scholarly journals Preparation and properties of a novel graphene fluoroxide/polyimide nanocomposite film with a low dielectric constant

RSC Advances ◽  
2017 ◽  
Vol 7 (4) ◽  
pp. 1956-1965 ◽  
Author(s):  
Xiao Chen ◽  
Haohao Huang ◽  
Xia Shu ◽  
Shumei Liu ◽  
Jianqing Zhao

A novel graphene fluoroxide/polyimide nanocomposite film with a low dielectric constant is prepared with excellent mechanical and thermal properties.

RSC Advances ◽  
2016 ◽  
Vol 6 (26) ◽  
pp. 21662-21671 ◽  
Author(s):  
Weibing Dong ◽  
Yue Guan ◽  
Dejing Shang

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF3)2– groups were firstly designed and synthesized.


2019 ◽  
Vol 10 (19) ◽  
pp. 2387-2396 ◽  
Author(s):  
Kan Zhang ◽  
Xinye Yu ◽  
Shiao-Wei Kuo

A high performance cross-linked polymer with a very low dielectric constant was achieved via a newly designed main-chain type poly(benzoxazine-co-imide-co-siloxane).


2008 ◽  
Vol 57 (5) ◽  
pp. 429-441 ◽  
Author(s):  
Turgay Seçkin ◽  
Süleyman Köytepe ◽  
Nilüfer Kıvılcım ◽  
Erkan Bahçe ◽  
Ibrahim Adıgüzel

RSC Advances ◽  
2018 ◽  
Vol 8 (14) ◽  
pp. 7753-7760 ◽  
Author(s):  
Handong Sun ◽  
Yunxia Lv ◽  
Chongyang Zhang ◽  
Xiaodan Zuo ◽  
Mengzhu Li ◽  
...  

Introducing long carbon–fluorine bonds into the polymer chain produced comb-shaped PEEK possessing a low dielectric constant (2.73) and low dielectric loss (3.00 × 10−3).


2019 ◽  
Vol 142 (1) ◽  
Author(s):  
Jisu Jiang ◽  
Landon Keller ◽  
Paul A. Kohl

Abstract Epoxide functionalized poly(propylene carbonate) (ePPC) was included in an epoxy resin formulation and thermally decomposed to create nanoporous epoxy film. The dielectric constant of the porous epoxy was lower than the epoxy formulation control. The introduction of 30% porosity in the epoxy lowered the dielectric constant from 3.78 to 2.76. A postporosity chemical treatment further lowered the dielectric constant. Hexamethyldisilazane (HMDS) was used to terminate the pore walls with the hydrophobic silane layer and reduce both the dielectric constant and tangent loss of the porous epoxy. Two different styrene maleic anhydride crosslinking agents were used in the epoxy formulation, styrene maleic anhydride 2000 (SMA2000) and styrene maleic anhydride 4000 (SMA4000). The effect of the maleic anhydride concentration within SMA on the electrical, mechanical, and thermal properties of porous epoxy film was evaluated. Epoxy films crosslinked with SMA2000 resulted in films with a higher dielectric constant compared to films prepared with SMA4000 due to higher mole fraction of maleic anhydride within SMA2000. However, SMA2000 crosslinked films yielded films with better mechanical and thermal properties. SMA2000 crosslinked films with 30% porosity had a coefficient of thermal expansion (CTE) of 35.2 ppm/K and glass transition temperature of 143 °C.


RSC Advances ◽  
2018 ◽  
Vol 8 (48) ◽  
pp. 27080-27080
Author(s):  
Handong Sun ◽  
Yunxia Lv ◽  
Chongyang Zhang ◽  
Xiaodan Zuo ◽  
Mengzhu Li ◽  
...  

Correction for ‘Materials with low dielectric constant and loss and good thermal properties prepared by introducing perfluorononenyl pendant groups onto poly(ether ether ketone)’ by Handong Sun et al., RSC Adv., 2018, 8, 7753–7760.


2018 ◽  
Vol 6 (24) ◽  
pp. 6378-6384 ◽  
Author(s):  
Xiaodong Yin ◽  
Yiyu Feng ◽  
Qiang Zhao ◽  
Yu Li ◽  
Shuangwen Li ◽  
...  

Transparent and flexible fluorinated polyimide films with loading of well-dispersed fluorographene exhibit low dielectric constants.


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