Performance degradation of GaN field-effect transistors due to thermal boundary resistance at GaN∕substrate interface

2004 ◽  
Vol 40 (1) ◽  
pp. 81 ◽  
Author(s):  
V.O. Turin ◽  
A.A. Balandin
2003 ◽  
Vol 764 ◽  
Author(s):  
Konstantin A. Filippov ◽  
Alexander A. Balandin

AbstractWe theoretically investigate the thermal boundary resistance and heat diffusion in AlGaN/GaN heterostructure field-effect transistors. Our calculations based on the diffuse mismatch model show that the thermal boundary resistance at the interface between GaN and SiC can strongly influence the temperature rise in the device channel.


Author(s):  
K.A. Filippov ◽  
A.A. Balandin

We have calculated the thermal boundary resistance at the GaN/SiC, GaN/sapphire and GaN/AlN interfaces in the diffuse mismatch approximation. The obtained values were then used to examine the effect of the thermal boundary resistance on heat diffusion in AlGaN/GaN heterostructure field-effect transistors. The results show that the thermal boundary resistance at the device layer interfaces can strongly influence the temperature rise in the device channel.


Author(s):  
A. V. Sergeev ◽  
E. E. Aksaev ◽  
I. G. Gogidze ◽  
G. N. Gol’tsman ◽  
A. D. Semenov ◽  
...  

2015 ◽  
Vol 15 (3) ◽  
pp. 342-351 ◽  
Author(s):  
Marco R. Cavallari ◽  
Vinicius R. Zanchin ◽  
Marcio A. Valle ◽  
Jose E. E. Izquierdo ◽  
Eduardo M. Rodriguez ◽  
...  

2006 ◽  
Vol 32 (10) ◽  
pp. 904-907 ◽  
Author(s):  
Yu. M. Nikolaenko ◽  
Yu. V. Medvedev ◽  
M. Ghafari ◽  
H. Hahn ◽  
I. N. Chukanova

2014 ◽  
Vol 104 (20) ◽  
pp. 203506 ◽  
Author(s):  
Matin Amani ◽  
Matthew L. Chin ◽  
Alexander L. Mazzoni ◽  
Robert A. Burke ◽  
Sina Najmaei ◽  
...  

2007 ◽  
Vol 101 (5) ◽  
pp. 054508 ◽  
Author(s):  
J. Kuzmík ◽  
S. Bychikhin ◽  
D. Pogany ◽  
C. Gaquière ◽  
E. Pichonat ◽  
...  

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