scholarly journals Investigating the Thermal Behavior of Polymers by Modulated Differential Scanning Calorimetry (MDSC) – A Review

2020 ◽  
Author(s):  
Natasha Claire Story
2018 ◽  
Vol 30 (4) ◽  
pp. 233-240 ◽  
Author(s):  
Md Hasnine

Purpose This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) solder alloys. Design/methodology/approach The thermal behavior of the Pb-free solder alloys was studied using differential scanning calorimetry. Wetting balance experiments were performed in accordance with the IPC standard, IPC-TM-650 and at a temperature of 260°C. Also, a solder spread test was performed on a Cu surface finish using the JIS-Z-3197 solderability standard. Findings It is shown that among the selected Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) alloys, Sn-3.5Ag-1.5In-1Sb showed the lowest melting point and the lowest undercooling temperature. The best wettability was achieved when the In and Sb contents were approximately 1.5 and 1.0 Wt.%, respectively. The effect of the combined addition of In and Sb on solder spreadability on a Cu substrate was also demonstrated. Originality/value It was found that adding approximately 1.5 and 1.0 Wt.% of In and Sb, respectively, in Sn-3.5Ag solder provided the best wetting performance and improved the solder spreadability.


2018 ◽  
Vol 6 (41) ◽  
pp. 20383-20392 ◽  
Author(s):  
Yongho Lee ◽  
Hyojun Lim ◽  
Sang-Ok Kim ◽  
Hyung-Seok Kim ◽  
Ki Jae Kim ◽  
...  

The thermal behavior of fully lithiated and sodiated Sn electrodes cycled in a MePF6 (Me = Li or Na)-based electrolyte was studied using differential scanning calorimetry (DSC).


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