Three-Dimensional Protein Microarray Fabricated on Reactive Microspheres Modified COC Substrate

2021 ◽  
Author(s):  
Jian Yan ◽  
Changwen Zhao ◽  
Yuhong Ma ◽  
Wantai Yang
Keyword(s):  
Surface Structure ◽  
Protein Microarray ◽  
Three Dimensional ◽  
High Density ◽  
Polymeric Microspheres ◽  
3D Surface

Fabrication of three-dimensional (3D) surface structure for high density immobilization of biomolecules is an effective way to prepare high sensitive biochips. In this work, a strategy to attach polymeric microspheres...

scholarly journals Data-Driven Intelligent 3D Surface Measurement in Smart Manufacturing: Review and Outlook

Machines ◽  
2021 ◽  
Vol 9 (1) ◽  
pp. 13
Author(s):  
Yuhang Yang ◽  
Zhiqiao Dong ◽  
Yuquan Meng ◽  
Chenhui Shao
Keyword(s):  
High Resolution ◽  
High Performance ◽  
Sampling Design ◽  
Three Dimensional ◽  
Measurement Data ◽  
Data Driven ◽  
Surface Measurement ◽  
Smart Manufacturing ◽  
Future Research ◽  
3D Surface

High-fidelity characterization and effective monitoring of spatial and spatiotemporal processes are crucial for high-performance quality control of many manufacturing processes and systems in the era of smart manufacturing. Although the recent development in measurement technologies has made it possible to acquire high-resolution three-dimensional (3D) surface measurement data, it is generally expensive and time-consuming to use such technologies in real-world production settings. Data-driven approaches that stem from statistics and machine learning can potentially enable intelligent, cost-effective surface measurement and thus allow manufacturers to use high-resolution surface data for better decision-making without introducing substantial production cost induced by data acquisition. Among these methods, spatial and spatiotemporal interpolation techniques can draw inferences about unmeasured locations on a surface using the measurement of other locations, thus decreasing the measurement cost and time. However, interpolation methods are very sensitive to the availability of measurement data, and their performances largely depend on the measurement scheme or the sampling design, i.e., how to allocate measurement efforts. As such, sampling design is considered to be another important field that enables intelligent surface measurement. This paper reviews and summarizes the state-of-the-art research in interpolation and sampling design for surface measurement in varied manufacturing applications. Research gaps and future research directions are also identified and can serve as a fundamental guideline to industrial practitioners and researchers for future studies in these areas.

scholarly journals Evidence of Three-Dimensional Asymmetries Seeded by High-Density Carbon-Ablator Nonuniformity in Experiments at the National Ignition Facility

2021 ◽  
Vol 126 (2) ◽  
Author(s):  
D. T. Casey ◽  
B. J. MacGowan ◽  
J. D. Sater ◽  
A. B. Zylstra ◽  
O. L. Landen ◽  
...  
Keyword(s):  
Three Dimensional ◽  
High Density ◽  
National Ignition Facility

Hierarchical Nano/Micro-structured Surfaces with High Surface Area/Volume Ratios

2021 ◽  
pp. 1-36
Author(s):  
Ketki Lichade ◽  
Yizhou Jiang ◽  
Yayue Pan
Keyword(s):  
Surface Structure ◽  
Surface Area ◽  
Light Trapping ◽  
High Surface ◽  
High Surface Area ◽  
Three Dimensional ◽  
Structure Design ◽  
Surface Structures ◽  
Structured Surfaces ◽  
Design And Manufacture

Abstract Recently, many studies have investigated additive manufacturing of hierarchical surfaces with high surface area/volume (SA/V) ratios, and their performance has been characterized for applications in next-generation functional devices. Despite recent advances, it remains challenging to design and manufacture high SA/V ratio structures with desired functionalities. In this study, we established the complex correlations among the SA/V ratio, surface structure geometry, functionality, and manufacturability in the Two-Photon Polymerization (TPP) process. Inspired by numerous natural structures, we proposed a 3-level hierarchical structure design along with the mathematical modeling of the SA/V ratio. Geometric and manufacturing constraints were modeled to create well-defined three-dimensional hierarchically structured surfaces with a high accuracy. A process flowchart was developed to design the proposed surface structures to achieve the target functionality, SA/V ratio, and geometric accuracy. Surfaces with varied SA/V ratios and hierarchy levels were designed and printed. The wettability and antireflection properties of the fabricated surfaces were characterized. It was observed that the wetting and antireflection properties of the 3-level design could be easily tailored by adjusting the design parameter settings and hierarchy levels. Furthermore, the proposed surface structure could change a naturally-hydrophilic surface to near-superhydrophobic. Geometrical light trapping effects were enabled and the antireflection property could be significantly enhanced (>80% less reflection) by the proposed hierarchical surface structures. Experimental results implied the great potential of the proposed surface structures for various applications such as microfluidics, optics, energy, and interfaces.

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

Three-Dimensional Magneto-Optical Recording

2004 ◽  
Vol 834 ◽  
Author(s):  
Akiyoshi Itoh
Keyword(s):  
Storage System ◽  
Three Dimensional ◽  
Optical Recording ◽  
High Density ◽  
The Novel ◽  
National Project ◽  
3 Dimensional ◽  
Disk Storage ◽  
High Density Recording ◽  
New Type

ABSTRACTIn this report, the newly developed three-dimensional magneto-optical (MO) recording scheme and the experimental results are reported. A part of this work has been done as the national project of 3D-MO (3-dimensional MO) project. It started at September 1998 and ended March 2002 as a part of the national project “Nanometer-Scale Optical High Density Disk Storage System” and aimed at achieving 100 Gb/in2 in storage density. Three-dimensional MO recording is one of the prosperous candidates of next generation ultra high density recording. Magnetic amplifying MO system (MAMMOS) is employed for achieving the novel three-dimensional MO recording. Double-MAMMOS scheme consists of 2-recording layers of differing compensation temperature (Tcomp ) and one readout layer was proposed and discussed.With write/read test it is succeeded to show the results corresponding to a 100 Gb/in2 (50 Gb/in2 × 2) recording density. We also proposed and showed results of simulations of a new type of Double-MAMMOS in which the recording layers can hold quadri-valued information by single writing process.

scholarly journals Three-dimensional high-density co-culture with primary tenocytes induces tenogenic differentiation in mesenchymal stem cells

2011 ◽  
Vol 29 (9) ◽  
pp. 1351-1360 ◽  
Author(s):  
Philipp R. A. Schneider ◽  
Constanze Buhrmann ◽  
Ali Mobasheri ◽  
Ulrike Matis ◽  
Mehdi Shakibaei
Keyword(s):  
Stem Cells ◽  
Mesenchymal Stem Cells ◽  
Three Dimensional ◽  
High Density ◽  
Tenogenic Differentiation

Performing Distance Measurements in Curved Facial Regions: A Comparison between Three-Dimensional Surface Scanning and Ultrasound Imaging

2021 ◽  
Author(s):  
Michael Alfertshofer ◽  
Konstantin Frank ◽  
Dmitry V. Melnikov ◽  
Nicholas Möllhoff ◽  
Robert H. Gotkin ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Dimensional Accuracy ◽  
Ultrasound Measurement ◽  
Surface Scanning ◽  
Distance Measurements ◽  
Surgical Performance ◽  
Facial Region ◽  
3D Surface ◽  
The Face ◽  
The Mean

AbstractFacial flap surgery depends strongly on thorough preoperative planning and precise surgical performance. To increase the dimensional accuracy of transferred facial flaps, the methods of ultrasound and three-dimensional (3D) surface scanning offer great possibilities. This study aimed to compare different methods of measuring distances in the facial region and where they can be used reliably. The study population consisted of 20 volunteers (10 males and 10 females) with a mean age of 26.7 ± 7.2 years and a mean body mass index of 22.6 ± 2.2 kg/m2. Adhesives with a standardized length of 20 mm were measured in various facial regions through ultrasound and 3D surface scans, and the results were compared. Regardless of the facial region, the mean length measured through ultrasound was 18.83 mm, whereas it was 19.89 mm for 3D surface scans, with both p < 0.0001. Thus, the mean difference was 1.17 mm for ultrasound measurements and 0.11 mm for 3D surface scans. Curved facial regions show a great complexity when it comes to measuring distances due to the concavity and convexity of the face. Distance measurements through 3D surface scanning showed more accurate distances than the ultrasound measurement. Especially in “complex” facial regions (e.g., glabella region and labiomental sulcus), the 3D surface scanning showed clear advantages.

Aeroelastic Stability of Lifting Surfaces in High-Density Fluids

1959 ◽  
Vol 3 (01) ◽  
pp. 10-21 ◽  
Author(s):  
Charles J. Henry ◽  
John Dugundji ◽  
Holt Ashley
Keyword(s):  
Degrees Of Freedom ◽  
Three Dimensional ◽  
Separated Flow ◽  
High Density ◽  
Aeroelastic Stability ◽  
Free Surfaces ◽  
Elastic Systems ◽  
Static Instability ◽  
Theoretical Evidence ◽  
Lifting Surfaces

The large increases anticipated in speeds of vehicles towed or propelled underwater suggests a re-examination of the problem of stability of flexible lifting surfaces mounted thereon. Experimental and theoretical evidence is assembled which suggests that oscillatory aeroelastic instability (flutter) is very unlikely at the structural-to-fluid mass ratios typical of hydrodynamic operation. It is shown that static instability (divergence) is the more important practical problem but that its occurrence can be predicted with greater confidence. Flutter data obtained in high-density fluids are reviewed, and various sources of inaccuracy in their theoretical prediction are analyzed. The need is expressed for more precise means of analytically representing both dynamic-elastic systems and three-dimensional unsteady hydrodynamic loads. For a simple hydrofoil with single degrees of freedom in bending and torsion, the theoretical influence of several significant parameters on high-density flutter is calculated and discussed. Recommendations are made for refinements to existing techniques of analysis to include the presence of channel boundaries, free surfaces, cavitation or separated flow.

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