TS-1 zeolite as an effective diffusion barrier for highly stable Pd membrane supported on macroporous α-Al2O3 tube

RSC Advances ◽  
2013 ◽  
Vol 3 (14) ◽  
pp. 4821 ◽  
Author(s):  
Xiaobin Wang ◽  
Xiaoyao Tan ◽  
Bo Meng ◽  
Xiongfu Zhang ◽  
Qi Liang ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Effective Diffusion ◽  
Pd Membrane ◽  
Al2o3 Tube ◽  
Α Al2o3

A novel approach for the preparation of highly stable Pd membrane on macroporous α-Al2O3 tube

2010 ◽  
Vol 362 (1-2) ◽  
pp. 241-248 ◽  
Author(s):  
Yu Guo ◽  
Xiongfu Zhang ◽  
Hui Deng ◽  
Xiaobin Wang ◽  
Yao Wang ◽  
...  
Keyword(s):  
Pd Membrane ◽  
Al2o3 Tube ◽  
Novel Approach ◽  
Α Al2o3

Synthesis of Potassium Ionic Sieve Membrane and its Selectivity to Potassium Ion in Seawater

2010 ◽  
Vol 178 ◽  
pp. 300-307 ◽  
Author(s):  
Jun Sheng Yuan ◽  
Fei Li ◽  
Hui Ru Han ◽  
Zhi Yong Ji
Keyword(s):  
Hydrothermal Synthesis ◽  
Gas Permeability ◽  
Knudsen Diffusion ◽  
Potassium Ion ◽  
Zeolite Membranes ◽  
Al2o3 Tube ◽  
Separation Factors ◽  
Α Al2o3 ◽  
High Separation ◽  
The Ideal

Potassium ionic sieve membrane was synthesized on porous α-Al2O3 tube support by the hydrothermal synthesis. The zeolite membranes were characterized by means of XRD and SEM. And the single-gas permeability through the membranes and selectivity to K+, Na+, Ca2+, Mg2+ were measured. The results show that the ideal separation factor is 3.68, which is close to Knudsen diffusion ratio 3.74 for H2/N2; the separation factors of the potassium ionic sieve membrane are , , respectively, indicating its high separation selectivity to potassium ion.

In-Situ Tem Study of Copper-Tin Intermetallic Formation

1993 ◽  
Vol 323 ◽  
Author(s):  
Yujing Wu ◽  
Elizabeth G. Jacobs ◽  
Cyrus Pouraghabagher ◽  
Russell F. Pinizzotto
Keyword(s):  
Thin Films ◽  
Real Time ◽  
Diffusion Barrier ◽  
Solder Joints ◽  
Effective Diffusion ◽  
Copper Substrate ◽  
In Situ Tem ◽  
Intermetallic Formation ◽  
Intermetallic Growth

AbstractThe formation and growth of Cu6Sn5 and Cu3Sn at the interface of Sn-Pb solder/copper substrate are factors which affect the solderability and reliability of electronic solder joints. The addition of particles such as Ni to eutectic Sn-Pb solder drastically affects the activation energies of formation for both intermetallics. This study was performed to understand the mechanisms of intermetallic formation and the effects of Ni on intermetallic growth. Cu/Sn and Cu/Sn/Ni thin films were deposited by evaporation and observed in the TEM in real time using a hot stage. The diffusion of Sn through Cu6Sn5 and Cu3Sn followed by reaction with Cu must occur for intermetallic formation and growth to take place. Ni is an effective diffusion barrier which prevents Sn from diffusing into Cu.

Effect of the Electroless Nickel, Electroless Palladium, and Immersion Gold Multilayer as a Diffusion Barrier on the Bonding Strength of BiTe-Based Thermoelectric Modules

2021 ◽  
Vol 21 (8) ◽  
pp. 4498-4502
Author(s):  
Yen Ngoc Nguyen ◽  
Khanh Quoc Dang ◽  
Injoon Son
Keyword(s):  
Intermetallic Compounds ◽  
Electrochemical Deposition ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Bonding Strength ◽  
Effective Diffusion ◽  
Electroless Nickel ◽  
Thermoelectric Modules ◽  
Diffusion Barrier Layer ◽  
Plating Layer

An effective diffusion barrier layer was coated onto the surface of BiTe-based materials to avoid the formation of brittle intermetallic compounds (IMCs) by the diffusion of the constituents of Sn-based solder alloys into the BiTe-based alloys. In this study, the electrochemical deposition of multi-layers, i.e., electroless nickel/electroless palladium/immersion gold (ENEPIG) was explored to enhance the bonding strength of BiTe materials with Cu electrodes. The thermoelectric modules with the ENEPIG plating layer exhibited high bonding strengths of 8.96 MPa and 7.28 MPa for the n- and p-type, respectively that increased slightly to 9.26 MPa and 7.76 MPa, respectively after the thermoelectric modules were heated at 200 °C for 200 h. These bonding strengths were significantly higher than that of the thermoelectric modules without a plating layer.

ANALYSIS OF THE ARRHENIUS SHAPE OF THE DIFFUSION COEFFICIENT ON AN fcc (111) SURFACE

2000 ◽  
Vol 07 (03) ◽  
pp. 219-225 ◽  
Author(s):  
M. MAŠÍN ◽  
Z. CHVOJ
Keyword(s):  
Diffusion Coefficient ◽  
Diffusion Barrier ◽  
Effective Diffusion ◽  
Chemical Diffusion ◽  
Strong Interactions ◽  
Chemical Diffusion Coefficient ◽  
Interacting Particles ◽  
Temperature Dependent ◽  
Deep Minimum ◽  
Coverage Dependence

We study the temperature and coverage dependence of an effective diffusion barrier assuming an Arrhenius shape of the chemical diffusion coefficient for a system of interacting particles. The previously published model of the diffusion of an fcc (111) surface with bivariate trap is used. The presence of two nonequivalent occupation sites and interaction result in a non-Arrhenius shape of the diffusion coefficient and a coverage- and temperature-dependent effective diffusion barrier. The temperature dependence of effective energy Ea shows a minimum at low temperatures (at approximately 150 K) for strong interactions. The coverage dependence of Ea has a deep minimum in the vicinity of Θ=1/2, even in a system without interaction.

Synthesis of thin and compact mesoporous MCM-48 membrane on vacuum-coated α-Al2O3 tube

2008 ◽  
Vol 319 (1-2) ◽  
pp. 231-237 ◽  
Author(s):  
S WU ◽  
J YANG ◽  
J LU ◽  
Z ZHOU ◽  
C KONG ◽  
...  
Keyword(s):  
Al2o3 Tube ◽  
Α Al2o3

TaN∕Ta as an Effective Diffusion Barrier for Direct Contact of Copper and NiSi

2012 ◽  
Vol 15 (1) ◽  
pp. H9 ◽  
Author(s):  
Yu-Long Jiang ◽  
Qi Xie ◽  
Xin-Ping Qu ◽  
David W Zhang ◽  
Davy Deduytsche ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Direct Contact ◽  
Effective Diffusion

scholarly journals Reducing copper leaching from treated wood by sol-gel derived TiO2 and SiO2 depositions

Holzforschung ◽  
2013 ◽  
Vol 67 (4) ◽  
pp. 429-435 ◽  
Author(s):  
Muhammad Shabir Mahr ◽  
Thomas Hübert ◽  
Ina Stephan ◽  
Michael Bücker ◽  
Holger Militz
Keyword(s):  
Cell Wall ◽  
Diffusion Barrier ◽  
Sol Gel ◽  
Effective Diffusion ◽  
Treated Wood ◽  
Emission Rates ◽  
Step Process ◽  
Copper Leaching ◽  
One Step ◽  
The One

Abstract The antileaching efficacy of sol-gel-derived TiO2- and SiO2-based precursors has been evaluated through laboratory leaching trials with pine sapwood in two different ways. In a one-step process, wood was vacuum impregnated by the precursor solutions containing CuCl2. The copper (Cu) emission rates of the sol-gel-based impregnated woods were up to 70% lower than that of wood treated with pure CuCl2 solution at the same level of concentration. More improvement (80%) could be achieved in a two-step process, in which sol-gel precursors were introduced into an already CuCl2-treated wood. The refinement was attributed to several effects. In the one-step approach, Cu was embedded in the TiO2/SiO2 gels formed in the wood texture. During a two-step impregnation, gel layers that were formed in the wooden interior acted as an effective diffusion barrier. The sol-gel impregnations made wood more hydrophobic; therefore, the low amount of water that penetrated the cell wall was less efficient to leach out Cu.

The Photodecomposition of Acetaldehyde in Gas Phase Using Immobilized TiO2 on Porous α-Al2O3 Tube

2002 ◽  
Vol 5 (2) ◽  
Author(s):  
Seoung Min Cho ◽  
Hyunku Joo ◽  
Hyun Jong Kim ◽  
Yong Gun Shul
Keyword(s):  
Photocatalytic Degradation ◽  
Gas Phase ◽  
Al2o3 Tube ◽  
Immobilized Tio2 ◽  
Α Al2o3

AbstractsA study on the photocatalytic degradation of acetaldehyde using immobilized TiO

Synthesis and characterization of Fe-MFI zeolite membrane on a porous α-Al2O3 tube

2001 ◽  
Vol 25 (1-3) ◽  
pp. 269-274 ◽  
Author(s):  
Zhang Xiongfu ◽  
Li Yongsheng ◽  
Wang Jinqu ◽  
Tong Huairong ◽  
Liu Changhou
Keyword(s):  
Zeolite Membrane ◽  
Synthesis And Characterization ◽  
Mfi Zeolite ◽  
Al2o3 Tube ◽  
Α Al2o3
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