A rapid and cost-effective metallization technique for 3C–SiC MEMS using direct wire bonding
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This paper presents a simple, rapid and cost-effective wire bonding technique for single crystalline silicon carbide (3C–SiC) MEMS devices.
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2008 ◽
Vol 113
(3)
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pp. 856-861
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2010 ◽
Vol 10
(11)
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pp. 7808-7811
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2017 ◽
Vol 9
(48)
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pp. 41641-41647
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2010 ◽
Vol 36
(1)
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pp. 80-82
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2007 ◽
Vol 42
(13)
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pp. 5068-5073
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