Reactive chemical vapor deposition of heteroepitaxial Ti1−xAlxN films

CrystEngComm ◽  
2018 ◽  
Vol 20 (12) ◽  
pp. 1711-1715 ◽  
Author(s):  
F. Mercier ◽  
H. Shimoda ◽  
S. Lay ◽  
M. Pons ◽  
E. Blanquet

A novel methodology combining CVD experiments, nanoscale characterisation and reaction–diffusion modelling demonstrates Ti1−xAlxN epitaxial growth on single crystalline AlN films.

Small ◽  
2019 ◽  
Vol 15 (22) ◽  
pp. 1805395 ◽  
Author(s):  
Xuefu Zhang ◽  
Tianru Wu ◽  
Qi Jiang ◽  
Huishan Wang ◽  
Hailong Zhu ◽  
...  

2017 ◽  
Vol 468 ◽  
pp. 614-619 ◽  
Author(s):  
Tomoya Washizu ◽  
Shinichi Ike ◽  
Yuki Inuzuka ◽  
Wakana Takeuchi ◽  
Osamu Nakatsuka ◽  
...  

2012 ◽  
Vol 717-720 ◽  
pp. 105-108 ◽  
Author(s):  
Wan Shun Zhao ◽  
Guo Sheng Sun ◽  
Hai Lei Wu ◽  
Guo Guo Yan ◽  
Liu Zheng ◽  
...  

A vertical 3×2〞low pressure chemical vapor deposition (LPCVD) system has been developed to realize fast epitaxial growth of 4H-SiC. The epitaxial growth process was optimized and it was found that the growth rate increases with increasing C/Si ratio and tends to saturate when C/Si ratio exceeded 1. Mirror-like thick 4H-SiC homoepitaxial layers are obtained at 1500 °C and C/Si ratio of 0.5 with a growth rate of 25 μm/h. The minimum RMS roughness is 0.20 nm and the FWHM of rocking curves of epilayers grown for 1 hour and 2 hours are 26.2 arcsec and 32.4 arcsec, respectively. These results indicate that high-quality thick 4H-SiC epilayers can be grown successfully on the off-orientation 4H-SiC substrates.


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