The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature

2015 ◽  
Vol 3 (23) ◽  
pp. 5890-5895 ◽  
Author(s):  
Yingqiong Yong ◽  
Tetsu Yonezawa ◽  
Masaki Matsubara ◽  
Hiroki Tsukamoto
Keyword(s):  
Electrical Conductivity ◽  
Fine Particles ◽  
Oxidation Process ◽  
Sintering Temperature ◽  
Copper Films ◽  
Low Sintering Temperature ◽  
First Time

A facile oxidation process was demonstrated, for the first time, and it can facilitate particle sintering by generating nanostructures.

scholarly journals SYNTHESIS OF COPPER NANOPARTICLES WITH VARIOUS SIZES TOWARDS IMPROVING THE ELECTRICAL CONDUCTIVITY OF COPPER FILMS AT LOW SINTERING TEMPERATURE

2019 ◽  
Vol 57 (3A) ◽  
pp. 48
Author(s):  
Anh Tuan Luu ◽  
Dat Vinh Vuong ◽  
Anh Phan Nhat Nguyen
Keyword(s):  
Electrical Conductivity ◽  
Crystallite Size ◽  
Copper Nanoparticles ◽  
Sintering Temperature ◽  
Copper Film ◽  
Circuit Board ◽  
Slight Variation ◽  
Copper Films ◽  
Copper Particles ◽  
Low Sintering Temperature

The use of copper nanoparticles (CuNPs) in conductive inks has attracted much attention to printed circuit board manufacturers due to its high electrical conductivity and low cost. The synthesis of CuNPs by surfactant-assisted chemical reduction method was studied aiming to identify the content of PVP-surfactant corresponding to the size of copper particles. The crystallite size and phase of CuNPs were determined by X-ray diffraction (XRD) analysis while transmission and scanning electron microscopy (TEM and SEM) were used to characterize the size of copper particles. The results showed that the crystallite and particle size of CuNPs decrease with increasing the PVP-surfactant concentration. The crystallite size values measured by TEM and XRD methods have a slight variation. The copper films were fabricated by the doctor-blade technique on PI and Al2O3 substrates. The effect of sintering temperature on conductive properties of the copper film after sintering was investigated. The copper film was sintered at low temperatures below 300oC. The electrical conductivity of copper films was measured by using the four-point probe method. The electrical resistivity of copper films archives stable at the low sintering temperature above 200°C about 0.22 mΩ.cm and 0.63 mΩ.cm for that of Al2O3 and PI substrates respectively.

Magnetic Properties of Ni-Zn Ferrite Ceramics Prepared from the Blend of Powders

2005 ◽  
Vol 475-479 ◽  
pp. 2193-2196 ◽  
Author(s):  
Haisheng Zhong ◽  
Qiang Li ◽  
Zhifeng Zhong ◽  
Ming Cheng
Keyword(s):  
Magnetic Properties ◽  
Grain Growth ◽  
Fine Particles ◽  
Sintering Temperature ◽  
Initial Permeability ◽  
Abnormal Grain Growth ◽  
Zn Ferrite ◽  
Low Sintering Temperature ◽  
Ultra Fine Particles

Ni-Zn ferrite ceramics were prepared from the blend of nano-sized powders and ultra-fine particles at the relative low sintering temperature (≤1200°C). The microstructure of the as-sintered samples characterized by SEM indicated that this process obstructed abnormal grain growth which often appeared in the Ni-Zn ferrite ceramics sintered from the nano-sized powders. The result of VSM measurements showed that the ratio of nano-sized powders to ultra-fine particles effected the initial permeability (μi) of the as-sintered samples. Optimum initial permeability can be obtained by adjusting the ratio as 1:1.

scholarly journals Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

2017 ◽  
Vol 5 (5) ◽  
pp. 1033-1041 ◽  
Author(s):  
Yingqiong Yong ◽  
Mai Thanh Nguyen ◽  
Tetsu Yonezawa ◽  
Takashi Asano ◽  
Masaki Matsubara ◽  
...  
Keyword(s):  
Low Temperature ◽  
Fine Particles ◽  
Sintering Temperature ◽  
Low Temperature Sintering ◽  
Cu Films ◽  
Conductive Films ◽  
Low Sintering Temperature ◽  
Effective Additive

Decomposable polymer was used for low temperature sintering of Cu fine particles for conductive films.

Preparation and Thermoelectric Properties of SiC Matrix Composites Prepared under a Low Sintering Temperature

2010 ◽  
Vol 105-106 ◽  
pp. 333-335 ◽  
Author(s):  
Ming Liang Li ◽  
Hai Long Wang ◽  
Rui Zhang ◽  
Jing Li ◽  
Jun Hao Li
Keyword(s):  
Electrical Conductivity ◽  
Thermoelectric Properties ◽  
Sintering Temperature ◽  
Pressureless Sintering ◽  
Matrix Composites ◽  
Sintering Aids ◽  
Nickel Powders ◽  
N2 Atmosphere ◽  
Low Sintering Temperature ◽  
P Type

SiC powders with nickel powders and sintering aids were prepared by pressureless sintering at 1500oC under a N2 atmosphere. XRD, TEM, SEM techniques were used to characterize the phases and microstructure of the specimens. The thermoelectric properties of SiC matrix composites were investigated by measuring the Seebeck coefficient and the electrical conductivity. The main phase of all samples was -SiC, the Ni2Si can be observed with adding nickel powders. The largest electric conductivity was close to 3.5 m-1-1 at about 973K. The highest Seeback coefficient was up to 1800 V/K at 1073K. The transition from n-type to p-type was occurred.

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