Fabrication of Low CTE Metal Masks by the Invar Fe-Ni Alloy Electroforming Process for Large and Fine Pitch OLED Displays

2013 ◽  
Vol 50 (52) ◽  
pp. 117-122 ◽  
Author(s):  
T. Nagayama ◽  
T. Yamamoto ◽  
T. Nakamura ◽  
Y. Mizutani
Keyword(s):  
Electroforming Process ◽  
Fine Pitch ◽  
Ni Alloy

Effect of CeO$lt;inf$gt;2$lt;/inf$gt;-based Solid Solutions on Hydrogen Storage Kinetic Properties of Mg$lt;inf$gt;2$lt;/inf$gt;Ni Alloy

2014 ◽  
Vol 29 (12) ◽  
pp. 1241
Author(s):  
ZHANG Guo-Fang ◽  
ZHANG Yang-Huan ◽  
LIU Zhuo-Cheng ◽  
XU Jian-Yi ◽  
ZHANG Yin
Keyword(s):  
Hydrogen Storage ◽  
Solid Solutions ◽  
Kinetic Properties ◽  
Ni Alloy

INVAR M93

Alloy Digest ◽  
2008 ◽  
Vol 57 (1) ◽  
Keyword(s):  
Fracture Toughness ◽  
Low Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Low Temperatures ◽  
Bend Strength ◽  
Temperature Performance ◽  
Ni Content ◽  
Precision Alloys ◽  
Ni Alloy

Abstract Invar is an Fe-Ni alloy with 36% Ni content that exhibits the lowest expansion of known metals from very low temperatures up to approximately 230 deg C (445 deg F). Invar M93 is a cryogenic Invar with improved weldability. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear and bend strength as well as fracture toughness and fatigue. It also includes information on low temperature performance as well as forming and joining. Filing Code: FE-143. Producer or source: Metalimphy Precision Alloys.

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

Sign in / Sign up

Export Citation Format

Share Document