Polycrystalline silicon layer transfer by ion-cut

2003 ◽  
Vol 82 (10) ◽  
pp. 1544-1546 ◽  
Author(s):  
C. H. Yun ◽  
N. Quitoriano ◽  
N. W. Cheung
2020 ◽  
Vol 164 ◽  
pp. 107677 ◽  
Author(s):  
Xing Wei ◽  
Lei Zhu ◽  
Yongwei Chang ◽  
Nan Gao ◽  
Xin Su ◽  
...  

2005 ◽  
Vol 87 (11) ◽  
pp. 111910 ◽  
Author(s):  
Peng Chen ◽  
S. S. Lau ◽  
Paul K. Chu ◽  
K. Henttinen ◽  
T. Suni ◽  
...  

1984 ◽  
Vol 24 (1) ◽  
pp. 192
Author(s):  
RaoGR Mohan ◽  
JohnS Stanczak ◽  
Jih-chan Lien ◽  
Shyam Bhatia

2002 ◽  
Vol 715 ◽  
Author(s):  
Kee-Chan Park ◽  
Jae-Shin Kim ◽  
Woo-Jin Nam ◽  
Min-Koo Han

AbstractResidual ion implantation damage at source/drain junctions of excimer laser annealed polycrystalline silicon (poly-Si) thin film transistor (TFT) was investigated by high-resolution transmission electron microscopy (HR-TEM). Cross-sectional TEM observation showed that XeCl excimer laser (λ=308 nm) energy decreased considerably at the source/drain junctions of top-gated poly-Si TFT due to laser beam diffraction at the gate electrode edges and that the silicon layer amorphized by ion implantation, was not completely annealed at the juncions. The HR-TEM observation showed severe lattice disorder at the junctions of poly-Si TFT.


2012 ◽  
Vol 108 (4) ◽  
pp. 929-934 ◽  
Author(s):  
Zhihao Yue ◽  
Honglie Shen ◽  
Lei Zhang ◽  
Bin Liu ◽  
Chao Gao ◽  
...  

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