Self-assembly of copper(ii) complexes with ladder, bi-rack, rack–ladder–rack and layer structures by the directional-bonding approach using a T-shaped ligand
2000 ◽
Vol 86
(1-2)
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pp. 96-102
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2020 ◽
Vol 76
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pp. 695-705
2011 ◽
Vol 412
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pp. 384-387
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2012 ◽
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pp. 39-42
2021 ◽
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1978 ◽
Vol 36
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pp. 434-435
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