Semiconductor technology computer aided design

1996 ◽  
Author(s):  
A.G. O'Neill
Keyword(s):  
Computer Aided Design ◽  
Semiconductor Technology ◽  
Computer Aided ◽  
Aided Design

scholarly journals Tool Setup Improvement for Package Scratch Mitigation at End-of-Line Process

2020 ◽  
pp. 1-5
Author(s):  
A. Sumagpang Jr. ◽  
F. R. Gomez ◽  
R. Rodriguez
Keyword(s):  
Computer Aided Design ◽  
Semiconductor Device ◽  
Device Simulation ◽  
Actual Process ◽  
Semiconductor Technology ◽  
Computer Aided ◽  
Line Process ◽  
Process Replication ◽  
Aided Design ◽  
Technology Trends

With new and continuous semiconductor technology trends, challenges in assembly manufacturing are inevitable. This paper focused on the elimination of assembly defects particularly package chip-out and scratch at the singulation end-of-line (EOL) process of a semiconductor device.  Simulation using computer-aided design (CAD) tools, actual process replication, and validations were done, eventually verifying and replicating the desired defect signatures. Singulation tool setup of the package was improved and a standardized tool setup was established based on the simulation and actual validations, resulting to at least 90% improvement in assembly EOL process parts per million (ppm) reduction.

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