Leak-tight vertical membrane microvalves

Lab on a Chip ◽  
2016 ◽  
Vol 16 (8) ◽  
pp. 1439-1446 ◽  
Author(s):  
Jonas Hansson ◽  
Mikael Hillmering ◽  
Tommy Haraldsson ◽  
Wouter van der Wijngaart
Keyword(s):  
Integration Density ◽  
Pdms Molding

A novel, dual-sided PDMS molding technique enables the first leak-tight vertical membrane microvalves and allows high integration density of microfluidic components.

scholarly journals Theoretical Analysis of Terahertz Dielectric–Loaded Graphene Waveguide

Nanomaterials ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 210
Author(s):  
Da Teng ◽  
Kai Wang
Keyword(s):  
Photonic Devices ◽  
Effective Index ◽  
The Finite Element Method ◽  
Index Method ◽  
Modal Properties ◽  
Terahertz Region ◽  
Effective Index Method ◽  
Integration Density ◽  
Device Integration ◽  
Potential Applications

The waveguiding of terahertz surface plasmons by a GaAs strip-loaded graphene waveguide is investigated based on the effective-index method and the finite element method. Modal properties of the effective mode index, modal loss, and cut-off characteristics of higher order modes are investigated. By modulating the Fermi level, the modal properties of the fundamental mode could be adjusted. The accuracy of the effective-index method is verified by a comparison between the analytical results and numerical simulations. Besides the modal properties, the crosstalk between the adjacent waveguides, which determines the device integration density, is studied. The findings show that the effective-index method is highly valid for analyzing dielectric-loaded graphene plasmon waveguides in the terahertz region and may have potential applications in subwavelength tunable integrated photonic devices.

scholarly journals Investigation on Thermal Resistance and Capacitance Characteristics of a Highly Integrated Power Control Unit Module

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 958
Author(s):  
Maosheng Zhang ◽  
Yu Bai ◽  
Shu Yang ◽  
Kuang Sheng
Keyword(s):  
Thermal Resistance ◽  
Power Control ◽  
Electric Vehicles ◽  
Low Cost ◽  
Control Unit ◽  
Underlying Mechanism ◽  
Power Converter ◽  
Liquid Cooling ◽  
Integration Density ◽  
Unit Module

With the increasing integration density of power control unit (PCU) modules, more functional power converter units are integrated into a single module for applications in electric vehicles or hybrid electric vehicles (EVs/HEVs). Different types of power dies with different footprints are usually placed closely together. Due to the constraints from the placement of power dies and liquid cooling schemes, heat-flow paths from the junction to coolant are possibly inconsistent for power dies, resulting in different thermal resistance and capacitance (RC) characteristics of power dies. This presents a critical challenge for optimal liquid cooling at a low cost. In this paper, a highly integrated PCU module is developed for application in EVs/HEVs. The underlying mechanism of the inconsistent RC characteristics of power dies for the developed PCU module is revealed by experiments and simulations. It is found that the matching placement design of power dies with a heat sink structure and liquid cooler, as well as a liquid cooling scheme, can alleviate the inconsistent RC characteristics of power dies in highly integrated PCU modules. The findings in this paper provide valuable guidance for the design of highly integrated PCU modules.

scholarly journals Low-Power Multiplexer Structures Targeting Efficient QCA Nanotechnology Circuit Designs

Electronics ◽  
2021 ◽  
Vol 10 (16) ◽  
pp. 1885
Author(s):  
Amjad Almatrood ◽  
Aby K. George ◽  
Harpreet Singh
Keyword(s):  
Energy Efficient ◽  
Building Blocks ◽  
Switching Frequency ◽  
Circuit Implementation ◽  
Suitable Candidate ◽  
Quantum Dot Cellular Automata ◽  
Performance Factors ◽  
Integration Density ◽  
Qca Circuits ◽  
Energy Efficient Building

Quantum-dot cellular automata (QCA) technology is considered to be a possible alternative for circuit implementation in terms of energy efficiency, integration density and switching frequency. Multiplexer (MUX) can be considered to be a suitable candidate for designing QCA circuits. In this paper, two different structures of energy-efficient 2×1 MUX designs are proposed. These MUXes outperform the best existing design in terms of power consumption with approximate reductions of 26% and 35%. Moreover, similar or better performance factors such as area and latency are achieved compared to the available designs. These MUX structures can be used as fundamental energy-efficient building blocks for replacing the majority-based structures in QCA. The scalability property of the proposed MUXes is excellent and can be used for energy-efficient complex QCA circuit designs.

scholarly journals Investigation of Side Wall Roughness Effect on Optical Losses in a Multimode Si3N4 Waveguide Formed on a Quartz Substrate

Photonics ◽  
2020 ◽  
Vol 7 (4) ◽  
pp. 104
Author(s):  
Anastasia Yakuhina ◽  
Alexey Kadochkin ◽  
Vyacheslav Svetukhin ◽  
Dmitry Gorelov ◽  
Sergey Generalov ◽  
...  
Keyword(s):  
Optical Waveguides ◽  
Quartz Substrate ◽  
Side Wall ◽  
Wall Roughness ◽  
Roughness Parameters ◽  
Optical Losses ◽  
Waveguide Width ◽  
Integration Density ◽  
Frequency Domain Reflectometry ◽  
Multimode Operation

This article presents the results of the study of the influence of the most significant parameters of the side wall roughness of an ultra-thin silicon nitride lightguide layer of multimode integrated optical waveguides with widths of 3 and 8 microns. The choice of the waveguide width was made due to the need to provide multimode operation for telecommunication wavelengths, which is necessary to ensure high integration density. Scattering in waveguide structures was measured by optical frequency domain reflectometry (OFDR) of a backscattering reflectometer. The finite difference time domain method (FDTD) was used to study the effect of roughness parameters on optical losses in fabricated waveguides, the roughness parameters that most strongly affect optical scattering were determined, and methods of its significant reduction were specified. The prospects for implementing such structures on a quartz substrate are justified.

Nanotube based Vertical Nano-devices for High Integration Density

2006 ◽  
Author(s):  
J.E. Jang ◽  
S.N. Cha ◽  
Y. Choi ◽  
D.J. Kang ◽  
T.P. Butler ◽  
...  
Keyword(s):  
Integration Density

Microfluidics and Beyond – Devices for Applications in Biotechnology -

2004 ◽  
Vol 820 ◽  
Author(s):  
Martina Daub ◽  
Rolf M. Kaack ◽  
Oliver Gutmann ◽  
Chris P. Steinert ◽  
Remigius Niekrawietz ◽  
...  
Keyword(s):  
High Throughput Screening ◽  
Life Science ◽  
Life Sciences ◽  
Microarray Technology ◽  
Parallel Operation ◽  
Modern Life ◽  
Liquid Handling ◽  
Microtiter Plates ◽  
Integration Density ◽  
Volume Range

AbstractFor the performance of certain analytical and diagnostic tasks in modern Life Science applications high throughput screening (HTS) methods are essential. Miniaturization, parallelization and automation allow to decrease consumption of expensive materials and lead to faster analyzing times. The miniaturization of total assay volumes by the use of microtiter plates as well as the microarray technology have revolutionized the field of biotechnology and Life Sciences. Neither printing of microarrays with droplet volumes of several picoliters, nor handling of precious enzymes in the upper nanoliter range can be accomplished with traditional liquid handling devices like air displacement pipettes. The development of novel low volume liquid handling devices, which are subject to current research, addresses the diverse requirements shifting steadily to lower volumes. Various novel non-contact dispensing methods in the nanoliter and picoliter range are presented and classified according to their working principles like air displacement and direct displacement methods (TopSpot®, NanoJetTM, Dispensing Well PlateTM). Properties of the various methods are compared in terms of flexibility, integration density, speed of operation, precision, addressable volume range and amenability to multi-parallel operation.

High-Permittivity Perovskite Thin Films for Dynamic Random-Access Memories

MRS Bulletin ◽  
1996 ◽  
Vol 21 (7) ◽  
pp. 46-52 ◽  
Author(s):  
A.I. Kingon ◽  
S.K. Streiffer ◽  
C. Basceri ◽  
S.R. Summerfelt
Keyword(s):  
Thin Films ◽  
Random Access ◽  
Important Application ◽  
Ferroelectric Films ◽  
High Permittivity ◽  
New Developments ◽  
Strong Growth ◽  
Technology Leader ◽  
Integration Density ◽  
Storage Node

An important application of ferroelectric films is their incorporation into dynamic random-access memories (DRAMs) as the storage node capacitor dielectric. Dynamic random-access memories represent a large market that is experiencing strong growth, but they are particularly significant as the technology leader for semiconductor devices. As products move to higher and higher integration density, new developments are first introduced in DRAMs. The steady trend toward higher density has placed severe demands on the device designs, particularly with respect to “squeezing” the capacitor into the available space.

Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process

2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000062-000066 ◽  
Author(s):  
T. Welker ◽  
S. Günschmann ◽  
N. Gutzeit ◽  
J. Müller
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Junction Temperature ◽  
Large Area ◽  
Heat Spreader ◽  
Integration Density ◽  
Heat Spreaders ◽  
Cte Mismatch ◽  
Pattern Resolution

The integration density in semiconductor devices is significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands on the substrate technology which is used for the first level interconnect between the semiconductor and the device package. Higher pattern resolution is required to connect more functions on a smaller chip. Also the thermal performance of the substrate is a crucial issue. The increased integration density leads to an increased power density, what means that more heat has to dissipate on a smaller area. Thus, substrates with a high thermal conductivity (e. g. direct bonded copper (DBC)) are utilized which spread the heat over a large area. However, the reduced pattern resolution caused by thick metal layers is disadvantageous for this substrate technology. Alternatively, low temperature co-fired ceramic (LTCC) can be used. This multilayer technology provides a high pattern resolution in combination with a high integration grade. The poor thermal conductivity of LTCC (3 … 5 W*m−1*K−1) requires thermal vias made of silver paste which are placed between the power chip and the heat sink and reduce the thermal resistance of the substrate. The via-pitch and diameter is limited by the LTCC technology, what allows a maximum filling grade of approx. 20 to 25 %. Alternatively, an opening in the ceramic is created, to bond the chip directly to the heat sink. This leads to technological challenges like the CTE mismatch between the chip and the heat sink material. Expensive materials like copper molybdenum composites with matched CTE have to be used. In the presented investigation, a thick silver tape is used to form a thick silver heat spreader through the LTCC substrate. An opening is structured by laser cutting in the LTCC tape and filled with a laser cut silver tape. After lamination, the substrate is fired using a constraint sintering process. The bond strength of the silver to LTCC interface is approx. 5.6 MPa. The thermal resistance of the silver structure is measured by a thermal test chip (Delphi PST1, 2.5 mm × 2.5 mm) glued with a high thermal conducting epoxy to the silver structure. The chip contains a resistor and diodes to generate heat and to determine the junction temperature respectively. The backside of the test structure is temperature stabilized by a temperature controlled heat sink. The resulting thermal resistance is in the range of 1.1 K/W to 1.5 K/W depending on the length of silver structure (5 mm to 7 mm). Advantages of the presented heat spreader are the low thermal resistance and the good embedding capability in the co-fire LTCC process.

scholarly journals Multipurpose self-configuration of programmable photonic circuits

2020 ◽  
Vol 11 (1) ◽  
Author(s):  
Daniel Pérez-López ◽  
Aitor López ◽  
Prometheus DasMahapatra ◽  
José Capmany
Keyword(s):  
Signal Processing ◽  
High Speed ◽  
Two Dimensional ◽  
Photonic Circuits ◽  
Computational Optimization ◽  
Digital Electronics ◽  
Control Signals ◽  
Integration Density ◽  
Functional Complexity ◽  
Multiple Configuration

AbstractProgrammable integrated photonic circuits have been called upon to lead a new revolution in information systems by teaming up with high speed digital electronics and in this way, adding unique complementary features supported by their ability to provide bandwidth-unconstrained analog signal processing. Relying on a common hardware implemented by two-dimensional integrated photonic waveguide meshes, they can provide multiple functionalities by suitable programming of their control signals. Scalability, which is essential for increasing functional complexity and integration density, is currently limited by the need to precisely control and configure several hundreds of variables and simultaneously manage multiple configuration actions. Here we propose and experimentally demonstrate two different approaches towards management automation in programmable integrated photonic circuits. These enable the simultaneous handling of circuit self-characterization, auto-routing, self-configuration and optimization. By combining computational optimization and photonics, this work takes an important step towards the realization of high-density and complex integrated programmable photonics.

scholarly journals Integration density of ion-damaged barrier Josephson junction and circuits

2019 ◽  
Vol 1182 ◽  
pp. 012002
Author(s):  
D. Crété ◽  
Y. Lemaître ◽  
J. Trastoy ◽  
B. Marcilhac ◽  
C. Ulysse
Keyword(s):  
Josephson Junction ◽  
Integration Density
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