Proposed configuration of integrated optical isolator employing wafer-direct bonding technique

1997 ◽  
Vol 33 (21) ◽  
pp. 1787 ◽  
Author(s):  
H. Yokoi ◽  
T. Mizumoto
Keyword(s):  
Optical Isolator ◽  
Integrated Optical ◽  
Wafer Direct Bonding ◽  
Bonding Technique

Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding

1998 ◽  
Vol 517 ◽  
Author(s):  
H. Yokoi ◽  
T. Mizumoto
Keyword(s):  
Phase Shift ◽  
Optical Devices ◽  
Optical Isolator ◽  
Cladding Layer ◽  
Integrated Optical ◽  
Wafer Direct Bonding ◽  
Bonding Technique

AbstractA novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of wafer direct bonding technique. This device has a semiconductor guiding layer, so high compatibility in integrating with other semiconductor optical devices is expected.

Feasibility of integrated optical isolator with semiconductor guiding layer fabricated by wafer direct bonding

1999 ◽  
Vol 146 (2) ◽  
pp. 105-110 ◽  
Author(s):  
H. Yokoi ◽  
Y. Nakano ◽  
N. Shinjo ◽  
N. Futakuchi ◽  
N. Kaida ◽  
...  
Keyword(s):  
Optical Isolator ◽  
Integrated Optical ◽  
Wafer Direct Bonding

Tunable DBR Laser with Integrated Optical Isolator

2021 ◽  
Author(s):  
Hauke Conradi ◽  
Tianwen Qian ◽  
Martin Kresse ◽  
Jakob Reck ◽  
David de Felipe ◽  
...  
Keyword(s):  
Optical Isolator ◽  
Integrated Optical

Analysis of polarization independent Mach-Zehnder-type integrated optical isolator

1999 ◽  
Vol 17 (7) ◽  
pp. 1200-1205 ◽  
Author(s):  
O. Zhuromskyy ◽  
M. Lohmeyer ◽  
N. Bahlmann ◽  
H. Dotsch ◽  
P. Hertel ◽  
...  
Keyword(s):  
Optical Isolator ◽  
Integrated Optical ◽  
Polarization Independent
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