Optical frequency stabilisation and line width reduction of a multielectrode DFB laser with current feedback

1987 ◽  
Vol 23 (21) ◽  
pp. 1161 ◽  
Author(s):  
H. Yasaka ◽  
Y. Yoshikuni ◽  
Y. Nakano ◽  
K. Oe
Keyword(s):  
Line Width ◽  
Optical Frequency ◽  
Current Feedback ◽  
Frequency Stabilisation ◽  
Dfb Laser ◽  
Width Reduction

Laser diode optical frequency stabilisation technique on ITU-T frequency grid employing modulated sideband light

2009 ◽  
Vol 45 (13) ◽  
pp. 683 ◽  
Author(s):  
A. Mizutori ◽  
Y. Nishizato ◽  
K. Mori ◽  
T. Yamamoto ◽  
K. Suzuki ◽  
...  
Keyword(s):  
Laser Diode ◽  
Optical Frequency ◽  
Frequency Stabilisation ◽  
Frequency Grid

scholarly journals Role of re-growth interface preparation process for spectral line-width reduction of single InAs site-controlled quantum dots

2015 ◽  
Vol 26 (19) ◽  
pp. 195301 ◽  
Author(s):  
Jesús Herranz ◽  
Lukasz Wewior ◽  
Benito Alén ◽  
David Fuster ◽  
Luisa González ◽  
...  
Keyword(s):  
Quantum Dots ◽  
Spectral Line ◽  
Line Width ◽  
Preparation Process ◽  
Growth Interface ◽  
Spectral Line Width ◽  
Width Reduction

scholarly journals A Novel Optical Frequency-Hopping System Based on DFB Laser Integrated With an EA Modulator

2019 ◽  
Vol 11 (6) ◽  
pp. 1-8
Author(s):  
Dechao Ban ◽  
Ninghua Zhu ◽  
Shijun Xia ◽  
Chenwei Zhang ◽  
Yinfang Chen ◽  
...  
Keyword(s):  
Frequency Hopping ◽  
Optical Frequency ◽  
Dfb Laser

A study of Sub-micron Fan-out Wafer Level Packaging solutions

2018 ◽  
Vol 2018 (1) ◽  
pp. 000488-000493 ◽  
Author(s):  
Yoshio GOTO ◽  
Kosuke URUSHIHARA ◽  
Bunsuke TAKESHITA ◽  
Ken-Ichiro MORI
Keyword(s):  
Wave Front ◽  
Line Width ◽  
Image Sensors ◽  
Wide Field ◽  
Next Generation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Manufacturing Methods ◽  
Width Reduction ◽  
Projection Optics

Abstract In Fan-out Wafer Level Packaging (FOWLP) processes, redistribution layer (RDL) line width reduction is a key challenge to expand the FOWLP market to multi-chip interconnections, including interconnections between SoC and DRAM, split-die connection of FPGA, and interconnections between image sensors and SoC. Next generation FOWLP requires 1.0 μm RDL and future FOWLP is targeting 0.8 μm RDL. To meet these requirements, Canon has developed new projection optics with a high NA and wide-field that is best suited for sub-micron FOWLP. These projection optics are a new option for FPA-5520iV steppers, offering NA 0.24 imaging and a 52 × 34 mm exposure field. FPA-5520iV steppers with NA 0.24 provide excellent 0.8 μm resolution performance throughout all imaging fields thanks to Canon's wave-front aberration based projection optics manufacturing methods and on-axis optical tilt focus sensor.

Doppler Line-Width Reduction

1954 ◽  
Vol 94 (5) ◽  
pp. 1393-1394 ◽  
Author(s):  
M. W. P. Strandberg ◽  
H. Dreicer
Keyword(s):  
Line Width ◽  
Width Reduction
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