Unprecedentedly high thermal conductivity of carbon/epoxy composites derived from parameter optimization studies

2020 ◽  
Vol 186 ◽  
pp. 107915 ◽  
Author(s):  
Yong Sik Yeom ◽  
Kie Yong Cho ◽  
Heun Young Seo ◽  
Jong Suk Lee ◽  
Do Hyun Im ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Parameter Optimization ◽  
High Thermal Conductivity ◽  
Epoxy Composites

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Surface Modified ◽  
Enhanced Thermal Conductivity ◽  
Electrical Insulation Properties

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.

scholarly journals Preparation and properties of MWCNTs-BNNSs/epoxy composites with high thermal conductivity and low dielectric loss

2020 ◽  
Vol 24 ◽  
pp. 100985 ◽  
Author(s):  
Rui Wang ◽  
Congzhen Xie ◽  
Shoukang Luo ◽  
Huasong Xu ◽  
Bin Gou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Loss ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Low Dielectric

scholarly journals Synergistic Enhanced Thermal Conductivity and Dielectric Constant of Epoxy Composites with Mesoporous Silica Coated Carbon Nanotube and Boron Nitride Nanosheet

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5251
Author(s):  
Yutao Hao ◽  
Qihan Li ◽  
Xianhai Pang ◽  
Bohong Gong ◽  
Chengmei Wei ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Boron Nitride ◽  
Mesoporous Silica ◽  
Epoxy Composite ◽  
Dielectric Materials ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Charge Movement ◽  
Boron Nitride Nanosheet

Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here, a multifunctional epoxy composite is fulfilled by incorporation of boron nitride nanosheets (BNNSs) and mesoporous silica coated multi-walled carbon nanotubes (MWCNTs@mSiO2). Owing to the effective establishment of continuous thermal conductive network, the obtained BNNSs/MWCNTs@mSiO2/epoxy composite exhibits a high thermal conductivity of 0.68 W m−1 K−1, which is 187% higher than that of epoxy matrix. In addition, the introducing of mesoporous silica dielectric layer can screen charge movement to shut off leakage current between MWCNTs, which imparts BNNSs/MWCNTs@mSiO2/epoxy composite with high dielectric constant (8.10) and low dielectric loss (<0.01) simultaneously. It is believed that the BNNSs/MWCNTs@mSiO2/epoxy composites with admirable features have potential applications in modern electronics.

Vertically Aligned and Interconnected Graphene Networks for High Thermal Conductivity of Epoxy Composites with Ultralow Loading

2016 ◽  
Vol 28 (17) ◽  
pp. 6096-6104 ◽  
Author(s):  
Gang Lian ◽  
Chia-Chi Tuan ◽  
Liyi Li ◽  
Shilong Jiao ◽  
Qilong Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Vertically Aligned

scholarly journals Composites of epoxy/graphene-modified-diamond filler show enhanced thermal conductivity and high electrical insulation

RSC Advances ◽  
2017 ◽  
Vol 7 (65) ◽  
pp. 40761-40766 ◽  
Author(s):  
Jin Jiang ◽  
Feixiang Liu ◽  
Kunyi Zhuang ◽  
Danqing Chen ◽  
Guohua Chen
Keyword(s):  
Thermal Conductivity ◽  
Electric Conductivity ◽  
Single Step ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Step Process ◽  
Enhanced Thermal Conductivity

In this work, we developed a single-step process to cast epoxy composites having a high thermal conductivity but a low electric conductivity.

Development of Epoxy/BN Composites with High Thermal Conductivity for Metal-Core Printed Circuit Board (MCPCB)

2015 ◽  
Vol 749 ◽  
pp. 290-294
Author(s):  
Jae Hyun Choi ◽  
Bong Goo Choi ◽  
Min A. Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Conductivity ◽  
Printed Circuit Board ◽  
Epoxy Composite ◽  
High Thermal Conductivity ◽  
Circuit Board ◽  
Epoxy Composites ◽  
Hot Press ◽  
Metal Core ◽  
Printed Circuit ◽  
Press Method

The epoxy composites with high thermal conductivity for metal-core printed circuit board (MCPCB) can be prepared by varnish coating and a hot press method. Alumina filler of plate-like shape was used as primary micro-filler, while plate-like alumina filler, h-BN, a-BN and s-BN filler were used for blending into the plate-like alumina filler as the secondary filler. Results showed that the secondary fillers a-BN and s-BN loaded epoxy composites have higher thermal conductivity than alumina filler single-loaded composites. Also, BN filler has high thermal conductivity, but h-BN filled epoxy composite has lower thermal conductivity than alumina filled epoxy composite. The decrease of voids in epoxy composite are very important, and the filler shape and surface modification is also necessary to achieve high thermal conductivity in epoxy composite for MCPCB

High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

2012 ◽  
Vol 537 ◽  
pp. 70-75 ◽  
Author(s):  
Jung-Pyo Hong ◽  
Sung-Woon Yoon ◽  
Taeseon Hwang ◽  
Joon-Suk Oh ◽  
Seung-Chul Hong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Nitride ◽  
Bimodal Distribution ◽  
High Thermal Conductivity ◽  
Epoxy Composites
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