scholarly journals Surface characterization and degradation behavior of polyimide films induced by coupling irradiation treatment

RSC Advances ◽  
2018 ◽  
Vol 8 (49) ◽  
pp. 28152-28160 ◽  
Author(s):  
Shan-Shan Dong ◽  
Wen-Zhu Shao ◽  
Li Yang ◽  
Hui-Jian Ye ◽  
Liang Zhen
Keyword(s):  
Surface Characterization ◽  
Degradation Process ◽  
Polyimide Film ◽  
Degradation Behavior ◽  
Polyimide Films ◽  
Irradiation Treatment ◽  
Coupling Treatment

Schematic of irradiation-load-heating coupling treatment and degradation process of polyimide film.

Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction

1997 ◽  
Vol 504 ◽  
Author(s):  
S. C. Choi ◽  
K. H. Kim ◽  
H-J. Jung ◽  
C. N. Whang ◽  
S. K. Koha
Keyword(s):  
Ion Irradiation ◽  
Polyimide Film ◽  
Wetting Angle ◽  
Free Energies ◽  
Polyimide Films ◽  
Oxygen Environment ◽  
X Ray ◽  
Oxygen Ion ◽  
Oxygen Gas ◽  
Cu Thin Film

ABSTRACTPolyimide films are modified by ion assisted reaction method using various ion beams in various gases environments. Amount of ion and blown gases rate were changed from 5 × 1014 to 1 × 1017 and from 0 to 8 sccm, respectively. Wetting angles between water and polyimide films modified by Ar+ ion without oxygen blowing decrease from 67° to 400° and surface free energies increase from 46 to 64 dyne/cm2. Wetting angle of polyimide films modified by Ar+ ion in an oxygen environment decreases to 12° and surface free energy increases to 72 dyne/cm2. The lowest wetting angle was obtained by oxygen ion irradiation in the oxygen gas environment and its value was 7°. In the case of polyimide film modified by Ar+ ions in an oxygen environment, the wetting angle increases up to 65° when it kept in air and that increases up to 46° when it kept in water after 5 day. In the case of polyimide film modified by O2+ ion in oxygen environment, however, the wetting angle of polyimide film dose not increase. X-ray photoelectron analysis shows that the chemical bonds between polyimide components are severed by ion irradiation and hydrophilic groups such as CO and C=O are formed by the reaction between newly formed radicals and blown oxygen. It was found that adhesion between Cu and polyimide modified by ion assisted reaction was improved. The main reason of the enhanced adhesion is due to the reaction between Cu and C-O or C=O groups formed by ion assisted reaction on the polyimide surface.

Orientation Specific Thermal Properties of Polyimide Film

2000 ◽  
Vol 123 (3) ◽  
pp. 273-277 ◽  
Author(s):  
Robert J. Samuels ◽  
Nancy E. Mathis
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Polyimide Film ◽  
New Materials ◽  
Polyimide Films ◽  
Nondestructive Technique ◽  
Theoretical Understanding ◽  
First Time ◽  
The Relationship ◽  
Transfer Mechanisms

The present study examines the relationship between thermal conductivity and planarity in polyimide films. The samples tested were specially prepared to range in orientation from three dimensionally random to highly planar. The molecular structure and orientation of the polyimide film have been characterized by polarizing microscope techniques, while the thermal conductivity measurements were done using a new rapid nondestructive technique. This correlation represents the first time thermal conductivity has been measured by modified hot wire techniques and related to the internal structure of polyimide. This work contributes to a deeper theoretical understanding of thermal conductivity and heat transfer mechanisms as they relate to orientation. Thermal conductivity evaluation could provide a new tool in the arsenal of structural characterization techniques. This relationship between thermal conductivity and orientation is key for applications of directional heat dissipation in the passive layers of chip assemblies. Such a correlation has potential to speed the development cycles of new materials during formulation as well as assure properties during production.

Residual Stress Measurements on Cr/Ni Pads Evaporated on Polyimide Thin Films

1992 ◽  
Vol 36 ◽  
pp. 203-212
Author(s):  
C. C. Goldsmith ◽  
C. Van Buskirk
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Thermal Processing ◽  
Polyimide Film ◽  
Metal Films ◽  
Dielectric Films ◽  
Nickel Layer ◽  
Polyimide Films ◽  
Layer Structures ◽  
Deposited Metal

AbstractPolyimide films are becoming more important in multi-layer structures, acting as dielectric films to separate conductive layers. High thin film residual stresses can cause problems with the polyimide film, leading to loss of adhesion between the metal film and the polyimide or can cause cracking in the polyimide.In this paper, we examine the residual stresses in “as deposited” metal films evaporated onto BTDA-APB polyimide films and follow the change in residual stress of the nickel layer during subsequent thermal processing. We will show that the change in residual stresses can be correlated to the glass transition temperature of the polyimide film.

Preparation and Characterization Silver and Copper Layers on Polyimide Prepared by Electroless Copper Plating

2006 ◽  
Vol 947 ◽  
Author(s):  
Eun Sun Ji ◽  
Young Hwan Kim ◽  
Young Soo Kang
Keyword(s):  
Polyimide Film ◽  
Metallic Silver ◽  
Polyimide Films ◽  
Electroless Copper Plating ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Ag Particles ◽  
Plating Method ◽  
Surface Image

ABSTRACTAg particles were generated on Ag+-doped polyimide film by ion exchanging, followed by copper deposition using metallic silver particles as seeds. The Cu layers were coated on the surface of polyimide films by electroless plating method. The surface image and morphology of Cu layers on the polyimide films were characterized with scanning electron microscopy (SEM), and atomic force microscopy (AFM). The chemical composition on the PI film was investigated energy dispersive X-ray (EDX) spectrometer.

Solvent Diffusion in Selected Polyimide Films

1989 ◽  
Vol 167 ◽  
Author(s):  
W. P. Pawlowski ◽  
M. I. Jacobson ◽  
M. E. Teixeira ◽  
K. G. Sakorafos
Keyword(s):  
Methylene Chloride ◽  
Rutherford Backscattering Spectrometry ◽  
Polyimide Film ◽  
Rutherford Backscattering ◽  
Polyimide Films ◽  
Solvent Diffusion ◽  
Additional Information ◽  
Methyl Chloroform ◽  
Significant Difference ◽  
Mode Of Transport

AbstractThe absorption of several solvents including methylene chloride (MC), methyl chloroform (MCF), gamma-butyrolactone (BLO), dibromomethane (DBRO), 1,2-dichloroethane (DCE), and 1,2-dichloropropane (DCP) in Kapton H*, Upilex S**, and Upilex R** polyimide film was measured gravimetrically. A significant difference in the rate and amount of absorption of these chemicals by the various films was observed. Complimentary Rutherford Backscattering Spectrometry (RBS) measurements provided additional information regarding the amount of solvent absorbed and mode of transport.

Design and Technology of Winding Curvilinear Pipelines from Sintered Polyimide-Fluoroplastic Film

2019 ◽  
pp. 86-92
Author(s):  
M.A. Komkov ◽  
Y.V. Badanina
Keyword(s):  
Composite Materials ◽  
Polyimide Film ◽  
Design And Technology ◽  
Hydraulic Systems ◽  
Polyimide Films ◽  
Typical Element ◽  
Land Vehicles ◽  
Bending Loads ◽  
Cryogenic Pipeline

This article deals with the issues related to designing and manufacturing light and reliable pipelines made of composite materials for missile technology, aircraft and land vehicles running on cryogenic fuel. Multi-layer straight and curvilinear pipelines made by winding polyimide films can significantly reduce the weight and level of bending loads. The article presents the geometry of a typical element of a curvilinear pipeline and the design of the flange of a cryogenic pipeline. A method for connecting the flange shank to the film shell is proposed and the results of testing pipelines made of polyimide-fluoroplastic films are presented. Cryogenic pipelines made of polyimide film PMF-352 have a smaller mass in comparison with metal analogues made of alloy AMg-6 and can be recommended as their replacement in pneumatic hydraulic systems of products operating on cryogenic fuels.

Effect of FeCl4– intercalation on the transport properties of a graphitized polyimide film

1993 ◽  
Vol 8 (9) ◽  
pp. 2299-2304 ◽  
Author(s):  
B. Nysten ◽  
J-P. Issi ◽  
H. Shioyama ◽  
M. Crespin ◽  
R. Setton ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Thermoelectric Power ◽  
Synthesis Method ◽  
Structural Disorder ◽  
Polyimide Film ◽  
Polyimide Films ◽  
Electrochemical Intercalation ◽  
Power Measurements ◽  
High Degree

The temperature variation of the thermal conductivity, the electrical resistivity, and the thermoelectric power of a graphitized polyimide film have been measured in the temperature range 2 < T < 300 K. The effect of the electrochemical intercalation with FeCl4− ions has also been studied. The thermal conductivity measurements confirm the high degree of graphitization that may be obtained with polyimide films. They show how intercalation increases the structural disorder and how the intercalate substantially contributes to the thermal conductivity at low temperatures. The electrical-resistivity and thermoelectric-power measurements reveal that the density of free carriers is about three times lower in stage-2 FeCl4− solvated intercalation compounds obtained by an electrochemical way than in stage-2 FeCl3 compounds obtained by a classical synthesis method.

Surface Modification-Based Fabrication of Double Surface Highly Reflective and Conductive Metallized Polymeric Films and Microstructural Tuning Nanocomposite Layers

2006 ◽  
Vol 11-12 ◽  
pp. 497-500
Author(s):  
Zhan Peng Wu ◽  
De Zhen Wu ◽  
Fang Li ◽  
Feng Hong Hong ◽  
Sheng Li Qi ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Film Surface ◽  
Silver Ions ◽  
Polyimide Film ◽  
Amic Acid ◽  
Silver Clusters ◽  
Polyimide Films ◽  
Near Surface ◽  
Double Surface ◽  
Conductive Surfaces

Silvered polyimide films have been prepared by alkali hydroxylation of polyimide film surface and incorporation of silver ions through subsequent ion exchange. Thermal curing had not only re-cycloimidized the poly(amic acid) into polyimide, but also reduced silver ions into silver atoms and near-atomic silver clusters, which diffused and aggregated to give reflective and conductive surfaces without addition of reducing agents. By this method, silvered polyimide films can be easily fabricated with double excellent reflective (reflectivity > 97%) and conductive surfaces (surface resistance: 0.02 /sq), outstanding metal-polymer adhesion, high mechanical properties, and controllable thickness of silver layers at modest cost. As the side-to-side near-surface microstructure difference in the laboratory made samples and commercial PI films, the thickness of alkali induced hydrolysis, loading of silver ions and forming of silver layers at the two sides of the polyimide films were also discussed here. Films were characterized by transmission electron microscopy (TEM), scanning electron microscopy (SEM) and tapping mode atomic force microscopy (AFM). Results show that continuous silver layers were formed on the polyimide films.

Raman Spectroscopic Study of Ag-, W- and Pd-Ions Implanted Polyimde Films

1994 ◽  
Vol 354 ◽  
Author(s):  
Hiroshi Watanabe ◽  
Katsuo Takahashl ◽  
Masaya Iwaki
Keyword(s):  
Surface Layer ◽  
Ion Implantation ◽  
Raman Spectra ◽  
Polyimide Film ◽  
Laser Raman Spectroscopy ◽  
High Dose ◽  
Polyimide Films ◽  
Carbon Structure ◽  
Raman Spectroscopic ◽  
Laser Raman

AbstractA study has been made of the carbon formation in the surface layer of Ag-, W- and Pd-ions implanted polyimide films. The doses of 130 KeV Ag-ions and 190 KeV W-ions ranged from lxlO16 to 5×1017 atoms/cm2. The doses of 100 KeV Pd-ions ranged from 5×1016 to 2×1017 atoms/cm2. The carbon structure in implanted layers was characterized by laser Raman spectroscopy (LRS). Non-implanted polyimide film has very strong intensity of fluorescence, and the intensity of all W-, Ag- and Pd-ions implanted specimens decreases with the increase in dose. The intensity of Raman spectra for both W- and Ag-ions implanted specimens increases with the increase in dose. For Pd-ion implanted specimens, the Raman spectrum of carbon is hardly observed even with a high dose. Raman spectra for W- or Ag-ions implanted specimens with a high dose show that the diamond-like carbon (DLC) exist in the implanted layers. It is found that the DLC structures in the W- and Ag-ions implanted layers have graphite-like and amorphous-like structures, respectively. We propose that transparency carbon structure in implanted layers is generated by Pd-ion implantation. It is concluded that marked DLC formation in surface layer of polyimide films can be caused by Ag- or W-ions implantation except Pd-ion implantation, and carbon structure in implanted layers depends strongly on the implanted elements.

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