Sub-5 nm monolayer germanium selenide (GeSe) MOSFETs: towards a high performance and stable device

Nanoscale ◽  
2020 ◽  
Vol 12 (28) ◽  
pp. 15443-15452
Author(s):  
Ying Guo ◽  
Feng Pan ◽  
Gaoyang Zhao ◽  
Yajie Ren ◽  
Binbin Yao ◽  
...  
Keyword(s):  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Device Performance ◽  
Gate Length ◽  
Germanium Selenide ◽  
Technology Roadmap

ML GeSe field-effect transistors have an excellent device performance, even at the 1 nm gate-length. The on-state current of the devices can fulfill the requirements of the International Technology Roadmap for Semiconductors (2013 version).

scholarly journals Effects of Doping Concentration on Device Performance of GaN-based Nano-regime MOSFETs

2017 ◽  
Vol 16 (1) ◽  
pp. 69-74
Author(s):  
Md Iktiham Bin Taher ◽  
Md. Tanvir Hasan
Keyword(s):  
Field Effect ◽  
Doping Concentration ◽  
Field Effect Transistors ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Device Performance ◽  
Gate Length ◽  
Drain Voltage ◽  
Switching Device ◽  
Device Applications

Gallium nitride (GaN) based metal-oxide semiconductor field-effect transistors (MOSFETs) are promising for switching device applications. The doping of n- and p-layers is varied to evaluate the figure of merits of proposed devices with a gate length of 10 nm. Devices are switched from OFF-state (gate voltage, VGS = 0 V) to ON-state (VGS = 1 V) for a fixed drain voltage, VDS = 0.75 V. The device with channel doping of 1×1016 cm-3 and source/drain (S/D) of 1×1020 cm-3 shows good device performance due to better control of gate over channel. The ON-current (ION), OFF-current (IOFF), subthreshold swing (SS), drain induce barrier lowering (DIBL), and delay time are found to be 6.85 mA/μm, 5.15×10-7 A/μm, 87.8 mV/decade, and 100.5 mV/V, 0.035 ps, respectively. These results indicate that GaN-based MOSFETs are very suitable for the logic switching application in nanoscale regime.

High performance electronic devices based on nanofibers via a crosslinking welding process

Nanoscale ◽  
2018 ◽  
Vol 10 (41) ◽  
pp. 19427-19434 ◽  
Author(s):  
Youchao Cui ◽  
You Meng ◽  
Zhen Wang ◽  
Chunfeng Wang ◽  
Guoxia Liu ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Epoxy Resin ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Electronic Devices ◽  
Welding Process ◽  
Device Performance ◽  
Adhesion Performance

An amine-hardened epoxy resin was selected as adhesion agent to weld nanofiber and improve the adhesion performance, resulting in low contact-resistance nanofiber networks (NFNs). The field-effect transistors based on In2O3 NFNs/SiO2 exhibit high device performance.

scholarly journals Device performance limits and negative capacitance of monolayer GeSe and GeTe tunneling field effect transistors

RSC Advances ◽  
2020 ◽  
Vol 10 (27) ◽  
pp. 16071-16078 ◽  
Author(s):  
Peipei Xu ◽  
Jiakun Liang ◽  
Hong Li ◽  
Fengbin Liu ◽  
Jun Tie ◽  
...  
Keyword(s):  
Low Power ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Device Performance ◽  
Negative Capacitance ◽  
Performance Limits ◽  
Tunneling Field Effect Transistors

The ML GeSe and GeTe NCTFETs fulfill the ITRS low power and high performance devices, respectively, at the “4/3” node range.

scholarly journals High Performance Field-Effect Transistors Based on Partially Suspended 2D Materials via Block Copolymer Lithography

Polymers ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 566
Author(s):  
Simon Kim ◽  
Su Eon Lee ◽  
Jun Hyun Park ◽  
Jin Yong Shin ◽  
Bom Lee ◽  
...  
Keyword(s):  
Block Copolymer ◽  
Self Assembly ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
2D Materials ◽  
Electronic Devices ◽  
Great Promise ◽  
Substrate Effect ◽  
Device Performance

Although various two-dimensional (2D) materials hold great promise in next generation electronic devices, there are many challenges to overcome to be used in practical applications. One of them is the substrate effect, which directly affects the device performance. The large interfacial area and interaction between 2D materials and substrate significantly deteriorate the device performance. Several top-down approaches have been suggested to solve the problem. Unfortunately, however, they have some drawbacks such as a complicated fabrication process, a high production cost, or a poor mechanical property. Here, we suggest the partially suspended 2D materials-based field-effect transistors (FETs) by introducing block copolymer (BCP) lithography to fabricate the substrate effect-free 2D electronic devices. A wide range of nanometer size holes (diameter = 31~43 nm) is successfully realized with a BCP self-assembly nanopatterning process. With this approach, the interaction mechanism between active 2D materials and substrate is elucidated by precisely measuring the device performance at varied feature size. Our strategy can be widely applied to fabricate 2D materials-based high performance electronic, optoelectronic, and energy devices using a versatile self-assembly nanopatterning process.

Highly efficient photovoltaics and field-effect transistors based on copolymers of mono-fluorinated benzothiadiazole and quaterthiophene: synthesis and effect of the molecular weight on device performance

2015 ◽  
Vol 6 (33) ◽  
pp. 6050-6057 ◽  
Author(s):  
Minghui Hao ◽  
Xiaodong Li ◽  
Keli Shi ◽  
Dongjun Xie ◽  
Xuan Zeng ◽  
...  
Keyword(s):  
Molecular Weight ◽  
Conjugated Polymer ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Device Performance ◽  
Highly Efficient

A D–A conjugated polymer based on mono-fluorinated benzothiadiazole (FBT) was designed and synthesized, and high performance photovoltaics and FETs were achieved.

scholarly journals Polarization-sensitive photodetectors based on three-dimensional molybdenum disulfide (MoS2) field-effect transistors

Nanophotonics ◽  
2020 ◽  
Vol 9 (16) ◽  
pp. 4719-4728
Author(s):  
Tao Deng ◽  
Shasha Li ◽  
Yuning Li ◽  
Yang Zhang ◽  
Jingye Sun ◽  
...  
Keyword(s):  
Molybdenum Disulfide ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Three Dimensional ◽  
Polarized Light ◽  
Optical Field ◽  
Two Dimensional ◽  
Polarization Ratio ◽  
Two Dimensional Materials

AbstractThe molybdenum disulfide (MoS2)-based photodetectors are facing two challenges: the insensitivity to polarized light and the low photoresponsivity. Herein, three-dimensional (3D) field-effect transistors (FETs) based on monolayer MoS2 were fabricated by applying a self–rolled-up technique. The unique microtubular structure makes 3D MoS2 FETs become polarization sensitive. Moreover, the microtubular structure not only offers a natural resonant microcavity to enhance the optical field inside but also increases the light-MoS2 interaction area, resulting in a higher photoresponsivity. Photoresponsivities as high as 23.8 and 2.9 A/W at 395 and 660 nm, respectively, and a comparable polarization ratio of 1.64 were obtained. The fabrication technique of the 3D MoS2 FET could be transferred to other two-dimensional materials, which is very promising for high-performance polarization-sensitive optical and optoelectronic applications.

scholarly journals Ab initio perspective of ultra-scaled CMOS from 2D-material fundamentals to dynamically doped transistors

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Aryan Afzalian
Keyword(s):  
Field Effect ◽  
High Performance ◽  
Field Effect Transistor ◽  
High Mobility ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Grand Challenge ◽  
Gate Length ◽  
Delay Performance ◽  
Effect Transistor

AbstractUsing accurate dissipative DFT-NEGF atomistic-simulation techniques within the Wannier-Function formalism, we give a fresh look at the possibility of sub-10-nm scaling for high-performance complementary metal oxide semiconductor (CMOS) applications. We show that a combination of good electrostatic control together with high mobility is paramount to meet the stringent roadmap targets. Such requirements typically play against each other at sub-10-nm gate length for MOS transistors made of conventional semiconductor materials like Si, Ge, or III–V and dimensional scaling is expected to end ~12 nm gate-length (pitch of 40 nm). We demonstrate that using alternative 2D channel materials, such as the less-explored HfS2 or ZrS2, high-drive current down to ~6 nm is, however, achievable. We also propose a dynamically doped field-effect transistor concept, that scales better than its MOSFET counterpart. Used in combination with a high-mobility material such as HfS2, it allows for keeping the stringent high-performance CMOS on current and competitive energy-delay performance, when scaling down to virtually 0 nm gate length using a single-gate architecture and an ultra-compact design (pitch of 22 nm). The dynamically doped field-effect transistor further addresses the grand-challenge of doping in ultra-scaled devices and 2D materials in particular.

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