Novel electroforming process of metal microstructures by using shielded anode

2006 ◽  
Author(s):  
Zeng Yongbin ◽  
Zhu Di ◽  
Ming Pingmei ◽  
Hu Yangyang
Keyword(s):  
Electroforming Process

Fabrication of Low CTE Metal Masks by the Invar Fe-Ni Alloy Electroforming Process for Large and Fine Pitch OLED Displays

2013 ◽  
Vol 50 (52) ◽  
pp. 117-122 ◽  
Author(s):  
T. Nagayama ◽  
T. Yamamoto ◽  
T. Nakamura ◽  
Y. Mizutani
Keyword(s):  
Electroforming Process ◽  
Fine Pitch ◽  
Ni Alloy

scholarly journals Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process

Micromachines ◽  
2016 ◽  
Vol 7 (1) ◽  
pp. 7 ◽  
Author(s):  
Liqun Du ◽  
Tong Yang ◽  
Ming Zhao ◽  
Yousheng Tao ◽  
Lei Luo ◽  
...  
Keyword(s):  
Microfluidic Chip ◽  
Thickness Uniformity ◽  
Electroforming Process

A graphene superficial layer for the advanced electroforming process

Nanoscale ◽  
2016 ◽  
Vol 8 (25) ◽  
pp. 12710-12714 ◽  
Author(s):  
Hokyun Rho ◽  
Mina Park ◽  
Seungmin Lee ◽  
Sukang Bae ◽  
Tae-Wook Kim ◽  
...  
Keyword(s):  
Superficial Layer ◽  
Electroforming Process

scholarly journals Numerical Analysis and Experimental Study on Fabrication of High Aspect Ratio Tapered Ultrafine Holes by Over-Growth Electroforming Process

Micromachines ◽  
2019 ◽  
Vol 10 (12) ◽  
pp. 824
Author(s):  
Yunyan Zhang ◽  
Pingmei Ming ◽  
Runqing Li ◽  
Ge Qin ◽  
Xinmin Zhang ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Structural Parameters ◽  
Geometric Shape ◽  
High Tech ◽  
Shape Evolution ◽  
Metallic Plate ◽  
Electroforming Process ◽  
Photoresist Film ◽  
The Relationship

High aspect ratio (HAR) ultrafine tapered holes (diameter ≤5 μm; AR ≥5) are the most important elements for some high-tech perforated metallic products, but they are very difficult to manufacture. Therefore, this paper proposes a nontraditional over-growth electroforming process. The formation mechanism of the HAR ultrafine tapered holes is investigated, and the factors controlling the geometric shape evolution are analyzed numerically. It was found that the geometric shape and dimensions of the holes are highly dependent on the diameter and thickness of the photoresist film patterns, but are hardly affected by the spacing between two neighboring patterns; the achievable diameter for a given hole depth becomes small with the increasing pattern diameter, but it becomes big with the increasing pattern thickness. These correlations can be well interpreted by the established two empirical equations that characterize the relationship between the minimum orifice of the tapered hole and the structural parameters of the photoresist film patterns previously formed on the substrate. Application of the fabricated 1500 tapered holes with 3-μm diameter and 17-AR as the nozzles of the medical precision nebulizer is also examined. The studies show that the over-growth electroforming process is highly applicable in fabricating the perforated metallic plate with HAR ultrafine tapered holes.

Electroforming In Space And Ground Telescopes

2020 ◽  
Author(s):  
Valsecchi Giuseppe
Keyword(s):  
Radio Telescope ◽  
Grazing Incidence ◽  
Space Telescopes ◽  
Telescope Array ◽  
X Ray ◽  
Electroforming Process ◽  
Space Agency ◽  
Thin Nickel ◽  
Grazing Incidence Optics ◽  
Italian Space Agency

In the last 25 years, electroforming process has been extensively optimized to produce grazing incidence optics for the X-ray space telescopes, enabling the renown observatories Beppo-SAX for the Italian Space Agency, SWIFT for NASA, XMM Newton for ESA, eROSITA for MPE. These optics are made of thin Nickel mirrors that are grown by electroforming process in an electrolytic bath on a Gold coated mandrel.Electroforming has also been adopted for production of large reflector panels for sub-millimeter radio telescope applications. Between 2006 and 2016, 3000 mirror panels for 25 antennas of the ALMA radio-telescope array of ESO and 1600 mirror panels for the 50-m diameter Large Millimeter Telescope (LMT) “Alfonso Serrano” of INAOE were designed, produced and tested.

Thick photoresists for electroforming metallic microcomponents

2008 ◽  
Vol 222 (1) ◽  
pp. 37-42 ◽  
Author(s):  
X Wei ◽  
C-H Lee ◽  
Z Jiang ◽  
K Jiang
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Current Paper ◽  
Sem Images ◽  
Advantages And Disadvantages ◽  
Uv Lithography ◽  
Electroforming Process ◽  
Electroformed Nickel ◽  
Scanning Electron

Recently, microelectroforming has been extensively applied to fabricating metallic components for sensors, actuators, and other systems. Thick photoresists are used for making micromoulds for electroforming and closely related to the quality and costs of an electroforming process. In the current paper, thick UV photoresists SU8, BPR100, and KMPR are analysed and compared in their electroforming performance of nickel microcomponents. Optimized UV lithography processes are introduced for producing micromoulds in each of the resists and scanning electron microscope (SEM) images of the moulds are presented and analysed. Then, electroformed nickel components from the micromoulds are presented. Finally, applicability of the photoresists to electroforming microcomponents is discussed. Each of the resists demonstrates advantages and disadvantages to suit different applications.

Nanocrystaline Electroforming Process

CIRP Annals ◽  
2002 ◽  
Vol 51 (1) ◽  
pp. 173-176 ◽  
Author(s):  
D. Zhu ◽  
W.N. Lei ◽  
N.S. Qu ◽  
H.Y. Xu
Keyword(s):  
Electroforming Process
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