Enhancing graphene–metal contact using graphene square flake array sandwich structure

RSC Advances ◽  
2016 ◽  
Vol 6 (52) ◽  
pp. 46244-46248 ◽  
Author(s):  
Shixi Guo ◽  
Xin Li ◽  
Hui Song ◽  
Ping Cui ◽  
Quanfu Li ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Sandwich Structure ◽  
Contact Structure ◽  
Metal Contact ◽  
First Time

A novel graphene–metal contact structure that has an extra layer of graphene square flake (GSF) array sandwiched between the graphene channel and the metal to reduce contact resistance is designed for the first time.

Contact resistance, coupling and hysteresis loss measurements of ITER Poloidal Field joint in parallel applied magnetic field

2021 ◽  
Author(s):  
Jianfeng Huang ◽  
Y. Ilyin ◽  
W.A.J. Wessel ◽  
Ruben Lubkemann ◽  
Erik Krooshoop ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Contact Resistance ◽  
Applied Magnetic Field ◽  
Applied Field ◽  
Simulated Data ◽  
Hysteresis Loss ◽  
Ac Loss ◽  
Field Conditions ◽  
Ac Losses ◽  
First Time

Abstract The inter-strand contact resistance and AC losses were measured on an ITER PF Coil joint in a parallel applied AC magnetic field. In addition, the hysteresis loss was measured as a function of the angle with the applied magnetic field on a NbTi strand of the same type as in the joint with a Vibrating Sample Magnetometer (VSM). The AC loss measurements were performed at four applied field conditions for combinations of 0 or 1 T offset field and 0.2 or 0.4 T sinusoidal amplitude. The hysteresis loss of the joint was compared with the measured AC loss density of the NbTi strand for the same field conditions as the joint AC loss measurement but with varying the angle of the applied field. The subsequent cable twist angles affect the hysteresis loss since the critical current and penetration field depend on the angle of the applied field. It is found that 15.5° is an effective angle for the calculation of the hysteresis loss of joint when compared to the single strand measurement. The inter-strand contact resistance measurements cover all the typical strand combinations from the five cabling stages of the individual conductors, as well as the strand combinations across the two conductors to characterize the inter-strand including the copper sole resistivity. It’s the first time to measure the contact resistances and AC losses of the full-size ITER PF joint. By comparing the measured and simulated data in the JackPot-ACDC model, it’s also the first time to obtain the accurate inter-strand, inter-petal and strand to copper sole contact resistivities, which are the main input parameters for the further quantitative numerical analysis of the PF joints, in any current and magnetic field conditions.

Failure mechanism in fiber-shaped electrodes for lithium-ion batteries

2015 ◽  
Vol 3 (20) ◽  
pp. 10942-10948 ◽  
Author(s):  
Wei Weng ◽  
Qingqing Wu ◽  
Qian Sun ◽  
Xin Fang ◽  
Guozhen Guan ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Failure Mechanism ◽  
Electrical Contact ◽  
Active Material ◽  
Lithium Ion ◽  
Current Collector ◽  
Conductive Network ◽  
Electrical Contact Resistance ◽  
Loss Of Contact ◽  
First Time

Failure mechanism is investigated for the first time in a Si-based fiber-shaped electrode. The interphase electrical contact resistance indicates the dominant failure mechanism, which is the loss of contact between the current collector/conductive network and the active material. The decreasing contact resistance denotes the loose interphase contact and a decreasing capacity.

Effect of PTFE on Thermal Conductivity of Gas Diffusion Layers of PEM Fuel Cells

2013 ◽  
Author(s):  
Hamidreza Sadeghifar ◽  
Ned Djilali ◽  
Majid Bahrami
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
Contact Resistance ◽  
Performance Modeling ◽  
Mechanistic Model ◽  
Pem Fuel Cells ◽  
Gas Diffusion ◽  
Gas Diffusion Layers ◽  
Diffusion Layers ◽  
First Time

Through-plane thermal conductivity of 14 SIGRACET gas diffusion layers (GDLs), including series 24 & 34, as well as 25 & 35, are measured under different compressive pressures, ranging from 2 to 14 bar, at the temperature of around 60 °C. The effect of compression, PTFE loadings, and micro porous layer (MPL) on thermal conductivity of the GDLs and their contact resistance with an iron clamping surface is experimentally investigated. The contact resistance of MPL coated on GDL with the substrate of that GDL is measured for the first time in this paper. A new robust mechanistic model is presented for predicting the through-plane thermal conductivity of GDLs treated with PTFE and is successfully verified with the present experimental data. The model can predict the experimentally-observed reduction in thermal conductivity as a result of PTFE treatment and provides detailed insights on performance modeling of PEMFCs.

Elastic sandwich-type GaN/MnO2/MnON composites for flexible supercapacitors with high energy density

2018 ◽  
Vol 6 (27) ◽  
pp. 13215-13224 ◽  
Author(s):  
Shouzhi Wang ◽  
Yongliang Shao ◽  
Weikang Liu ◽  
Yongzhong Wu ◽  
Xiaopeng Hao
Keyword(s):  
Sandwich Structure ◽  
High Energy ◽  
Buffer Layers ◽  
High Energy Density ◽  
Flexible Electrode ◽  
Oxide Electrodes ◽  
Sandwich Type ◽  
First Time ◽  
Large Volume Change ◽  
Areal Capacity

A novel flexible electrode with a sandwich structure consisting of double stabilizing buffer layers is designed and fabricated for the first time, and significant improvement in cycling stability and desired areal capacity is achieved. This strategy will allow large volume change metal oxide electrodes to be applied in energy storage and related fields.

Contact resistance improvement by dielectric breakdown in semiconductor-dielectric-metal contact

2013 ◽  
Vol 102 (11) ◽  
pp. 113505 ◽  
Author(s):  
Kausik Majumdar ◽  
Chris Hobbs ◽  
Ken Matthews ◽  
Chien-Hao Chen ◽  
Tat Ngai ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Dielectric Breakdown ◽  
Metal Contact ◽  
Resistance Improvement

Development of an Experimental Procedure for Thermal Contact Resistance Estimation at the Glass/Metal Contact Interface

2013 ◽  
Vol 6 (2) ◽  
Author(s):  
B. Abdulhay ◽  
B. Bourouga ◽  
F. Alzetto ◽  
C. Challita
Keyword(s):  
Heat Flux ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Conditions ◽  
Metal Contact ◽  
Contact Interface ◽  
Equivalent Thermal Conductivity ◽  
Experimental Procedure ◽  
Glass Metal

In this paper, an experimental device is designed and developed in order to estimate thermal conditions at the glass/metal contact interface. This device is made of two parts: The upper part contains the tool (piston) made of bronze and a heating device to raise the temperature of the piston to 700 °C. The lower part is composed of a lead crucible and a glass sample. The assembly is provided with a heating system, an induction furnace of 6 kW for heating the glass up to 950 °C. The developed experimental procedure has permitted the estimation of the thermal contact resistance (TCR) using a developed measurement principle based on the inverse technique developed by Beck et al. (1985, Inverse Heat Conduction: III Posed Problems, Wiley Inter-science, New York). The semitransparent character of the glass has been taken into account by an additional radiative heat flux and an equivalent thermal conductivity. After the set-up tests, reproducibility experiments for a specific contact pressure have been carried out. Results show a good repeatability of the registered and estimated parameters such as the piston surface temperature, heat flux density, and TCR. The estimated value of TCR reaches 2 × 10−3 K m2/W with a maximum dispersion that does not exceed 6%.

Improvement of graphene–metal contact resistance by introducing edge contacts at graphene under metal

2014 ◽  
Vol 104 (18) ◽  
pp. 183506 ◽  
Author(s):  
Seung Min Song ◽  
Taek Yong Kim ◽  
One Jae Sul ◽  
Woo Cheol Shin ◽  
Byung Jin Cho
Keyword(s):  
Contact Resistance ◽  
Metal Contact

Electrical Comparison of Ta/Ti/Al/Mo/Au and Ti/Al/Mo/Au Ohmic Contacts on Undoped GaN HEMTs Structure with AlN Interlayer

2007 ◽  
Vol 17 (01) ◽  
pp. 85-89 ◽  
Author(s):  
Yunju Sun ◽  
Lester F. Eastman
Keyword(s):  
Contact Resistance ◽  
Electron Mobility ◽  
Ohmic Contacts ◽  
High Electron Mobility Transistor ◽  
Metal Contact ◽  
High Electron ◽  
Transfer Resistance ◽  
High Electron Mobility ◽  
Hemt Structure ◽  
Gan Hemts

A significant improvement of contact transfer resistance on undoped GaN/AlGaN/AlN (10 Å)/ GaN high electron mobility transistor (HEMT) structure was demonstrated using a Ta/Ti/Al/Mo/Au metallization scheme compared to a Ti/Al/Mo/Au metallization scheme. A contact resistance as low as 0.16 ± 0.03 ohm - mm was achieved by rapid thermal annealing of evaporated Ta (125 Å)/ Ti (150 Å)/ Al (900 Å)/ Mo (400 Å)/ Au (500 Å) metal contact at 700 °C for 1 min followed by 800 °C for 30 sec in a N 2 ambient. An excellent edge acuity was also demonstrated for the annealed Ta/Ti/Al/Mo/Au ohmic contacts.

scholarly journals Root Cause Analysis and Correction of Single Metal Contact Open-Induced Scan Chain Failure in 90 nm Node VLSI

2017 ◽  
Author(s):  
Chao-Cheng Ting ◽  
Ya-Chi Liu ◽  
Hsuan-Hsien Chen ◽  
Chung-Ching Tsai ◽  
Liwen Shih
Keyword(s):  
Metal Contact ◽  
Copper Plating ◽  
Cause Analysis ◽  
Excess Carbon ◽  
X Ray ◽  
Root Cause ◽  
Incomplete Removal ◽  
Scan Chain ◽  
First Time ◽  
O2 Plasma

Abstract In this paper, the localization of open metal contact for 90nm node SOC is reported based on Electron Beam Absorbed Current (EBAC) technique and scan diagnosis for the first time. According to the detected excess carbon, silicon and oxygen signals obtained from X-ray energy dispersive spectroscopy (EDX), the failure was deemed to be caused by the incomplete removal of silicate photoresist polymer formed during the O2 plasma dry clean before copper plating. Based on this, we proposed to replace the dry clean with diluted HF clean prior to the copper plating, which can significantly remove the silicate polymers and increase the yield.

A Silicon - Metal Contact Resistance

Nature ◽  
1947 ◽  
Vol 160 (4073) ◽  
pp. 710-711 ◽  
Author(s):  
E. H. PUTLEY
Keyword(s):  
Contact Resistance ◽  
Metal Contact
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