Inkjet printing metals on flexible materials for plastic and paper electronics

2018 ◽  
Vol 6 (7) ◽  
pp. 1618-1641 ◽  
Author(s):  
N. C. Raut ◽  
K. Al-Shamery
Keyword(s):  
Technical Progress ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Flexible Materials ◽  
Commercial Potential ◽  
Paper Electronics

Inorganic printed electronics is now recognized as an area of tremendous commercial potential and technical progress.

scholarly journals Surface modification of fused filament fabrication (FFF) 3D printed substrates by inkjet printing polyimide for printed electronics

2020 ◽  
Vol 36 ◽  
pp. 101544
Author(s):  
Devin J. Roach ◽  
Christopher Roberts ◽  
Janet Wong ◽  
Xiao Kuang ◽  
Joshua Kovitz ◽  
...  
Keyword(s):  
Surface Modification ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Fused Filament Fabrication ◽  
3D Printed

scholarly journals One-step preparation of Cr2O3-based ink with long-term dispersion stability for inkjet applications

2021 ◽  
Author(s):  
Dongjin Xie ◽  
Qiuyi Luo ◽  
Shen Zhou ◽  
Mei Zu ◽  
Haifeng Cheng
Keyword(s):  
High Precision ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Direct Writing ◽  
Deposition Technique ◽  
Functional Material ◽  
Wide Range ◽  
One Step ◽  
Oled Display

Inkjet printing of functional material has shown a wide range of application in advertzing, OLED display, printed electronics and other specialized utilities that require high-precision, mask-free, direct-writing deposition technique. Nevertheless,...

Title: Inkjet-printed rectifying metal-insulator-semiconductor (MIS) diodes for flexible electronic applications

2014 ◽  
Vol 1628 ◽  
Author(s):  
Kalyan Yoti Mitra ◽  
Carme Martínez-Domingo ◽  
Enrico Sowade ◽  
Eloi Ramon ◽  
Henrique Leonel Gomes ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
Printed Electronics ◽  
Schottky Diodes ◽  
Functional Materials ◽  
Industrial Applications ◽  
Plastic Substrate ◽  
Organic Thin Film ◽  
Metal Insulator ◽  
Metal Insulator Semiconductor ◽  
Mis Diode

ABSTRACTInkjet printing is a well-accepted deposition technology for functional materials in the area of printed electronics. It allows the precise deposition of patterned functional layers on both, rigid and flexible substrates. Furthermore, inkjet printing is considered as up-scalable technology towards industrial applications. Many electronic devices manufactured with inkjet printing have been reported in the recent years. Some of the evident examples are capacitors, resistors, organic thin film transistors and rectifying Schottky diodes. [1, 2, 3] In this paper we report on the manufacturing of an inkjet-printed metal-insulator-semiconductor (MIS) diode on flexible plastic substrate. The structure is comprised of an insulating and a polymeric semiconducting layer sandwiched between two silver electrodes. The current vs. voltage characteristics are rectifying with rectification ratio up to 100 at |4 V|. Furthermore, they can carry high current densities (up to mA/cm2) and have a low capacitance which makes them attractive for high frequency rectifying circuits. They are also an ideal candidate to replace conventional Schottky diodes for which the fabrication remains a challenge. This is because inkjet printing of Schottky diodes require additional processing steps such as intense pulsed light sintering (IPL sintering) [4] or post-treatments at high temperatures. The deposition of two different metal layers using inkjet printing e.g. Cu or Al with Ag is possible. However, the mentioned post treatment technologies might be incompatible with the already existing layer stack– e.g. it could degrade the organic semiconductor or can damage insulator which in this case is present in the MIS diode architecture.

scholarly journals Printed Electronics as Prepared by Inkjet Printing

Materials ◽  
2020 ◽  
Vol 13 (3) ◽  
pp. 704 ◽  
Author(s):  
Vimanyu Beedasy ◽  
Patrick J. Smith
Keyword(s):  
Inkjet Printing ◽  
Printed Electronics ◽  
Electronic Devices ◽  
Fabrication Process ◽  
Device Performance ◽  
Solar Panels ◽  
Sintering Conditions ◽  
Printing Parameters

Inkjet printing has been used to produce a range of printed electronic devices, such as solar panels, sensors, and transistors. This article discusses inkjet printing and its employment in the field of printed electronics. First, printing as a field is introduced before focusing on inkjet printing. The materials that can be employed as inks are then introduced, leading to an overview of wetting, which explains the influences that determine print morphology. The article considers how the printing parameters can affect device performance and how one can account for these influences. The article concludes with a discussion on adhesion. The aim is to illustrate that the factors chosen in the fabrication process, such as dot spacing and sintering conditions, will influence the performance of the device.

Patterned Surface with Controllable Wettability for Inkjet Printing of Flexible Printed Electronics

2014 ◽  
Vol 6 (6) ◽  
pp. 4011-4016 ◽  
Author(s):  
Phuong Q. M. Nguyen ◽  
Lip-Pin Yeo ◽  
Boon-Keng Lok ◽  
Yee-Cheong Lam
Keyword(s):  
Inkjet Printing ◽  
Printed Electronics ◽  
Patterned Surface

Inkjet Printing for Printed Electronics

2017 ◽  
pp. 599-616
Author(s):  
Pit Teunissen ◽  
Robert Abbel ◽  
Tamara Eggenhuizen ◽  
Michiel Coenen ◽  
Pim Groen
Keyword(s):  
Inkjet Printing ◽  
Printed Electronics

scholarly journals Preparation of Li-Doped Indium-Zinc Oxide Thin-Film Transistor at Relatively Low Temperature Using Inkjet Printing Technology

2021 ◽  
Vol 59 (5) ◽  
pp. 314-320
Author(s):  
Woon-Seop Choi
Keyword(s):  
Thin Film ◽  
Zinc Oxide ◽  
Electrical Properties ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Thin Film Transistor ◽  
Oxide Thin Film ◽  
Lithium Doping ◽  
Indium Zinc Oxide ◽  
Oxide Tfts

Inkjet printing is a very attractive technology for printed electronics and a potential alternative to current high cost and multi-chemical lithography processes, for display and other applications in the electronics field. Inkjet technology can be employed to fabricate organic light emitting diodes (OLED), quantum dots displays, and thin-film transistors (TFTs). Among potential applications, metal oxide TFTs, which have good properties and moderate processing methods, could be prepared using inkjet printing in the display industry. One effective method of improving their electrical properties is via doping. Lithium doping an oxide TFT is a very delicate process, and difficult to get good results. In this study, lithium was added to indium-zinc oxide (IZO) for inkjet printing to make oxide TFTs. Electrical properties, transfer and output curves, were achieved using inkjet printing even at the relatively low annealing temperature of 200 oC. After optimizing the inkjet process parameters, a 0.01 M Li-doped IZO TFT at 400 oC showed a mobility of 9.08 ± 0.7 cm2/V s, a sub-threshold slope of 0.62 V/dec, a threshold voltage of 2.66 V, and an on-to-off current ratio of 2.83 × 108. Improved bias stability and hysteresis behavior of the inkjet-printed IZO TFT were also achieved by lithium doping.

scholarly journals A general ink formulation of 2D crystals for wafer-scale inkjet printing

2020 ◽  
Vol 6 (33) ◽  
pp. eaba5029 ◽  
Author(s):  
Guohua Hu ◽  
Lisong Yang ◽  
Zongyin Yang ◽  
Yubo Wang ◽  
Xinxin Jin ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
Large Scale ◽  
Printed Electronics ◽  
Device Fabrication ◽  
Great Promise ◽  
Binary Solvent ◽  
Droplet Shape ◽  
Wafer Scale ◽  
2D Crystals ◽  
Ink Formulation

Recent advances in inkjet printing of two-dimensional (2D) crystals show great promise for next-generation printed electronics development. Printing nonuniformity, however, results in poor reproducibility in device performance and remains a major impediment to their large-scale manufacturing. At the heart of this challenge lies the coffee-ring effect (CRE), ring-shaped nonuniform deposits formed during postdeposition drying. We present an experimental study of the drying mechanism of a binary solvent ink formulation. We show that Marangoni-enhanced spreading in this formulation inhibits contact line pinning and deforms the droplet shape to naturally suppress the capillary flows that give rise to the CRE. This general formulation supports uniform deposition of 2D crystals and their derivatives, enabling scalable and even wafer-scale device fabrication, moving them closer to industrial-level additive manufacturing.

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