Designing a Photoresponsive Molecularly Imprinted System on a Silicon Wafer Substrate Surface

Langmuir ◽  
2013 ◽  
Vol 29 (26) ◽  
pp. 8311-8319 ◽  
Author(s):  
Dongsheng Wang ◽  
Danyang Xie ◽  
Wenbin Shi ◽  
Shudong Sun ◽  
Changsheng Zhao
Keyword(s):  
Silicon Wafer ◽  
Substrate Surface ◽  
Molecularly Imprinted ◽  
Wafer Substrate

Synthesis, Film Morphology and Performance of a Functional Polysiloxane Containing Polyether, Epoxy and Trifluoropropyl Side Groups

2011 ◽  
Vol 480-481 ◽  
pp. 624-628
Author(s):  
Wei Xu ◽  
Qiu Feng An ◽  
Wei Xu
Keyword(s):  
Silicon Wafer ◽  
Molecular Orientation ◽  
Substrate Surface ◽  
Proton Nuclear Magnetic Resonance ◽  
Film Morphology ◽  
Water Contact ◽  
Atomic Force ◽  
Wafer Substrate ◽  
Finishing Agent ◽  
And Performance

A novel polysiloxane (PSA-PFMS) fabric finishing agent, bearing pendant stearyl acrylate, polyether, epoxy and trifluoropropyl side groups, etc., was synthesized by hydrosilylation of polytrifluoropropylhydromethylsiloxane (PFHMS), stearyl acrylate (SA), allylpolyoxyethylene ether (PEO) and allylglyeidyl ether (AGE). The chemical structure of PSA-PFMS was characterized by infrared spectrum (IR) and proton nuclear magnetic resonance (1H NMR). Film morphology and molecular orientation of PSA-PFMS on silicon wafer substrate surface were observed by atomic force microscope (AFM). Results show that PSA-PFMS can form an inhomogeneous and hydrophobic polysiloxane film with rough, scraggly and microscopic phase separation structures. All of these suggest that the molecular orientation of PSA-PFMS is in such a manner that the stearyl acrylate groups, trifluoropropyl and silicon methyl groups project outward into air, while polyether and Si-O dipole bonds point to the silicon wafer substrate surface. Owing to this highly rough and microscopic phase-separated hydrophobic film and its tight link with fabric, the treated fabrics are altered from hydrophile to hydrophobe with water contact angle of 129.2° and possess favorable washing endurance with WCA of 106.7° after 20 times of standard soaping procedure.

Light-Patterned and Recognition-Directed Adsorption of Nanoparticles at a Silicon Wafer Substrate

Nano Letters ◽  
2004 ◽  
Vol 4 (4) ◽  
pp. 573-575 ◽  
Author(s):  
Declan Ryan ◽  
Lorraine Nagle ◽  
Donald Fitzmaurice
Keyword(s):  
Silicon Wafer ◽  
Wafer Substrate

Fabrication of Eyeball-Like Spherical Micro-Lens Array for Optical Fiber Coupling

2009 ◽  
Author(s):  
S. C. Shen ◽  
C. T. Pan ◽  
R. F. Shyu ◽  
C. H. Chao ◽  
J. C. Huang ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Substrate Surface ◽  
Coupling Efficiency ◽  
Numerical Aperture ◽  
Spherical Geometry ◽  
Single Mode ◽  
Batch Process ◽  
Optical Measurements ◽  
Lens Array ◽  
Micro Lens

Batch-fabrication of eyeball-like spherical micro-lens not only reduces micro assembly cost, but also replaces conventional ball-lenses or costly GRINs (Gradient Reflective Index) without sacrificing performance. Compared to the conventional micro-lenses made in a half-spherical geometry, the eyeball-like micro-lens is a sphere, which allows focusing light in all directions on the substrate surface, thus providing application flexibility for optical applications. The current eyeball-like spherical micro-lens is made using photoresist SU-8. This work develops a batch process at low temperature by spin-coating SU-8 on a surface of silicon wafer. The SU-8 thick film is patterned by UV lithography to form an array of holes for holding eyeball-like spherical micro-lens. The fabrication process employs bulk micromachining to fabricate an array of nozzles on the silicon wafer. Next, this process pours viscous SU-8 into the cavity of silicon wafer and presses it through the nozzle before reflow. The eyeball-like spherical micro-balls form by balancing between surface tension and cohesion. Varying the amount of SU-8 pressed through the nozzle controls the diameter of the balls. This paper designs a pattern with a 3 × 3 lens-array with a numerical aperture of about 0.38. Diameters range from 60 to 500 um. Optical measurements indicate a diameter fluctuation within 3% and an optical insertion loss is below 2.5dB with a wavelength of 635nm in a single-mode fiber (SMF). Therefore the eyeball-like spherical micro-lens is capable of increasing coupling efficiency.

scholarly journals Energy Dissipation and the High-Strain Rate Dynamic Response of Vertically Aligned Carbon Nanotube Ensembles Grown on Silicon Wafer Substrate

2013 ◽  
Vol 2013 ◽  
pp. 1-7 ◽  
Author(s):  
P. Raju Mantena ◽  
Tezeswi Tadepalli ◽  
Brahmananda Pramanik ◽  
Veera M. Boddu ◽  
Matthew W. Brenner ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
High Strain Rate ◽  
Strain Rate ◽  
Silicon Wafer ◽  
High Strain ◽  
Flexural Rigidity ◽  
Functionally Graded ◽  
Dynamic Mechanical ◽  
Wafer Substrate ◽  
Vertically Aligned

The dynamic mechanical behavior and high-strain rate response characteristics of a functionally graded material (FGM) system consisting of vertically aligned carbon nanotube ensembles grown on silicon wafer substrate (VACNT-Si) are presented. Flexural rigidity (storage modulus) and loss factor (damping) were measured with a dynamic mechanical analyzer in an oscillatory three-point bending mode. It was found that the functionally graded VACNT-Si exhibited significantly higher damping without sacrificing flexural rigidity. A Split-Hopkinson pressure bar (SHPB) was used for determining the system response under high-strain rate compressive loading. Combination of a soft and flexible VACNT forest layer over the hard silicon substrate presented novel challenges for SHPB testing. It was observed that VACNT-Si specimens showed a large increase in the specific energy absorption over a pure Si wafer.

Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer

2013 ◽  
Vol 275-277 ◽  
pp. 2290-2294
Author(s):  
Wei Ping Yang ◽  
Yong Bo Wu ◽  
Jun Liu
Keyword(s):  
Surface Quality ◽  
Silicon Wafer ◽  
Ultrasonic Vibration ◽  
Substrate Surface ◽  
High Surface ◽  
Machining Process ◽  
Hybrid Technique ◽  
Mechanical Grinding ◽  
Vibration Assistance ◽  
Profile Accuracy

For the final finishing of the substrate surface, Chemo-mechanical polishing (CMP) is often utilized. Those processes are able to offer a great sur-face roughness, but sacrifice profile accuracy. On the other hand, Chemo-mechanical grinding (CMG) is potentially emerging defect-free machining process which combines the advantages of CMP. In order to simultaneously achieve high surface quality and high profile accuracy, CMG process has been applied into machining of large size quartz glass substrates for photomask use. In this paper, based on the characteristics of higher machining efficiency and higher surface quality of ultrasonic vibration machining, a new ultrasonic vibration assisted CMG of silicon wafer hybrid technique is achieved by designing elliptical vibrator with longitudinal mode and bending mode. The experimental results show that under the elliptic ultrasonic vibration assistance, the surface roughness is decreased significantly, the surface quality is improved obviously, and moreover caused little or even doesn’t lead to the surface damage.

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