scholarly journals Through-silicon via submount for the CuO/Cu2O nanostructured field emission display

RSC Advances ◽  
2018 ◽  
Vol 8 (2) ◽  
pp. 706-709 ◽  
Author(s):  
Chun-Liang Lu ◽  
Shoou-Jinn Chang ◽  
Ting-Jen Hsueh
Keyword(s):  
Field Emission ◽  
Three Dimensional ◽  
Field Emission Display ◽  
Through Silicon Via

A three dimensional (3D) field emission display structure was prepared using CuO/Cu2O composite nanowires (NWs) and a three dimensional through silicon via (3D-TSV) technique.

Enhanced field emission performance of MXene-TiO2 composite film

Nanoscale ◽  
2021 ◽  
Author(s):  
Bingjun Yang ◽  
Jiangtao Chen ◽  
xiaonan Wu ◽  
Bao Liu ◽  
Lingyang Liu ◽  
...  
Keyword(s):  
Composite Film ◽  
Field Emission ◽  
Two Dimensional ◽  
Field Emission Display ◽  
Free Standing ◽  
Emission Performance ◽  
Field Emitters ◽  
Field Emission Performance

A facile method to produce MXene-TiO2 composite is demonstrated for enhanced field emission display applications. The field emission performance of two-dimensional free-standing and linear-shaped field emitters has been systematically investigated...

Sign in / Sign up

Export Citation Format

Share Document