In Situ and Quantitative Characterization of Solid Electrolyte Interphases

Nano Letters ◽  
2014 ◽  
Vol 14 (3) ◽  
pp. 1405-1412 ◽  
Author(s):  
Arthur v. Cresce ◽  
Selena M. Russell ◽  
David R. Baker ◽  
Karen J. Gaskell ◽  
Kang Xu
Keyword(s):  
Solid Electrolyte ◽  
Quantitative Characterization

The use of Rheed Intensities for the Quantitative Characterization of Surfaces

1995 ◽  
Vol 399 ◽  
Author(s):  
Y. Ma ◽  
S. Lordi ◽  
J. A. Eades
Keyword(s):  
Quantitative Characterization ◽  
Important Method ◽  
Stepped Surfaces ◽  
Methods Of Calculation ◽  
Improved Methods

ABSTRACTRHEED is an important method for the in situ characterization of surfaces. Until recently, this characterization has not used the intensities of RHEED reflections. Improved methods of calculation have made it possible to simulate RHEED patterns from bulk-terminated, reconstructed and stepped surfaces. From the comparison between simulated and experimental patterns, it is now possible to refine the positions of atoms in surfaces and to determine the density of steps on surfaces (well almost).

Quantitative Characterization of Dislocation Structure coupled with Electromigration in a Passivated Al (0.5wt%Cu) Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
R.I. Barabash ◽  
N. Tamura ◽  
B.C. Valek ◽  
R. Spolenak ◽  
J.C. Bravman ◽  
...  
Keyword(s):  
Plastic Deformation ◽  
Dislocation Structure ◽  
Rotation Axis ◽  
Early Stage ◽  
Middle Region ◽  
Quantitative Characterization ◽  
X Ray ◽  
Interconnect Lines

AbstractNew synchrotron x-ray microbeam methodology is used to analyze and test the reliability of interconnects. The early stage of plastic deformation induced by electromigration before any damages become visible has been recently revealed by white beam scanning X-ray microdiffraction during an accelerated test on Al interconnect lines. In the present paper, we provide a quantitative analysis of the dislocation structure generated in several micron-sized Al grains in both the middle region and ends of the interconnect line during anin-situelectromigration experiment. We demonstrate that the evolution of the dislocation structure during electromigration is highly inhomogeneous and results in the formation of randomly distributed geometrically necessary dislocations as well as geometrically necessary boundaries. The orientation of the activated slip systems and rotation axis depends on the position of the grain in the interconnect line. The origin of the observed plastic deformation is considered in view of constraints for dislocation arrangements under applied electric field during electromigration. The coupling between plastic deformation and precipitation in the Al (0.5% wt. Cu) is observed for the grains close to the anode/cathode end of the line.

Preparation and in-situ characterization of well-defined solid electrolyte/electrode interfaces in thin-film lithium batteries

2016 ◽  
Vol 285 ◽  
pp. 118-121 ◽  
Author(s):  
Masakazu Haruta ◽  
Susumu Shiraki ◽  
Takeo Ohsawa ◽  
Tohru Suzuki ◽  
Akichika Kumatani ◽  
...  
Keyword(s):  
Thin Film ◽  
Solid Electrolyte ◽  
Lithium Batteries ◽  
In Situ Characterization

Isatin binding proteins in rat brain: In situ imaging, quantitative characterization of specific [3H]isatin binding, and proteomic profiling

2009 ◽  
Vol 87 (12) ◽  
pp. 2763-2772 ◽  
Author(s):  
Michele Crumeyrolle-Arias ◽  
Olga Buneeva ◽  
Victor Zgoda ◽  
Arthur Kopylov ◽  
Ana Cardona ◽  
...  
Keyword(s):  
Rat Brain ◽  
Binding Proteins ◽  
Proteomic Profiling ◽  
Quantitative Characterization ◽  
In Situ Imaging
Sign in / Sign up

Export Citation Format

Share Document