Concentration profiles in the surface layer on glass electrodes by argon–ion beam sputtering

Author(s):  
Arthur K. Covington ◽  
Adrian Flynn
2016 ◽  
Vol 683 ◽  
pp. 62-66 ◽  
Author(s):  
Pawel Zukowski ◽  
Tomasz N. Koltunowicz ◽  
Vitalii Bondariev ◽  
Alexander K. Fedotov ◽  
Julia A. Fedotova

Author(s):  
G.J.C. Carpenter ◽  
J.A. Jackman ◽  
J. McCaffrey

Argon ion sputtering is widely used in the final thinning stage for the preparation of thin foils for transmission electron microscopy. During a recent study of a titanium alloy, we observed that ion-beam thinning resulted in specimens that appeared in the electron microscope to have become severely damaged. Similar microstructures had been observed previously in zirconium, thinned in this manner. Because ion-beam sputtering takes place on the atomic scale, it seemed unlikely that gross distortion of a thin foil could have been caused directly by the sputtering process. A more detailed study has therefore been made of this phenomenon.


2005 ◽  
Vol 486-487 ◽  
pp. 301-304
Author(s):  
Kyoung Chul Shin ◽  
Jong Min Lim ◽  
Chong Mu Lee

The hexavalent chromium used in chromium plating is so toxic that it is very hazardous to human body and even carcinogenic. Therefore, it is indispensable to develop an alternative deposition technique. To explore the feasibility of sputtering as an alternative technique for chromium plating, we investigated the dependences of the deposition rate, the phases, the hardness, the surface roughness and the corrosion-resistance of CrNx deposited on the high speed steel substrate by using a dual ion beam sputtering system on the rf-powers. The deposition rate of CrNx depends more strongly upon the rf-power for argon ion beam than that of the nitrogen ion beam. The hardness of the CrNx film can be maximized by optimizing the rf-power, so that the volume percent of the Cr2N phase in the film is highest. Amorphous films are obtained when the rf-power for nitrogen ion beam is much higher than that for argon ion beam. The CrNx film deposited by using the sputtering technique under the optimal condition provides corrosion-resistance comparable to that of the electroplated chromium.


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