Closed‐form impedance model for annular through‐silicon via pairs in three‐dimensional integration
2015 ◽
Vol 9
(8)
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pp. 808-813
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2020 ◽
Vol E103.A
(4)
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pp. 704-709
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2008 ◽
Vol 55
(12)
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pp. 3467-3475
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1965 ◽
Vol 87
(2)
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pp. 228-234
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2020 ◽
pp. 65-72
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