Process Multiplicity and Process Dynamics: Weaving the Space of Possible Paths

In research on process organization studies, the concept of multiplicity is widely used, but a fundamental confusion about what process multiplicity means persists. As a result, we miss some of the potential of this concept for understanding process dynamics and process change. In this paper, we define process multiplicity as a duality of ‘one’ and ‘many’, and we conceptualize ‘the many’ as a space of possible paths encompassed by a process. We use the notion of paths to operationalize process multiplicity and make it accessible for empirical research. When we see process as a multiplicity, process change can be understood as expanding, shifting or contracting the space of possible paths. We suggest that this concept of process multiplicity also has implications for a range of other theoretical and practical topics, including standards, standardization and flexibility as well as process replication, management and resilience.

Tool Setup Improvement for Package Scratch Mitigation at End-of-Line Process

With new and continuous semiconductor technology trends, challenges in assembly manufacturing are inevitable. This paper focused on the elimination of assembly defects particularly package chip-out and scratch at the singulation end-of-line (EOL) process of a semiconductor device. Simulation using computer-aided design (CAD) tools, actual process replication, and validations were done, eventually verifying and replicating the desired defect signatures. Singulation tool setup of the package was improved and a standardized tool setup was established based on the simulation and actual validations, resulting to at least 90% improvement in assembly EOL process parts per million (ppm) reduction.