A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics

2018 ◽  
Vol 6 (24) ◽  
pp. 6406-6415 ◽  
Author(s):  
Yue Dong ◽  
Zhijie Lin ◽  
Xiaodong Li ◽  
Qi Zhu ◽  
Ji-Guang Li ◽  
...  
Keyword(s):  
Low Temperature ◽  
Printed Electronics ◽  
Cu Films ◽  
Air Atmosphere ◽  
Metal Organic ◽  
Organic Decomposition

A Cu–diamine formulated ink for obtaining flexible conductive Cu films in an air atmosphere at temperatures as low as 130 °C.

A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics

2014 ◽  
Vol 6 (5) ◽  
pp. 3312-3319 ◽  
Author(s):  
Dong-Hun Shin ◽  
Seunghee Woo ◽  
Hyesuk Yem ◽  
Minjeong Cha ◽  
Sanghun Cho ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Metal Organic ◽  
Organic Decomposition

Low-temperature Crystallization of Metal Organic Decomposition BaTiO3Thin Film by Hydrothermal Annealing

2000 ◽  
Vol 39 (Part 1, No. 7A) ◽  
pp. 4217-4219 ◽  
Author(s):  
Zhiqiang Wei ◽  
Huaping Xu ◽  
Kaoru Yamashita ◽  
Masanori Okuyama
Keyword(s):  
Low Temperature ◽  
Metal Organic ◽  
Low Temperature Crystallization ◽  
Temperature Crystallization ◽  
Organic Decomposition

An Ultradurable and Uniform Cu Electrode by Blending Carbon Nanotube Fillers in Copper-Based Metal-Organic Decomposition Ink for Flexible Printed Electronics

2018 ◽  
Vol 5 (16) ◽  
pp. 1800502 ◽  
Author(s):  
Kwang-dong Seong ◽  
Jong Min Kim ◽  
Jeongmin Kang ◽  
Minsik Hwang ◽  
Chaedong Lee ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Printed Electronics ◽  
Metal Organic ◽  
Organic Decomposition

scholarly journals Metal−Organic Decomposition Ink for Printed Electronics

2019 ◽  
Vol 6 (20) ◽  
pp. 1901002 ◽  
Author(s):  
Yejung Choi ◽  
Kwang‐dong Seong ◽  
Yuanzhe Piao
Keyword(s):  
Printed Electronics ◽  
Metal Organic ◽  
Organic Decomposition

scholarly journals Filtration-induced production of conductive/robust Cu films on cellulose paper by low-temperature sintering in air

2018 ◽  
Vol 5 (7) ◽  
pp. 172417 ◽  
Author(s):  
Shintaro Sakurai ◽  
Yusuke Akiyama ◽  
Hideya Kawasaki
Keyword(s):  
Low Temperature ◽  
Low Cost ◽  
Metal Nanoparticle ◽  
Low Temperature Sintering ◽  
Cu Films ◽  
Cellulose Paper ◽  
Conductive Films ◽  
Paper Electronics ◽  
Cu Film ◽  
Organic Decomposition

Cellulose paper is an attractive substrate for paper electronics because of its advantages of flexibility, biodegradability, easy incorporation into composites, low cost and eco-friendliness. However, the micrometre-sized pores of cellulose paper make robust/conductive films difficult to deposit onto its surface from metal-nanoparticle-based inks. We developed a Cu-based composite ink to deposit conductive Cu films onto cellulose paper via low-temperature sintering in air. The Cu-based inks consisted of a metallo-organic decomposition ink and formic-acid-treated Cu flakes. The composite ink was heated in air at 100°C for only 15 s to give a conductive Cu film (7 × 10 −5  Ω cm) on the cellulose paper. Filtration of the Cu-based composite ink accumulated Cu flakes on the paper, which enabled formation of a sintered Cu film with few defects. A strategy was developed to enhance the bending stability of the sintered Cu films on paper substrates using polyvinylpyrrolidone-modified Cu flakes and amine-modified paper. The resistance of the Cu films increased only 1.3-fold and 1.1-fold after 1000 bending cycles at bending radii of 5 mm and 15 mm, respectively. The results of this study provide an approach to increasing the bending stability of Cu films on cellulose paper.

High copper loading metal organic decomposition paste for printed electronics

2017 ◽  
Vol 52 (10) ◽  
pp. 5617-5625 ◽  
Author(s):  
Sze Kee Tam ◽  
Ka Yip Fung ◽  
Ka Ming Ng
Keyword(s):  
Printed Electronics ◽  
High Copper ◽  
Metal Organic ◽  
Organic Decomposition

Charge Trapping and Degradation Properties of PZT Thin Films for MEMS

1996 ◽  
Vol 444 ◽  
Author(s):  
Hyeon-Seag Kim ◽  
D. L. Polla ◽  
S. A. Campbell
Keyword(s):  
Thin Films ◽  
Loss Factor ◽  
High Field ◽  
Microelectromechanical Systems ◽  
Charge Trapping ◽  
Metal Organic ◽  
Electrical Reliability ◽  
Silicon Based ◽  
Degradation Properties ◽  
Organic Decomposition

AbstractThe electrical reliability properties of PZT (54/46) thin films have been measured for the purpose of integrating this material with silicon-based microelectromechanical systems. Ferroelectric thin films of PZT were prepared by metal organic decomposition. The charge trapping and degradation properties of these thin films were studied through device characteristics such as hysteresis loop, leakage current, fatigue, dielectric constant, capacitancevoltage, and loss factor measurements. Several unique experimental results have been found. Different degradation processes were verified through fatigue (bipolar stress), low and high charge injection (unipolar stress), and high field stressing (unipolar stress).

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