Does a Small Coke Taste Better? Effects of Package Size on Quality Judgment

How perception of package size changes influences consumer choice

PsycEXTRA Dataset ◽

10.1037/e621312012-013 ◽

2004 ◽

Author(s):

Michael Wiles

Keyword(s):

Consumer Choice ◽

Package Size

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Improved preparation of small coke

Metallurgist ◽

10.1007/bf00736068 ◽

1959 ◽

Vol 3 (3) ◽

pp. 93-94

Author(s):

V. V. Vinogradov

Keyword(s):

Small Coke

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Abstract MP54: Retail Soda Purchases Decrease And Water Purchases Increase After Six Years Of A Healthy Beverage Campaign

Circulation ◽

10.1161/circ.143.suppl_1.mp54 ◽

2021 ◽

Vol 143 (Suppl_1) ◽

Author(s):

Marlene B Schwartz ◽

Glenn E Schneider ◽

Ran Xu ◽

Yoon-Young Choi ◽

Abiodun Atoloye ◽

...

Keyword(s):

Matched Control ◽

Difference In Differences ◽

Sugary Drinks ◽

Sports Drinks ◽

Diet Soda ◽

Package Size ◽

Relevant Variables ◽

Carbonated Water ◽

Sugary Drink ◽

And Control

Introduction: Sugary drink consumption is a major risk factor for excess weight gain. In 2013, Howard County, MD launched a multi-component campaign to decrease sugary drink consumption. A previously published difference-in-differences (DID) analysis of supermarket retail beverage sales from 2012 (baseline) to 2015 documented a significant decrease in regular soda and fruit drinks sales in intervention stores compared to matched control stores. The present study extends this evaluation through 2018. Hypothesis: Sugary drink sales will continue to decrease and sales of non-sugary drinks will increase through 2018. Methods: Prior to the intervention, a retail sales tracking company identified a sample of supermarkets (N=15) in Howard County (Intervention stores) and assessed 52-weeks of top brand sales for each beverage category. These data were used to identify a set of matched Control stores (N=17) in an adjacent state. DID analyses were used to compare the weekly volume sales of each product (brand and package size) within each beverage category in the Intervention and Control stores from baseline (2012) to Year 6 (2018). Models were adjusted for relevant variables, including average price/ounce; average competitor price/ounce; and weekly local temperature. Results: DID analyses identified a significantly larger net decrease in average weekly volume sales of regular soda, fruit drinks, and 100% juice in the Intervention stores compared to the Control stores over six years (p < .001). See Figure for regular soda sales. After 2015, intervention stores also exhibited significant increases in sales of plain bottled water (p < .0001) and carbonated water (p < .001). In contrast, sports drinks, diet soda, and flavored waters did not consistently differ between conditions. Conclusion: A locally implemented, multi-component campaign reduced regular soda and fruit drink sales over six years. Additional efforts to reduce sales of sports drinks are warranted.

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The influence of price and promotion on package size propensity

American Journal of Business ◽

10.1108/ajb-10-2016-0032 ◽

2017 ◽

Vol 32 (2) ◽

pp. 93-103

Author(s):

Amit K. Ghosh

Keyword(s):

Decision Making ◽

Product Category ◽

Relative Price ◽

Grocery Stores ◽

Consumer Decision Making ◽

Content Type ◽

Household Level ◽

Packaged Goods ◽

Package Size ◽

The Impact

Purpose The constantly changing prices, promotions, and packaging options have made decision making more complex for consumers of packaged goods. The purpose of this paper is to explore how price and promotions influence consumer propensity to buy a certain package size. Design/methodology/approach Scanner panel data for shelf-stable salad dressing obtained from Information Resources Inc. were used to compute the proportion of large packages bought, the relative price paid for large packages, propensity to use various types of promotions, and a behavioral covariate for each household. Data of over 5,600 households were analyzed using a multiple regression analysis for hypothesis testing. Findings The positive nature of relationship between the relative price of large packages and the proportion of large packages bought demonstrates the suboptimal nature of consumer decision making. The inefficiency is partially attributable to the abundance of promotions, to consumers’ lack of price awareness, and to the use of heuristics by consumers. Also, consumers who are prone to use promotions such as displays and temporary price reductions tend to purchase larger packages. They are more likely to buy impulsively and base their decisions on heuristics. In contrast, consumers who are influenced by featured price cuts and who utilize coupons tend to purchase smaller packages. Research limitations/implications Data were obtained from grocery stores; only a single product category was studied. Practical implications Offer coupons and advertise featured price cuts on small packages to increase the sales of smaller packages. To move large packages successfully, retailers should rely more on in-store displays and temporary price reductions. Originality/value The impact of price and promotions on package size propensity has never been investigated. This study is also one of the few that uses a household-level analysis based on observable purchase data for consumer packaged goods.

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The Die Embedded and RDL structure on the high density substrate (i-THOP®) for mobile application

International Symposium on Microelectronics ◽

10.4071/isom-2016-tp11 ◽

2016 ◽

Vol 2016 (1) ◽

pp. 000001-000006

Author(s):

Masahiro Kyozuka ◽

Tatsuro Yoshida ◽

Noriyoshi Shimizu ◽

Koichi Tanaka ◽

Tetsuya Koyama

Keyword(s):

Mobile Devices ◽

Manufacturing Process ◽

Printed Circuit Board ◽

Semiconductor Device ◽

Current Trend ◽

High Density ◽

Circuit Board ◽

Fine Pitch ◽

Package Size ◽

Proper Material

Abstract The current trend in the electronics industry is one of increased computing performance, combined with a seemingly unending demand for portability and increased miniaturization; this is especially evident in the significant changes to the semiconductor device. To sustain the performance-improvement trend without increasing total cost, the partitioning of single die into a multi-chip architecture is widely studied in industry. These partitioned chips are then integrated into a single system-in-package (SiP). However, partitioning a single die into multiple split die causes two major challenges. The first is that it creates the need for very high density die to die interconnection. This interconnection is needed to provide enough routing density between the multiple die. Based on design studies, it believes that 2μm line and 2μm space is required in the package substrate. The second challenge is created by the increase in the overall die size. After partitioning the single die, each resulting smaller die must have its own I/O circuits, and effectively increases the total die area. This increase is a penalty, as mobile devices have a limited package size. When comparing a conventional package on package (PoP), the SiP requires a higher pin count with a finer pitch connection between the die and the memory. This finer pitch is needed to have enough I/Os, but within a limited package size to support mobile devices. To overcome these challenges, the structure of i-THOP® with POP pad, named “i-THOP® with Die embedded +ReDestribution Layer(RDL) structure”, has been developed. Herein, i-THOP® (integrated Thin film High density Organic Package) is a type of high-density substrate A key aspect to development of Die embedded +RDL is forming the multiple redistribution layers (RDL) over die and the fine pitch via connection. To achieve this, the proper material set was selected based on stress simulations and basic experiments. Regarding the manufacturing process, a conventional printed-circuit board (PCB) production line was used to minimize production cost. This article reports the manufacturing process and characteristics of the structure.

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Manual Assembly of 400um Bumped-Die GaN Power Semiconductor Devices

International Symposium on Microelectronics ◽

10.4071/isom-2012-poster_hale ◽

2012 ◽

Vol 2012 (1) ◽

pp. 000514-000523

Author(s):

Stephan W. Henning ◽

Luke Jenkins ◽

Sidni Hale ◽

Christopher G. Wilson ◽

John Tennant ◽

...

Keyword(s):

Semiconductor Devices ◽

Thermal Dissipation ◽

Single Digit ◽

Manual Assembly ◽

Power Semiconductors ◽

Power Semiconductor ◽

Residue Removal ◽

Power Semiconductor Devices ◽

Package Size ◽

The Cost

Until recently, power semiconductors were usually produced as TO, power-PAK, and D-PAK style packaging, due to die size, thermal dissipation requirements, and the vertical flow of current through the devices. The introduction of GaN to power semiconductors has allowed manufactures to produce devices with approximately 9% the footprint of similar rated D-PAK Si MOSFETs. In addition, GaN semiconductors have much better theoretical limits of specific on-resistance to breakdown voltage, when compared to Si and SiC. As of now, GaN devices offer very good performance at much less the cost of SiC, very small footprints, no reverse recovery losses of a body diode, very low RDS(ON), and very fast turn-on and turn-off times due to QGS in single-digit nC range. GaN semiconductors are expected to make vast improvements over the next decade. Unfortunately, this decrease in package size has made design prototyping significantly more challenging. Traditional manual solder iron assembly is not sufficient for these devices. Difficulties include board design, device handling, alignment, solder reflow, flux residue removal, and post-assembly inspection. The EPC 2014 and 2015 devices both have a 4mm pitch and are 1.85mm2 and 6.70mm2, respectively. In many situations, the decreased pitch and small overall size of these devices mandate the use of automated assembly equipment, such as a pick & place, to ensure quality and repeatability of assembly. However, this may not be feasible for initial prototyping, due to cost and time constraints. Here we will present a technique for manual assembly of these chip scale devices, applied specifically to the EPC 2014 and 2015. This should decrease the cost and turn time for prototype assembly when utilizing these types of chip scale packaged power semiconductor devices.

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