Contribution of Ligand Oxidation Products to High Durability of Copper Films Prepared from Low-Sintering-Temperature Copper Ink on Polymer Substrates

2017 ◽  
Vol 19 (8) ◽  
pp. 1700259 ◽  
Author(s):  
Yusuke Akiyama ◽  
Tomonori Sugiyama ◽  
Hideya Kawasaki
Keyword(s):  
Sintering Temperature ◽  
Oxidation Products ◽  
Copper Films ◽  
Polymer Substrates ◽  
High Durability ◽  
Low Sintering Temperature

The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature

2015 ◽  
Vol 3 (23) ◽  
pp. 5890-5895 ◽  
Author(s):  
Yingqiong Yong ◽  
Tetsu Yonezawa ◽  
Masaki Matsubara ◽  
Hiroki Tsukamoto
Keyword(s):  
Electrical Conductivity ◽  
Fine Particles ◽  
Oxidation Process ◽  
Sintering Temperature ◽  
Copper Films ◽  
Low Sintering Temperature ◽  
First Time

A facile oxidation process was demonstrated, for the first time, and it can facilitate particle sintering by generating nanostructures.

scholarly journals SYNTHESIS OF COPPER NANOPARTICLES WITH VARIOUS SIZES TOWARDS IMPROVING THE ELECTRICAL CONDUCTIVITY OF COPPER FILMS AT LOW SINTERING TEMPERATURE

2019 ◽  
Vol 57 (3A) ◽  
pp. 48
Author(s):  
Anh Tuan Luu ◽  
Dat Vinh Vuong ◽  
Anh Phan Nhat Nguyen
Keyword(s):  
Electrical Conductivity ◽  
Crystallite Size ◽  
Copper Nanoparticles ◽  
Sintering Temperature ◽  
Copper Film ◽  
Circuit Board ◽  
Slight Variation ◽  
Copper Films ◽  
Copper Particles ◽  
Low Sintering Temperature

The use of copper nanoparticles (CuNPs) in conductive inks has attracted much attention to printed circuit board manufacturers due to its high electrical conductivity and low cost. The synthesis of CuNPs by surfactant-assisted chemical reduction method was studied aiming to identify the content of PVP-surfactant corresponding to the size of copper particles. The crystallite size and phase of CuNPs were determined by X-ray diffraction (XRD) analysis while transmission and scanning electron microscopy (TEM and SEM) were used to characterize the size of copper particles. The results showed that the crystallite and particle size of CuNPs decrease with increasing the PVP-surfactant concentration. The crystallite size values measured by TEM and XRD methods have a slight variation. The copper films were fabricated by the doctor-blade technique on PI and Al2O3 substrates. The effect of sintering temperature on conductive properties of the copper film after sintering was investigated. The copper film was sintered at low temperatures below 300oC. The electrical conductivity of copper films was measured by using the four-point probe method. The electrical resistivity of copper films archives stable at the low sintering temperature above 200°C about 0.22 mΩ.cm and 0.63 mΩ.cm for that of Al2O3 and PI substrates respectively.

Significant enhancement ofHc2andHirrin MgB2+C4H6O5bulks at a low sintering temperature of 600 °C

2007 ◽  
Vol 20 (8) ◽  
pp. L51-L54 ◽  
Author(s):  
M S A Hossain ◽  
J H Kim ◽  
X Xu ◽  
X L Wang ◽  
M Rindfleisch ◽  
...  
Keyword(s):  
Sintering Temperature ◽  
Significant Enhancement ◽  
Low Sintering Temperature
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