by chemical beam epitaxy using triethylgallium and arsine. Undoped GaAs epilayer with net acceptor concentration NA - ND = 3}10 14cm-3 has been obtained at a low growth temperature of 500°C. Si dopant diffusion at such low temperature during growth is negligible. Using monolayer doping technique epilayers with Si impurities localized in a 2-dimensional plane were prepared. Capacitance-voltage profiling showed a high sheet electron concentration of lx1013cm-2 and peak widths of 22Å and 18Å at 300K and 77K, respectively, which are the narrowest ever reported. For samples grown or annealed at higher temperatures, significant impurity diffusion was observed.


RSC Advances ◽  
2015 ◽  
Vol 5 (81) ◽  
pp. 66086-66095 ◽  
Author(s):  
Qiang Wang ◽  
Qingjun Guo ◽  
Bing Li

High-quality substitutional Na-modified K2Ti6O13 nanobelts with improved photocatalytic activity were synthesized efficiently from NaCl–KCl melts below 700 °C.


2004 ◽  
Vol 22 (6) ◽  
pp. 2419-2423 ◽  
Author(s):  
Y. J. Zhang ◽  
P. X. Yan ◽  
Z. G. Wu ◽  
J. W. Xu ◽  
W. W. Zhang ◽  
...  

2012 ◽  
Vol 05 (03) ◽  
pp. 1250029 ◽  
Author(s):  
ZUYONG FENG ◽  
DONGQI SHI ◽  
SHIXUE DOU ◽  
YIHUA HU ◽  
XINGUI TANG

High-quality piezoelectric ( Ba 0.85 Ca 0.15)( Zr 0.1 Ti 0.9) O 3 thick films with dense and homogenous microstructures were fabricated at a low sintering temperature (900°C) using a CuBi 2 O 4 sintering aid. The 10 μm thick film exhibited a high longitudinal piezoelectric constant d33, eff of 210 pC/N with estimated unconstrained d33 value of 560 pC/N very close to that in the corresponding bulks. Such excellent piezoelectric effect in the low-temperature sintered ( Ba 0.85 Ca 0.15)( Zr 0.1 Ti 0.9) O 3 thick films is comparable to the case of lead-based PZT thick films, and may be a promising application in lead-free microdevices such as piezoelectric microelectromechanical systems (MEMS).


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