scholarly journals Large-scale synthesis of uniform hexagonal boron nitride films by plasma-enhanced atomic layer deposition

2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Hamin Park ◽  
Tae Keun Kim ◽  
Sung Woo Cho ◽  
Hong Seok Jang ◽  
Sang Ick Lee ◽  
...  
Nanomaterials ◽  
2018 ◽  
Vol 8 (10) ◽  
pp. 849 ◽  
Author(s):  
Matthieu Weber ◽  
Cassandre Lamboux ◽  
Bruno Navarra ◽  
Philippe Miele ◽  
Sandrine Zanna ◽  
...  

The ability to prepare controllable nanocatalysts is of great interest for many chemical industries. Atomic layer deposition (ALD) is a vapor phase technique enabling the synthesis of conformal thin films and nanoparticles (NPs) on high surface area supports and has become an attractive new route to tailor supported metallic NPs. Virtually all the studies reported, focused on Pd NPs deposited on carbon and oxide surfaces. It is, however, important to focus on emerging catalyst supports such as boron nitride materials, which apart from possessing high thermal and chemical stability, also hold great promises for nanocatalysis applications. Herein, the synthesis of Pd NPs on boron nitride (BN) film substrates is demonstrated entirely by ALD for the first time. X-ray photoelectron spectroscopy indicated that stoichiometric BN formed as the main phase, with a small amount of BNxOy, and that the Pd particles synthesized were metallic. Using extensive transmission electron microscopy analysis, we study the evolution of the highly dispersed NPs as a function of the number of ALD cycles, and the thermal stability of the ALD-prepared Pd/BN catalysts up to 750 °C. The growth and coalescence mechanisms observed are discussed and compared with Pd NPs grown on other surfaces. The results show that the nanostructures of the BN/Pd NPs were relatively stable up to 500 °C. Consequent merging has been observed when annealing the samples at 750 °C, as the NPs’ average diameter increased from 8.3 ± 1.2 nm to 31 ± 4 nm. The results presented open up exciting new opportunities in the field of catalysis.


MRS Bulletin ◽  
2009 ◽  
Vol 34 (7) ◽  
pp. 493-503 ◽  
Author(s):  
Robert M. Wallace ◽  
Paul C. McIntyre ◽  
Jiyoung Kim ◽  
Yoshio Nishi

AbstractThe prospect of utilizing alternative transistor channel materials for ultrahigh performance transistors will require suitable gate dielectrics for surface-channel field-effect devices. With the utilization of deposited gate dielectrics in large-scale production for Si-based integrated circuits by atomic layer deposition, extending this technology to channel materials that exhibit high bulk mobility behavior is of interest. A review of the current status for atomic layer deposited high-κ dielectrics on Ge and III–V channel materials is presented.


Nano Letters ◽  
2012 ◽  
Vol 12 (2) ◽  
pp. 714-718 ◽  
Author(s):  
Kang Hyuck Lee ◽  
Hyeon-Jin Shin ◽  
Jinyeong Lee ◽  
In-yeal Lee ◽  
Gil-Ho Kim ◽  
...  

2005 ◽  
Vol 11 (6-7) ◽  
pp. 330-337 ◽  
Author(s):  
J. Olander ◽  
L. M. Ottosson ◽  
P. Heszler ◽  
J.-O. Carlsson ◽  
K. M. E. Larsson

2020 ◽  
Vol 12 (32) ◽  
pp. 36688-36694
Author(s):  
Jaebeom Lee ◽  
Arul V. Ravichandran ◽  
Jaidah Mohan ◽  
Lanxia Cheng ◽  
Antonio T. Lucero ◽  
...  

RSC Advances ◽  
2019 ◽  
Vol 9 (18) ◽  
pp. 10155-10158 ◽  
Author(s):  
Zhiyuan Shi ◽  
Guangyuan Lu ◽  
Peng Yang ◽  
Tianru Wu ◽  
Weijun Yin ◽  
...  

CVD growth of large scale and high quality multilayer h-BN.


2014 ◽  
Vol 571 ◽  
pp. 51-55 ◽  
Author(s):  
Michael Snure ◽  
Qing Paduano ◽  
Merle Hamilton ◽  
Jodie Shoaf ◽  
J. Matthew Mann

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