Dynamical Simulations of Coarse Grain Polymeric Systems: Rouse and Entangled Dynamics

2013 ◽  
Vol 46 (15) ◽  
pp. 6287-6299 ◽  
Author(s):  
Abelardo Ramírez-Hernández ◽  
François A. Detcheverry ◽  
Brandon L. Peters ◽  
Verónica C. Chappa ◽  
Kenneth S. Schweizer ◽  
...  
Keyword(s):  
Coarse Grain ◽  
Polymeric Systems ◽  
Dynamical Simulations

Theoretically informed coarse grain simulations of polymeric systems

2009 ◽  
Vol 131 (8) ◽  
pp. 084903 ◽  
Author(s):  
Darin Q. Pike ◽  
François A. Detcheverry ◽  
Marcus Müller ◽  
Juan J. de Pablo
Keyword(s):  
Coarse Grain ◽  
Polymeric Systems

Simulations of theoretically informed coarse grain models of polymeric systems

2010 ◽  
Vol 144 ◽  
pp. 111-125 ◽  
Author(s):  
François A. Detcheverry ◽  
Darin Q. Pike ◽  
Paul F. Nealey ◽  
Marcus Müller ◽  
Juan J. de Pablo
Keyword(s):  
Coarse Grain ◽  
Polymeric Systems

Monte Carlo Simulation of Coarse Grain Polymeric Systems

2009 ◽  
Vol 102 (19) ◽  
Author(s):  
François A. Detcheverry ◽  
Darin Q. Pike ◽  
Paul F. Nealey ◽  
Marcus Müller ◽  
Juan J. de Pablo
Keyword(s):  
Monte Carlo Simulation ◽  
Monte Carlo ◽  
Coarse Grain ◽  
Polymeric Systems

Coherent electron nanodiffraction from clean silver nano particles in a UHV STEM

1993 ◽  
Vol 51 ◽  
pp. 1058-1059
Author(s):  
J. Liu ◽  
M. Pan ◽  
G. E. Spinnler
Keyword(s):  
Supported Catalysts ◽  
Imaging Techniques ◽  
Nano Particles ◽  
Metal Particles ◽  
Shape Structure ◽  
Dynamical Simulations ◽  
Small Metal Particles ◽  
Extract Information

Small metal particles have peculiar chemical and physical properties as compared to bulk materials. They are especially important in catalysis since metal particles are common constituents of supported catalysts. The structural characterization of small particles is of primary importance for the understanding of structure-catalytic activity relationships. The shape and size of metal particles larger than approximately 5 nm in diameter can be determined by several imaging techniques. It is difficult, however, to deduce the shape of smaller metal particles. Coherent electron nanodiffraction (CEND) patterns from nano particles contain information about the particle size, shape, structure and defects etc. As part of an on-going program of STEM characterization of supported catalysts we report some preliminary results of CEND study of Ag nano particles, deposited in situ in a UHV STEM instrument, and compare the experimental results with full dynamical simulations in order to extract information about the shape of Ag nano particles.

Coarse grain parallelization and acceleration of biochemical ODE simulation using GPGPU

2014 ◽  
Vol 1 ◽  
pp. 29-32
Author(s):  
Kazushige Nakamura ◽  
Kei Sumiyoshi ◽  
Noriko Hiroi ◽  
Akira Funahashi
Keyword(s):  
Coarse Grain

Novel organic, polymeric materials for electronics applications

2002 ◽  
Vol 722 ◽  
Author(s):  
Ram W. Sabnis ◽  
Mary J. Spencer ◽  
Douglas J. Guerrero
Keyword(s):  
Optical Density ◽  
Chemical Vapor ◽  
Polymeric Materials ◽  
Substantial Improvement ◽  
Polymeric Systems ◽  
Patterned Wafers ◽  
Visible Spectra ◽  
Potential Applications ◽  
Deep Ultraviolet ◽  
Deposited Films

AbstractNovel organic, polymeric materials and processes of depositing thin films on electronics substrates by chemical vapor deposition (CVD) have been developed and the lithographic behavior of photoresist coated over these CVD films at deep ultraviolet (DUV) wavelength has been evaluated. The specific monomers synthesized for DUV applications include [2.2](1,4)- naphthalenophane, [2.2](9,10)-anthracenophane and their derivatives which showed remarkable film uniformity on flat wafers and conformality over structured topography wafers, upon polymerization by CVD. The chemical, physical and optical properties of the deposited films have been characterized by measuring parameters such as thickness uniformity, solubility, conformality, adhesion to semiconductor substrates, ultraviolet-visible spectra, optical density, optical constants, defectivity, and resist compatibility. Scanning electron microscope (SEM) photos of cross-sectioned patterned wafers showed verticle profiles with no footing, standing waves or undercut. Resist profiles down to 0.10 νm dense lines and 0.09 νm isolated lines were achieved in initial tests. CVD coatings generated 96-100% conformal films, which is a substantial improvement over commercial spin-on polymeric systems. The light absorbing layers have high optical density at 248 nm and are therefore capable materials for DUV lithography applications. CVD is a potentially useful technology to extend lithography for sub-0.15 νm devices. These films have potential applications in microelectronics, optoelectronics and photonics.

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