Low-resistance nonalloyed ohmic contact to p-type GaN using strained InGaN contact layer

2001 ◽  
Vol 79 (16) ◽  
pp. 2588-2590 ◽  
Author(s):  
Kazuhide Kumakura ◽  
Toshiki Makimoto ◽  
Naoki Kobayashi
2016 ◽  
Vol 109 (5) ◽  
pp. 052102 ◽  
Author(s):  
Xinyu Zhang ◽  
Yimao Wan ◽  
James Bullock ◽  
Thomas Allen ◽  
Andres Cuevas

1995 ◽  
Vol 67 (9) ◽  
pp. 1277-1279 ◽  
Author(s):  
Takeo Ohtsuka ◽  
Masashi Yoshimura ◽  
Katsuhiko Morita ◽  
Masataka Koyama ◽  
Takafumi Yao

1999 ◽  
Vol 595 ◽  
Author(s):  
Mi-Ran Park ◽  
Wayne A. Anderson ◽  
Seong-Ju Park

AbstractA low resistance Ohmic contact to p-type GaN is essential for reliable operation of electronic and optoelectronic devices. Such contacts have been made using Ni/Au and Pd / Au contacts to p-type Mg-doped GaN (1.41×1017 cm−3) grown by metalorganic chemical vapor deposition ( MOCVD ) on ( 0001 ) sapphire substrates. Thermal evaporation was used for the deposition of those metals followed by annealing at temperatures of 400 ∼ 700 °C in an oxygen and nitrogen mixed gas ambient, then subsequently cooled in liquid nitrogen which reduced the specific contact resistance from the range of 9.46∼2.80×10−2 ωcm2 to 9.84∼2.65×10−4 ωcm2 for Ni/Au and from the range of 8.35∼5.01×10−4 ωcm2 to 3.34∼1.80×10−4 ωcm2 for Pd/Au. The electrical characteristics for the contacts were examined by the current versus voltage curves and the specific contact resistance was determined by use of the circular transmission line method (c-TLM). The effects of the cryogenic process on improving Ohmic behavior (I-V linearity) and reducing the specific contact resistance will be discussed from a microstructural analysis which reveals the metallurgy of Ohmic contact formation.


2001 ◽  
Vol 79 (12) ◽  
pp. 1822-1824 ◽  
Author(s):  
Ho Won Jang ◽  
Ki Hong Kim ◽  
Jong Kyu Kim ◽  
Soon-Won Hwang ◽  
Jung Ja Yang ◽  
...  

2009 ◽  
Vol 517 (14) ◽  
pp. 4039-4042 ◽  
Author(s):  
Han-Ki Kim ◽  
Min-Su Yi ◽  
Sung-Nam Lee
Keyword(s):  

2000 ◽  
Vol 5 (S1) ◽  
pp. 901-907
Author(s):  
Mi-Ran Park ◽  
Wayne A. Anderson ◽  
Seong-Ju Park

A low resistance Ohmic contact to p-type GaN is essential for reliable operation of electronic and optoelectronic devices. Such contacts have been made using Ni/Au and Pd / Au contacts to p-type Mg-doped GaN (1.41×1017 cm−3) grown by metalorganic chemical vapor deposition ( MOCVD ) on ( 0001 ) sapphire substrates. Thermal evaporation was used for the deposition of those metals followed by annealing at temperatures of 400 ∼ 700 °C in an oxygen and nitrogen mixed gas ambient, then subsequently cooled in liquid nitrogen which reduced the specific contact resistance from the range of 9.46∼2.80×10−2 Ωcm2 to 9.84∼2.65×10−4 Ωcm2 for Ni/Au and from the range of 8.35∼5.01×10−4 Ωcm2 to 3.34∼1.80×10−4 Ωcm2 for Pd/Au. The electrical characteristics for the contacts were examined by the current versus voltage curves and the specific contact resistance was determined by use of the circular transmission line method (c-TLM). The effects of the cryogenic process on improving Ohmic behavior (I-V linearity) and reducing the specific contact resistance will be discussed from a microstructural analysis which reveals the metallurgy of Ohmic contact formation.


Sensors ◽  
2022 ◽  
Vol 22 (2) ◽  
pp. 630
Author(s):  
Ji-Yeon Choy ◽  
Eun-Bee Jo ◽  
Chang-Joo Yim ◽  
Hae-Kyung Youi ◽  
Jung-Hoon Hwang ◽  
...  

Research on stretchable strain sensors is actively conducted due to increasing interest in wearable devices. However, typical studies have focused on improving the elasticity of the electrode. Therefore, methods of directly connecting wire or attaching conductive tape to materials to detect deformation have been used to evaluate the performance of strain sensors. Polyaniline (PANI), a p-type semiconductive polymer, has been widely used for stretchable electrodes. However, conventional procedures have limitations in determining an appropriate metal for ohmic contact with PANI. Materials that are generally used for connection with PANI form an undesirable metal-semiconductor junction and have significant contact resistance. Hence, they degrade sensor performance. This study secured ohmic contact by adapting Au thin film as the metal contact layer (the MCL), with lower contact resistance and a larger work function than PANI. Additionally, we presented a buffer layer using hard polydimethylsiloxane (PDMS) and structured it into a dumbbell shape to protect the metal from deformation. As a result, we enhanced steadiness and repeatability up to 50% strain by comparing the gauge factors and the relative resistance changes. Consequently, adapting structural methods (the MCL and the dumbbell shape) to a device can result in strain sensors with promising stability, as well as high stretchability.


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