Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding
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AbstractA novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of wafer direct bonding technique. This device has a semiconductor guiding layer, so high compatibility in integrating with other semiconductor optical devices is expected.
1999 ◽
Vol 146
(2)
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pp. 105-110
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2002 ◽
Vol 35
(12)
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pp. 1404-1407
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2009 ◽
Vol 48
(6)
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pp. 065502
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2018 ◽
Vol 67
(12)
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pp. 2863-2871
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