MÖSSBAUER STUDY OF RESISTIBILITY TO OXIDATION OF THIN FILMS Sn1-xPbxTe AND Sn1-xPbxSe

1980 ◽  
Vol 41 (C1) ◽  
pp. C1-327-C1-328
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D. Baltrùnas ◽  
I. Brodin ◽  
D. Freik ◽  
K. Makariùnas ◽  
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Vacuum ◽  
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G Costeanu

1978 ◽  
Vol 26 (12) ◽  
pp. 883-887 ◽  
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M. Ron ◽  
M. Ohring

1983 ◽  
Vol 19 (5-6) ◽  
pp. 187-199 ◽  
Author(s):  
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S. Varghese ◽  
V. Unnikrishnan Nayar

1985 ◽  
Vol 51 (1-3) ◽  
pp. 273-279 ◽  
Author(s):  
H.M. van Noort ◽  
F.J.A. den Broeder ◽  
H.J.G. Draaisma
Keyword(s):  

2014 ◽  
Vol 81 (5) ◽  
pp. 298 ◽  
Author(s):  
E. A. Shakhno ◽  
D. A. Sinev ◽  
A. M. Kulazhkin

2016 ◽  
Vol 55 (3) ◽  
pp. 038006 ◽  
Author(s):  
Masaya Ichimura ◽  
Takahiro Kajima ◽  
Shoichi Kawai ◽  
Ko Mibu

Author(s):  
John C. Bravman

The fabrication of increasingly complex integrated circuit devices represents one of the most challenging areas of applied materials research. As layout geometries are reduced, device operation becomes more readily influenced both by the presence of various materials defects and by the structural integrity of the interfaces involved. Critical to the manufacture of such devices are the technologies associated with the deposition, doping, and oxidation of thin films of polycrystalline silicon (polysilicon). The strong interrelationship between the last two of these processes can result in the formation of unusual morphologies at the interface between the polysilicon and its thermally grown oxide. Conventional TEM has been applied to establish the nature of several such structures. Because their spatial extent is sometimes extremely small (e.g. 20A), high resolution lattice imaging was utilized in order to gain crystallographic information of a very fine scale.


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