Effect of Al2O3 coverage on SiC particles for electrically insulated polymer composites with high thermal conductivity

RSC Advances ◽  
2014 ◽  
Vol 4 (33) ◽  
pp. 17015 ◽  
Author(s):  
Yongseon Hwang ◽  
Myeongjin Kim ◽  
Jooheon Kim
2016 ◽  
Vol 27 (17) ◽  
pp. 175601 ◽  
Author(s):  
Indira Seshadri ◽  
Gibran L Esquenazi ◽  
Thomas Cardinal ◽  
Theodorian Borca-Tasciuc ◽  
Ganpati Ramanath

RSC Advances ◽  
2018 ◽  
Vol 8 (40) ◽  
pp. 22846-22852 ◽  
Author(s):  
Seokgyu Ryu ◽  
Taeseob Oh ◽  
Jooheon Kim

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).


Materials ◽  
2019 ◽  
Vol 12 (17) ◽  
pp. 2770 ◽  
Author(s):  
Dongxu Wu ◽  
Congliang Huang ◽  
Yukai Wang ◽  
Yi An ◽  
Chuwen Guo

In this work, SiC and Cu particles were utilized to enhance the thermal and mechanical properties of Al matrix composites. The ball-milling and cold-compact methods were applied to prepare Al matrix composites, and the uniform distribution of SiC and Cu particles in the composite confirms the validity of our preparation method. After characterizing the thermal conductivity and the compressibility of the prepared composites, results show that small particles have a higher potential to improve compressibility than large particles, which is attributed to the size effect of elastic modulus. The addition of SiC to the Al matrix will improve the compressibility behavior of Al matrix composites, and the compressibility can be enhanced by 100% when SiC content is increased from 0 to 30%. However, the addition of SiC particles has a negative effect on thermal conductivity because of the low thermal conductivity of SiC particles. The addition of Cu particles to Al-SiC MMCs could further slightly improve the compressibility behavior of Al-SiC/Cu MMCs, while the thermal conductivity could be enhanced by about 100% when the Cu content was increased from 0 to 30%. To meet the need for low density and high thermal conductivity in applications, it is more desirable to enhance the specific thermal conductivity by enlarging the preparation pressure and/or sintering temperature. This work is expected to supply some information for preparing Al matrix composites with low density but high thermal conductivity and high compressibility.


2020 ◽  
Vol 8 (16) ◽  
pp. 5380-5388
Author(s):  
Chao Liu ◽  
Wei Wu ◽  
Dietmar Drummer ◽  
Wanting Shen ◽  
Yi Wang ◽  
...  

The needle-like Al2O3–ZnO nanowire hybrid filler endows polymer composites with high thermal conductivity, mechanical and thermal properties.


Polymers ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 426 ◽  
Author(s):  
Yunjian Wu ◽  
Xiaoxing Zhang ◽  
Ankit Negi ◽  
Jixiong He ◽  
Guoxiong Hu ◽  
...  

Polymer composites, with both high thermal conductivity and high electrical insulation strength, are desirable for power equipment and electronic devices, to sustain increasingly high power density and heat flux. However, conventional methods to synthesize polymer composites with high thermal conductivity often degrade their insulation strength, or cause a significant increase in dielectric properties. In this work, we demonstrate epoxy nanocomposites embedded with silver nanoparticles (AgNPs), and modified boron nitride nanosheets (BNNSs), which have high thermal conductivity, high insulation strength, low permittivity, and low dielectric loss. Compared with neat epoxy, the composite with 25 vol% of binary nanofillers has a significant enhancement (~10x) in thermal conductivity, which is twice of that filled with BNNSs only (~5x), owing to the continuous heat transfer path among BNNSs enabled by AgNPs. An increase in the breakdown voltage is observed, which is attributed to BNNSs-restricted formation of AgNPs conducting channels that result in a lengthening of the breakdown path. Moreover, the effects of nanofillers on dielectric properties, and thermal simulated current of nanocomposites, are discussed.


2020 ◽  
Vol 188 ◽  
pp. 107970 ◽  
Author(s):  
Chen Li ◽  
Li-Yuan Tan ◽  
Xiao-Liang Zeng ◽  
De-Liang Zhu ◽  
Rong Sun ◽  
...  

2017 ◽  
Vol 9 (38) ◽  
pp. 33001-33010 ◽  
Author(s):  
Guiran Pan ◽  
Yimin Yao ◽  
Xiaoliang Zeng ◽  
Jiajia Sun ◽  
Jiantao Hu ◽  
...  

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