Effect of applied mechanical stress on the electromigration failure times of aluminum interconnects

1991 ◽  
Vol 59 (11) ◽  
pp. 1308-1310 ◽  
Author(s):  
H. Kahn ◽  
C. V. Thompson
Keyword(s):  
Mechanical Stress ◽  
Failure Times ◽  
Aluminum Interconnects

A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

1998 ◽  
Vol 516 ◽  
Author(s):  
Jonathan C. Doan ◽  
John C. Bravman ◽  
Paul A. Flinn ◽  
Thomas N. Marieb
Keyword(s):  
Quantitative Study ◽  
High Voltage ◽  
Void Nucleation ◽  
Normal Distributions ◽  
Failure Times ◽  
Interconnect Test ◽  
Entire Structure ◽  
Simultaneous Testing ◽  
Aluminum Interconnects ◽  
A Current

AbstractAccelerated electromigration tests were performed in a High Voltage SEM (HVSEM). These experiments were conducted on 10 identical, passivated Al interconnect test structures at a temperature of 237°C and a current density of 30mA/µm2. Simultaneous testing and observation of the entire structure allowed the void nucleation times to be measured. Two normal distributions fit the nucleation times. The second of these distributions coincides roughly with the distribution of failure times of the test structures. Fracture of the passivation is hypothesized as the mechanism that causes the concurrent late nucleation and failure processes.

Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

1996 ◽  
Vol 427 ◽  
Author(s):  
D. D. Brown ◽  
J. E. Sanchez ◽  
V. Pham ◽  
P. R. Besser ◽  
M. A. Korhonen ◽  
...  
Keyword(s):  
Grain Size ◽  
Stress State ◽  
Mechanical Stress ◽  
Line Width ◽  
Void Volume ◽  
Narrow Line ◽  
Failure Times ◽  
Line Widths ◽  
Critical Void

AbstractIn narrow metal lines used for chip level interconnects, the line width can strongly affect the electromigration reliability, typically due to variations in the microstructure and in the mechanical stress state. These variations have a stronger effect as the line width decreases to the order of the metal grain size or less. Electromigration failure distributions were obtained both experimentally and by simulation for realistic interconnect structures with six different line widths, ranging from lμm to 8μm. In order to simulate the electromigration failure distributions, microstructure statistics were obtained (using TEM) and the critical void volume for failure was measured (using SEM) for each line width. The simulated failure times match the experimental failure times for narrow line widths (1-4μm).

Behaviour of Ni-Mn-Ga alloys under mechanical stress

2003 ◽  
Vol 112 ◽  
pp. 943-946 ◽  
Author(s):  
K. Koho ◽  
J. Vimpari ◽  
L. Straka ◽  
N. Lanska ◽  
O. Sôderberg ◽  
...  
Keyword(s):  
Mechanical Stress

Enhancement of Platelet Sensitivity to ADP-Aggregation by Isometric Exercise in Arteriosclerotic Patients and its Prevention

1977 ◽  
Vol 37 (02) ◽  
pp. 329-338 ◽  
Author(s):  
Tadahiro Sano ◽  
Takeshi Motomiya ◽  
Hiroh Yamazaki ◽  
Takio Shimamoto
Keyword(s):  
Cyclic Amp ◽  
Mechanical Stress ◽  
Optical Density ◽  
Platelet Function ◽  
Isometric Exercise ◽  
Phosphodiesterase Inhibitor ◽  
New Method ◽  
Platelet Aggregability ◽  
Control Subjects ◽  
Healthy Control

SummaryA new method for assessment of platelet sensitivity to ADP-aggregation was devised. Its reproducibility and the correlations between the values obtained by this method, the optical density (O. D.) method, and the screen filtration pressure (SFP) method were assessed. In summary, this method may be said to have three main points:1. It can be performed without centrifugation, avoiding mechanical stress to platelets, using only 0.8 ml. of blood and inexpensive equipment.2. It may reflect different aspects of platelet function from the O. D. method and the SFP method, despite the positive significant correlations between the values obtained by these three methods.3. It was proved to be highly reproducible and is thought to be useful clinically.By using this method, the effect of sustained isometric exercise by handgripping on platelet aggregability was assessed in coronary sclerotic and cerebral arteriosclerotic patients on placebo and EG-626, a newly synthesized cyclic AMP phosphodiesterase inhibitor. On placebo, an enhancement of platelet sensitivity was observed after isometric exercise in coronary and cerebral arteriosclerotic patients but not in healthy control subjects. The enhancement was prevented by pretreatment of EG-626, administered orally 1.5 hours prior to exercise.

Exploring the Biological Protective Role of Carotenoids by Raman Spectroscopy: Mechanical Stress of Cells

2019 ◽  
Vol 64 (1-2) ◽  
pp. 75-82
Author(s):  
F. Nekvapil ◽  
◽  
Cs. Müller Molnár ◽  
S. Tomšić ◽  
S. Cintă Pinzaru ◽  
...  
Keyword(s):  
Raman Spectroscopy ◽  
Mechanical Stress ◽  
Protective Role
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