Use of Differential Scanning Calorimetry (DSC) as a New Technique for Detection of Adulteration in Honeys. 1. Study of Adulteration Effect on Honey Thermal Behavior

2002 ◽  
Vol 50 (1) ◽  
pp. 203-208 ◽  
Author(s):  
Christophe Cordella ◽  
Jean-François Antinelli ◽  
Clément Aurieres ◽  
Jean-Paul Faucon ◽  
Daniel Cabrol-Bass ◽  
...  
Keyword(s):  
Differential Scanning Calorimetry ◽  
Thermal Behavior ◽  
New Technique ◽  
Scanning Calorimetry ◽  
A New Technique

Differential Scanning Calorimetry: A New Technique To Characterize Hydrate Formation in Drilling Muds

SPE Journal ◽  
2002 ◽  
Vol 7 (02) ◽  
pp. 196-202 ◽  
Author(s):  
Didier Dalmazzone ◽  
Christine Dalmazzone ◽  
Benjamin Herzhaft
Keyword(s):  
Differential Scanning Calorimetry ◽  
Hydrate Formation ◽  
New Technique ◽  
Scanning Calorimetry ◽  
A New Technique ◽  
Drilling Muds

Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder

2018 ◽  
Vol 30 (4) ◽  
pp. 233-240 ◽  
Author(s):  
Md Hasnine
Keyword(s):  
Differential Scanning Calorimetry ◽  
Melting Point ◽  
Thermal Behavior ◽  
Surface Finish ◽  
Design Methodology ◽  
Solder Alloys ◽  
Scanning Calorimetry ◽  
Content Type ◽  
Cu Substrate ◽  
Free Solder

Purpose This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) solder alloys. Design/methodology/approach The thermal behavior of the Pb-free solder alloys was studied using differential scanning calorimetry. Wetting balance experiments were performed in accordance with the IPC standard, IPC-TM-650 and at a temperature of 260°C. Also, a solder spread test was performed on a Cu surface finish using the JIS-Z-3197 solderability standard. Findings It is shown that among the selected Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) alloys, Sn-3.5Ag-1.5In-1Sb showed the lowest melting point and the lowest undercooling temperature. The best wettability was achieved when the In and Sb contents were approximately 1.5 and 1.0 Wt.%, respectively. The effect of the combined addition of In and Sb on solder spreadability on a Cu substrate was also demonstrated. Originality/value It was found that adding approximately 1.5 and 1.0 Wt.% of In and Sb, respectively, in Sn-3.5Ag solder provided the best wetting performance and improved the solder spreadability.

scholarly journals Thermal stability of Sn anode material with non-aqueous electrolytes in sodium-ion batteries

2018 ◽  
Vol 6 (41) ◽  
pp. 20383-20392 ◽  
Author(s):  
Yongho Lee ◽  
Hyojun Lim ◽  
Sang-Ok Kim ◽  
Hyung-Seok Kim ◽  
Ki Jae Kim ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Differential Scanning Calorimetry ◽  
Thermal Behavior ◽  
Anode Material ◽  
Sodium Ion ◽  
Aqueous Electrolytes ◽  
Sodium Ion Batteries ◽  
Scanning Calorimetry ◽  
Sn Anode ◽  
Thermal Stability Of

The thermal behavior of fully lithiated and sodiated Sn electrodes cycled in a MePF6 (Me = Li or Na)-based electrolyte was studied using differential scanning calorimetry (DSC).

Characterization of Thermal Behavior of Epoxy Composites Reinforced With Curaua Fibers by Differential Scanning Calorimetry

2016 ◽  
pp. 403-407
Author(s):  
A. Barcelos Mariana ◽  
D. Ribeiro Carolina Gomes ◽  
Jordana Ferreira ◽  
S. Vieira Janaina da ◽  
M. Margem Frederico ◽  
...  
Keyword(s):  
Differential Scanning Calorimetry ◽  
Thermal Behavior ◽  
Epoxy Composites ◽  
Scanning Calorimetry ◽  
Curaua Fibers

Thermal Behavior of Epoxy Resins Cured with an Amine-Containing, Thermoplastic Poly(arylene Ether Sulphone)

1999 ◽  
Vol 19 (3) ◽  
pp. 161-174 ◽  
Author(s):  
Oriana Motta ◽  
Antonino Rocca ◽  
Valentina Siracusa ◽  
Domenico Acierno
Keyword(s):  
Differential Scanning Calorimetry ◽  
Thermal Behavior ◽  
Kinetic Parameters ◽  
Epoxy Resins ◽  
Curing Agent ◽  
Cure Process ◽  
Scanning Calorimetry ◽  
Arylene Ether ◽  
Diaminodiphenyl Methane ◽  
Residual Heat

Abstract In this paper we carried out the crosslinking of the tetraglycidyl-4,4′- diaminodiphenyl methane epoxy resin by using a reactive poly(arylene ether sulphone) as curing agent. Differential scanning calorimetry was used to derive the kinetic parameters of the reactions involved in the cure process and to evaluate the extent of the reaction as a function of time by measuring the total (ΔHr) and the residual heat(ΔHresid) of the resin at different curing times. A comparatively slower reaction was found to take place when the resin was cured with the poly(arylene ether sulphone) that when it was cured with the conventional curing agent 4,4′-diaminodiphenyl sulphone.

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