scholarly journals A rapid and cost-effective metallization technique for 3C–SiC MEMS using direct wire bonding

RSC Advances ◽  
2018 ◽  
Vol 8 (28) ◽  
pp. 15310-15314 ◽  
Author(s):  
Abu Riduan Md Foisal ◽  
Hoang-Phuong Phan ◽  
Toan Dinh ◽  
Tuan-Khoa Nguyen ◽  
Nam-Trung Nguyen ◽  
...  

This paper presents a simple, rapid and cost-effective wire bonding technique for single crystalline silicon carbide (3C–SiC) MEMS devices.

2020 ◽  
Vol 101 ◽  
pp. 107625
Author(s):  
Debarati Mukherjee ◽  
Filipe Oliveira ◽  
Simone Camargo Trippe ◽  
Shlomo Rotter ◽  
Miguel Neto ◽  
...  

2008 ◽  
Vol 113 (3) ◽  
pp. 856-861 ◽  
Author(s):  
Zhenhai Wang ◽  
Mingwen Zhao ◽  
Tao He ◽  
Xuejuan Zhang ◽  
Zexiao Xi ◽  
...  

2017 ◽  
Vol 9 (48) ◽  
pp. 41641-41647 ◽  
Author(s):  
Tuan-Khoa Nguyen ◽  
Hoang-Phuong Phan ◽  
Harshad Kamble ◽  
Raja Vadivelu ◽  
Toan Dinh ◽  
...  

1999 ◽  
Vol T79 (1) ◽  
pp. 152
Author(s):  
J. H?rk?nen ◽  
M. Yli-Koski ◽  
S. Arpiainen ◽  
T. Juvonen ◽  
K. Grigoras ◽  
...  

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