Mitigation of line edge roughness and line width roughness in block copolymer directed self-assembly through polymer composition molecular weight manipulation

Author(s):  
Jakin B. Delony ◽  
Peter J. Ludovice ◽  
Clifford L. Henderson
2017 ◽  
Vol 53 (36) ◽  
pp. 5005-5008 ◽  
Author(s):  
Xiao-Li Sun ◽  
Dong-Ming Liu ◽  
Pan Wang ◽  
Jia-Lin Tan ◽  
Kang-Kang Li ◽  
...  

Clews of tubules are reported via block copolymer self-assembly of P4VP-b-PS with both high asymmetry and very high molecular weight.


Nanomaterials ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 2443
Author(s):  
Tommaso Giammaria ◽  
Ahmed Gharbi ◽  
Anne Paquet ◽  
Paul Nealey ◽  
Raluca Tiron

This work reports a novel, simple, and resist-free chemo-epitaxy process permitting the directed self-assembly (DSA) of lamella polystyrene-block-polymethylmethacrylate (PS-b-PMMA) block copolymers (BCPs) on a 300 mm wafer. 193i lithography is used to manufacture topographical guiding silicon oxide line/space patterns. The critical dimension (CD) of the silicon oxide line obtained can be easily trimmed by means of wet or dry etching: it allows a good control of the CD that permits finely tuning the guideline and the background dimensions. The chemical pattern that permits the DSA of the BCP is formed by a polystyrene (PS) guide and brush layers obtained with the grafting of the neutral layer polystyrene-random-polymethylmethacrylate (PS-r-PMMA). Moreover, data regarding the line edge roughness (LER) and line width roughness (LWR) are discussed with reference to the literature and to the stringent requirements of semiconductor technology.


2016 ◽  
Vol 6 (1) ◽  
Author(s):  
Sungmin Park ◽  
Yeongsik Kim ◽  
Hyungju Ahn ◽  
Jong Hak Kim ◽  
Pil J. Yoo ◽  
...  

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