Remediation of Line Edge Roughness in Chemical Nanopatterns by the Directed Assembly of Overlying Block Copolymer Films

2010 ◽  
Vol 43 (5) ◽  
pp. 2334-2342 ◽  
Author(s):  
Mark P. Stoykovich ◽  
Kostas Ch. Daoulas ◽  
Marcus Müller ◽  
Huiman Kang ◽  
Juan J. de Pablo ◽  
...  
Keyword(s):  
Block Copolymer ◽  
Directed Assembly ◽  
Line Edge Roughness ◽  
Copolymer Films ◽  
Edge Roughness

scholarly journals Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography

2020 ◽  
Vol 32 (6) ◽  
pp. 2399-2407 ◽  
Author(s):  
Daniel F. Sunday ◽  
Xuanxuan Chen ◽  
Thomas R. Albrecht ◽  
Derek Nowak ◽  
Paulina Rincon Delgadillo ◽  
...  
Keyword(s):  
Block Copolymer ◽  
Line Edge Roughness ◽  
Edge Roughness ◽  
Block Copolymer Lithography ◽  
Copolymer Lithography

Ordering of Self-Assembled Nanodots Improved by Guide Pattern with Low Line Edge Roughness for 5 Tbit/in.2 Patterned Media

2013 ◽  
Vol 596 ◽  
pp. 78-82
Author(s):  
Takuya Komori ◽  
Miftakhul Huda ◽  
Takashi Akahane ◽  
Muneyasu Masuda ◽  
Jing Liu ◽  
...  
Keyword(s):  
Block Copolymer ◽  
High Resolution ◽  
Ammonium Hydroxide ◽  
Line Pattern ◽  
Line Edge Roughness ◽  
Patterned Media ◽  
Tetramethyl Ammonium Hydroxide ◽  
Edge Roughness ◽  
Nanodot Arrays ◽  
Self Assembled

We investigated the possibility of ordering of 12 nm pitced self-assembled nanodots from block copolymer (BCP) improved by the guide pattern with low line edge roughness (LER) for patterned media. We found that LER of the line pattern (σ-value) was reduced by using high-resolution salty development for HSQ resist line pattern fabrication compared with conventional tetramethyl ammonium hydroxide (TMAH) developer. By adopting this development technique to guide pattern fabrication, we demonstrated 10 rows of ordered self-assembled BCP nanodot arrays with a size of 6 nm and a pitch of 12 nm (5 Tbit/in.2) between the guide patterns.

Balanced Interfacial Interactions for Fluoroacrylic Block Copolymer Films and Fast Electric Field Directed Assembly

2020 ◽  
Vol 32 (22) ◽  
pp. 9633-9641
Author(s):  
Seongjun Jo ◽  
Seungbae Jeon ◽  
Hwiesoo Kim ◽  
Chang Y. Ryu ◽  
Seungwoo Lee ◽  
...  
Keyword(s):  
Block Copolymer ◽  
Electric Field ◽  
Directed Assembly ◽  
Interfacial Interactions ◽  
Copolymer Films

Rapid Directed Assembly of Block Copolymer Films at Elevated Temperatures

2008 ◽  
Vol 41 (8) ◽  
pp. 2759-2761 ◽  
Author(s):  
Adam M. Welander ◽  
Huiman Kang ◽  
Karl O. Stuen ◽  
Harun H. Solak ◽  
Marcus Müller ◽  
...  
Keyword(s):  
Block Copolymer ◽  
Elevated Temperatures ◽  
Directed Assembly ◽  
Copolymer Films

Three-dimensional line edge roughness in pre- and post-dry etch line and space patterns of block copolymer lithography

2020 ◽  
Vol 22 (2) ◽  
pp. 478-488
Author(s):  
Shubham Pinge ◽  
Yufeng Qiu ◽  
Victor Monreal ◽  
Durairaj Baskaran ◽  
Abhaiguru Ravirajan ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Block Copolymer ◽  
Large Scale ◽  
Three Dimensional ◽  
Coarse Grained ◽  
Line Edge Roughness ◽  
Edge Roughness ◽  
Dry Etch ◽  
Block Copolymer Lithography ◽  
Symmetric Block

In this work, we employ large-scale coarse-grained molecular dynamics (CGMD) simulations to study the three-dimensional line edge roughness associated with line and space patterns of chemo-epitaxially directed symmetric block copolymers.

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