Core–shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction

2018 ◽  
Vol 6 (2) ◽  
pp. 257-265 ◽  
Author(s):  
Shaoqing Liu ◽  
Bo Zhao ◽  
Li Jiang ◽  
Yan-Wu Zhu ◽  
Xian-Zhu Fu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Electronic Packaging ◽  
Thermal Conduction ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Core Shell ◽  
Filled Polymer

3D core–shell Cu@rGO filled polymer composites with high thermal conductivity for advanced electronic packaging techniques.

Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

2021 ◽  
Vol 209 ◽  
pp. 108760
Author(s):  
Yang Hu ◽  
Chao Chen ◽  
Yingfeng Wen ◽  
Zhigang Xue ◽  
Xingping Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electronic Packaging ◽  
Epoxy Composites

Microwave synthesis of branched silver nanowires and their use as fillers for high thermal conductivity polymer composites

2016 ◽  
Vol 27 (17) ◽  
pp. 175601 ◽  
Author(s):  
Indira Seshadri ◽  
Gibran L Esquenazi ◽  
Thomas Cardinal ◽  
Theodorian Borca-Tasciuc ◽  
Ganpati Ramanath
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Microwave Synthesis ◽  
Silver Nanowires ◽  
High Thermal Conductivity

Enhanced thermal conductivity of epoxy composites by constructing thermal conduction networks via adding hybrid alumina filler

2021 ◽  
Author(s):  
Zhong‐Yu Wang ◽  
Xiao‐Nan Zhou ◽  
Zi‐Xuan Li ◽  
Song‐Song Xu ◽  
Liu‐Cheng Hao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Conduction ◽  
Epoxy Composites ◽  
Enhanced Thermal Conductivity

Unprecedentedly high thermal conductivity of carbon/epoxy composites derived from parameter optimization studies

2020 ◽  
Vol 186 ◽  
pp. 107915 ◽  
Author(s):  
Yong Sik Yeom ◽  
Kie Yong Cho ◽  
Heun Young Seo ◽  
Jong Suk Lee ◽  
Do Hyun Im ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Parameter Optimization ◽  
High Thermal Conductivity ◽  
Epoxy Composites

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

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