scholarly journals Printed Electronics as Prepared by Inkjet Printing

Materials ◽  
2020 ◽  
Vol 13 (3) ◽  
pp. 704 ◽  
Author(s):  
Vimanyu Beedasy ◽  
Patrick J. Smith
Keyword(s):  
Inkjet Printing ◽  
Printed Electronics ◽  
Electronic Devices ◽  
Fabrication Process ◽  
Device Performance ◽  
Solar Panels ◽  
Sintering Conditions ◽  
Printing Parameters

Inkjet printing has been used to produce a range of printed electronic devices, such as solar panels, sensors, and transistors. This article discusses inkjet printing and its employment in the field of printed electronics. First, printing as a field is introduced before focusing on inkjet printing. The materials that can be employed as inks are then introduced, leading to an overview of wetting, which explains the influences that determine print morphology. The article considers how the printing parameters can affect device performance and how one can account for these influences. The article concludes with a discussion on adhesion. The aim is to illustrate that the factors chosen in the fabrication process, such as dot spacing and sintering conditions, will influence the performance of the device.

scholarly journals Assessing the Relationships between Interdigital Geometry Quality and Inkjet Printing Parameters

Micromachines ◽  
2021 ◽  
Vol 13 (1) ◽  
pp. 57
Author(s):  
Federico Bertolucci ◽  
Nicolò Berdozzi ◽  
Lara Rebaioli ◽  
Trunal Patil ◽  
Rocco Vertechy ◽  
...  
Keyword(s):  
High Precision ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Study Objective ◽  
Flexible Devices ◽  
Drop On Demand ◽  
Process Outcomes ◽  
Nozzle Temperature ◽  
Printing Parameters ◽  
Printing Speed

Drop on demand (DoD) inkjet printing is a high precision, non-contact, and maskless additive manufacturing technique employed in producing high-precision micrometer-scaled geometries allowing free design manufacturing for flexible devices and printed electronics. A lot of studies exist regarding the ink droplet delivery from the nozzle to the substrate and the jet fluid dynamics, but the literature lacks systematic approaches dealing with the relationship between process parameters and geometrical outcome. This study investigates the influence of the main printing parameters (namely, the spacing between subsequent drops deposited on the substrate, the printing speed, and the nozzle temperature) on the accuracy of a representative geometry consisting of two interdigitated comb-shape electrodes. The study objective was achieved thanks to a proper experimental campaign developed according to Design of Experiments (DoE) methodology. The printing process performance was evaluated by suitable geometrical quantities extracted from the acquired images of the printed samples using a MATLAB algorithm. A drop spacing of 140 µm and 170 µm on the two main directions of the printing plane, with a nozzle temperature of 35 °C, resulted as the most appropriate parameter combination for printing the target geometry. No significant influence of the printing speed on the process outcomes was found, thus choosing the highest speed value within the investigated range can increase productivity.

scholarly journals Characteristics of nanosilver ink (UTDAg) microdroplets and lines on polyimide during inkjet printing at high stage velocity

2020 ◽  
Vol 1 (1) ◽  
pp. 99-107
Author(s):  
Aamir Hamad ◽  
Adam Archacki ◽  
Ahsan Mian
Keyword(s):  
Inkjet Printing ◽  
Printed Electronics ◽  
High Stage ◽  
Printing Parameters

The performance of printed electronics strongly depends on printing parameters and printing resolution.

scholarly journals Overview of recent progress in electrohydrodynamic jet printing in practical printed electronics: focus on variety of printable materials for each component

2021 ◽  
Author(s):  
Hyeok-Jin Kwon ◽  
Jisu Hong ◽  
Sang Yong Nam ◽  
Hyun Ho Choi ◽  
Xinlin Li ◽  
...  
Keyword(s):  
Inkjet Printing ◽  
Recent Progress ◽  
Printed Electronics ◽  
Electronic Devices ◽  
Flexible Substrates ◽  
Next Generation ◽  
Electrohydrodynamic Jet Printing ◽  
Jet Printing

Printed electronics will be essential in the implementation of next-generation electronic devices, because printing facilitates fabrication of devices on various rigid, thin, or flexible substrates. Inkjet printing enables precise placement...

scholarly journals Surface modification of fused filament fabrication (FFF) 3D printed substrates by inkjet printing polyimide for printed electronics

2020 ◽  
Vol 36 ◽  
pp. 101544
Author(s):  
Devin J. Roach ◽  
Christopher Roberts ◽  
Janet Wong ◽  
Xiao Kuang ◽  
Joshua Kovitz ◽  
...  
Keyword(s):  
Surface Modification ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Fused Filament Fabrication ◽  
3D Printed

scholarly journals One-step preparation of Cr2O3-based ink with long-term dispersion stability for inkjet applications

2021 ◽  
Author(s):  
Dongjin Xie ◽  
Qiuyi Luo ◽  
Shen Zhou ◽  
Mei Zu ◽  
Haifeng Cheng
Keyword(s):  
High Precision ◽  
Inkjet Printing ◽  
Printed Electronics ◽  
Direct Writing ◽  
Deposition Technique ◽  
Functional Material ◽  
Wide Range ◽  
One Step ◽  
Oled Display

Inkjet printing of functional material has shown a wide range of application in advertzing, OLED display, printed electronics and other specialized utilities that require high-precision, mask-free, direct-writing deposition technique. Nevertheless,...

Fabrication of Flexible Interposer Using Printing Method

2020 ◽  
Author(s):  
Atsuhiro Furuta ◽  
Kazuki Honjo ◽  
Jun Taniguchi
Keyword(s):  
Silicon Substrate ◽  
Nanoimprint Lithography ◽  
Printed Electronics ◽  
Electronic Devices ◽  
Master Mold ◽  
Sintering Process ◽  
Silver Ink ◽  
Press Method ◽  
Photolithography Process ◽  
Printing Method

Abstract In recent years, flexible electronic devices such as printed electronics are gathering attention. To make flexible connect between one circuit device and another circuit device, interposer is necessary. However, most of conventional interposers are not flexible, because there are made of silicon or glass substrate. To solve this problem, we have been developed fabrication process of flexible interposer. Master mold was fabricated by photolithography process. First, SU-8 resist was coated on silicon substrate with 5μm thickness. Then, photolithography process was carried out to SU-8 resist. After development, pillar shape master molds with diameters of 10 or 20 μm were obtained. After release coating of master molds, hole patterns for vias were transferred by UV nanoimprint lithography. The obtained hole patterns were diameter of 10 μm or 20 μm, and pitch of 21.0 μm and 40.1 μm, respectively. Next, these holes were filled with silver ink by roll press method. Then, sintering process was carried out to evaporate of solvent of silver ink. After that, flexible interposer was obtained. As a result, we have been succeeded in filling the holes array with silver ink. Obtained interposer vias, which were silver region, were 8.2 μm diameter and 3.3 μm height, or 20.3 μm diameter and 5.3 μm height for 10 mm square size.

Canadian Registry of Electronic Device Outcomes: remote monitoring outcomes in the Abbott battery performance alert—a multicentre cohort

EP Europace ◽  
2021 ◽  
Author(s):  
Sharath Kumar ◽  
Jason Davis ◽  
Bernard Thibault ◽  
Iqwal Mangat ◽  
Benoit Coutu ◽  
...  
Keyword(s):  
Remote Monitoring ◽  
Primary Outcome ◽  
Electronic Device ◽  
Electronic Devices ◽  
Cardiac Resynchronization ◽  
Device Performance ◽  
Cardiac Implantable Electronic Devices ◽  
All Cause Mortality ◽  
Multicentre Cohort

Abstract Aims Cardiac implantable electronic devices with device advisories have the potential of device malfunction. Remote monitoring (RM) of devices has been suggested to allow the identification of abnormal device performance and permit early intervention. We sought to describe the outcomes of patients with and without RM in devices subject to the Abbott Premature Battery Depletion (PBD) advisory with data from a Canadian registry. Methods and results Patients with an Abbott device subject to the PBD advisory from nine implantable cardioverter defibrillator (ICD) implanting centres in Canada were included in the registry. The use of RM was identified from baseline and follow-up data in the registry. The primary outcome was detection of PBD and all-cause mortality. A total of 2666 patients were identified with a device subject to the advisory. In all, 1687 patients (63.2%) had RM at baseline. There were 487 deaths during follow-up. At a mean follow-up of 5.7 ± 0.7 years, mortality was higher in those without a remote monitor compared with RM at baseline (24.7% vs. 14.5%; P < 0.001). Pre-mature battery depletion was identified in 36 patients (2.1%) with RM vs. 7 (0.7%) without RM (P = 0.004). Time to battery replacement was significantly reduced in patients on RM (median 5 vs. 13 days, P = 0.001). Conclusion The use of RM in patients with ICD and cardiac resynchronization therapy under advisory improved detection of PBD, time to device replacement, and was associated with a reduction in all-cause mortality. The factors influencing the association with mortality are unknown and deserve further study.

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Jinesh Narangaparambil ◽  
Tony Thomas ◽  
Kyle Schulze
Keyword(s):  
Strain Gauge ◽  
Printed Electronics ◽  
Performance Testing ◽  
Temperature Limit ◽  
Stability Study ◽  
Strain Gauges ◽  
Gauge Factor ◽  
Wearable Electronics ◽  
Strain Sensing ◽  
Sintering Conditions

Abstract Printed electronics has found new applications in wearable electronics owing to the opportunities for integration, and the ability of sustaining folding, flexing and twisting. Continuous monitoring necessitates the production of sensors, which include temperature, humidity, sweat, and strain sensors. In this paper, a process study was performed on the FR4 board while taking into account multiple printing parameters for the direct-write system. The process parameters include ink pressure, print speed, and stand-off height, as well as their effect on the trace profile and print consistency using white light interferometry analysis. The printed traces have also been studied for different sintering conditions while keeping the FR4 board’s temperature limit in mind. The paper also discusses the effect of sintering conditions on mechanical and electrical properties, specifically shear load to failure and resistivity. The data from this was then used to print strain gauges and compared them to commercially available strain gauges. By reporting the gauge factor, the printed strain gauge has been standardized. The conductive ink’s strain sensing capabilities will be studied under tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads.

scholarly journals Optimization of a Handwriting Method by an Automated Ink Pen for Cost-Effective and Sustainable Sensors

Chemosensors ◽  
2021 ◽  
Vol 9 (9) ◽  
pp. 264
Author(s):  
Florin C. Loghin ◽  
José F. Salmerón ◽  
Paolo Lugli ◽  
Markus Becherer ◽  
Aniello Falco ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Electronic Devices ◽  
Cost Effective ◽  
Capacitive Sensor ◽  
Fabrication Technique ◽  
Rfid Tag ◽  
Environmental Friendly ◽  
Fast Prototyping ◽  
Do It Yourself

In this work, we present a do-it-yourself (DIY) approach for the environmental-friendly fabrication of printed electronic devices and sensors. The setup consists only of an automated handwriting robot and pens filled with silver conductive inks. Here, we thoroughly studied the fabrication technique and different optimized parameters. The best-achieved results were 300 mΩ/sq as sheet resistance with a printing resolution of 200 µm. The optimized parameters were used to manufacture fully functional electronics devices: a capacitive sensor and a RFID tag, essential for the remote reading of the measurements. This technique for printed electronics represents an alternative for fast-prototyping and ultra-low-cost fabrication because of both the cheap equipment required and the minimal waste of materials, which is especially interesting for the development of cost-effective sensors.

Modeling the Impact of Packaging Stress on Device Performance

2005 ◽  
Vol 863 ◽  
Author(s):  
Xiaopeng Xu ◽  
Victor Moroz
Keyword(s):  
Normal Stress ◽  
Mobility Model ◽  
External Pressure ◽  
Stress Pattern ◽  
Fabrication Process ◽  
Device Performance ◽  
Stress Evolution ◽  
Transistor Fabrication ◽  
The Impact ◽  
Additional Device

AbstractIn this study the stress evolution for the entire transistor fabrication process is simulated and the packaging stress is modeled as the external pressure/normal stress acting on the boundaries of the transistor unit cell. The impact on device performance from both the fabrication stress and the packaging stress is investigated using a classical piezo-resistance mobility model. The effect of the packaging stress on device mobility can be either beneficial or detrimental depending on whether the stress is tensile or compressive, on stress pattern, its magnitude, and the transistor type. The results suggest that utilizing both the fabrication stress and the packaging stress for stress engineering can lead to additional device performance enhancements.

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