Development of double-sided Si neural probe with microfluidic channels using wafer direct bonding technique

2009 ◽  
Author(s):  
R. Kobayashi ◽  
S. Kanno ◽  
S. Lee ◽  
T. Fukushima ◽  
K. Sakamoto ◽  
...  
Keyword(s):  
Microfluidic Channels ◽  
Neural Probe ◽  
Wafer Direct Bonding ◽  
Bonding Technique

Development of Neural Probe with Microfluidic Channel Fabricated by using Wafer Direct Bonding Technique

2008 ◽  
Author(s):  
S. Kanno ◽  
R. Kobayashi ◽  
T. Fukushima ◽  
K. Sakamoto ◽  
N. Katayama ◽  
...  
Keyword(s):  
Microfluidic Channel ◽  
Neural Probe ◽  
Wafer Direct Bonding ◽  
Bonding Technique

Development of Si Neural Probe with Microfluidic Channel Fabricated Using Wafer Direct Bonding

2009 ◽  
Vol 48 (4) ◽  
pp. 04C189 ◽  
Author(s):  
Soichiro Kanno ◽  
Risato Kobayashi ◽  
Lee Sanghoon ◽  
Bea Jicheol ◽  
Takafumi Fukushima ◽  
...  
Keyword(s):  
Microfluidic Channel ◽  
Neural Probe ◽  
Wafer Direct Bonding

scholarly journals Tacky cyclic olefin copolymer: a biocompatible bonding technique for the fabrication of microfluidic channels in COC

Lab on a Chip ◽  
2016 ◽  
Vol 16 (9) ◽  
pp. 1561-1564 ◽  
Author(s):  
Nico Keller ◽  
Tobias M. Nargang ◽  
Matthias Runck ◽  
Frederik Kotz ◽  
Andreas Striegel ◽  
...  
Keyword(s):  
Microfluidic Channels ◽  
Cyclic Olefin Copolymer ◽  
Cyclic Olefin ◽  
Efficient Process ◽  
Cost Efficient ◽  
Bonding Technique

A fast and cost-efficient process for bonding of COC for the fabrication of biologically functionalized microfluidic channels is presented.

Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding

1998 ◽  
Vol 517 ◽  
Author(s):  
H. Yokoi ◽  
T. Mizumoto
Keyword(s):  
Phase Shift ◽  
Optical Devices ◽  
Optical Isolator ◽  
Cladding Layer ◽  
Integrated Optical ◽  
Wafer Direct Bonding ◽  
Bonding Technique

AbstractA novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of wafer direct bonding technique. This device has a semiconductor guiding layer, so high compatibility in integrating with other semiconductor optical devices is expected.

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