New method to improve thermal stability in the interface of silicon and tungsten by the interposition of plasma deposited tungsten nitride thin film

1994 ◽  
Vol 64 (5) ◽  
pp. 619-621 ◽  
Author(s):  
Chang Woo Lee ◽  
Yong Tae Kim ◽  
Jeong Yong Lee
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
New Method ◽  
Tungsten Nitride ◽  
And Tungsten

TEM Studies of Plasma Deposited Tungsten and Tungsten Nitride Barriers for Thermally Stable Metallization

1993 ◽  
Vol 318 ◽  
Author(s):  
Chang Woo Lee ◽  
Yong Tae Kim ◽  
Suk-Ki Min ◽  
Choochon Lee ◽  
Jeong Yong Lee ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Compressive Stress ◽  
Lattice Constant ◽  
Diffusion Barrier ◽  
Chemical Vapor ◽  
Tungsten Nitride ◽  
Si Substrate ◽  
Chemical Vapor Deposited ◽  
Thermal Stability Of

ABSTRACTPlasma enhanced chemical vapor deposited tungsten nitride (PECVD-W67N33) thin film has been proposed as a diffusion barrier. The resistivity and lattice constant of PECVD-W67N33 are 110-28 μΩ-cm and 4.134 Å, respectively and this film has compressive stress of 2.6 × 1010 dyne/cm2. Thermal stability of PECVD-W67N33 as a diffusion barrier reveals that the interdiffusions between Al or W and Si substrate can be prevented by N interstitial atoms in fcc-W2N grains and grain boundaries.

Thermal stability of tungsten and tungsten nitride Schottky contacts to AlGaN/GaN

2011 ◽  
Vol 20 (6) ◽  
pp. 067303 ◽  
Author(s):  
Fang Liu ◽  
Zhi-Xin Qin ◽  
Fu-Jun Xu ◽  
Sheng Zhao ◽  
Xiang-Ning Kang ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Schottky Contacts ◽  
Tungsten Nitride ◽  
Thermal Stability Of ◽  
And Tungsten

Annealing in water vapor as a new method for improvement of silicon thin film properties

2006 ◽  
Vol 352 (9-20) ◽  
pp. 955-958 ◽  
Author(s):  
S. Honda ◽  
A. Fejfar ◽  
J. Kočka ◽  
T. Yamazaki ◽  
A. Ogane ◽  
...  
Keyword(s):  
Thin Film ◽  
Water Vapor ◽  
New Method ◽  
Silicon Thin Film ◽  
Film Properties

Thin film electrode: a new method for the fabrication of submicrometer band electrodes

1991 ◽  
Vol 36 (5-6) ◽  
pp. 763-771 ◽  
Author(s):  
B.J. Seddon ◽  
M.J. Eddowes ◽  
A. Firth ◽  
A.E. Owen ◽  
H.H.J. Girault
Keyword(s):  
Thin Film ◽  
New Method ◽  
Film Electrode ◽  
Thin Film Electrode

Thermal stability of PECVD W-B-N thin film as a diffusion barrier

1997 ◽  
Author(s):  
YongTae Kim ◽  
Dong J. Kim ◽  
Chang W. Lee ◽  
Jong-Wan Park
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Diffusion Barrier ◽  
Thermal Stability Of
Sign in / Sign up

Export Citation Format

Share Document