Passivation of InGaAs(001)-(2 × 4) by Self-Limiting Chemical Vapor Deposition of a Silicon Hydride Control Layer

2015 ◽  
Vol 137 (26) ◽  
pp. 8526-8533 ◽  
Author(s):  
Mary Edmonds ◽  
Tyler Kent ◽  
Evgueni Chagarov ◽  
Kasra Sardashti ◽  
Ravi Droopad ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon Hydride ◽  
Control Layer

Laser Optogalvanic Monitoring of SiH in a Chemical Vapor Deposition Glow Discharge

1986 ◽  
Vol 40 (4) ◽  
pp. 494-497 ◽  
Author(s):  
William G. Tong ◽  
Robert W. Shaw
Keyword(s):  
Chemical Vapor Deposition ◽  
Glow Discharge ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Silicon Hydride ◽  
Commercial Preparation ◽  
X Ray ◽  
Discharge Cell ◽  
Hydrogenated Amorphous ◽  
Absorption Technique

A demountable hollow cathode discharge cell that is useful for studies of plasmas relevant to chemical vapor deposition (CVD) was assembled and demonstrated. Direct current glow discharge decomposition of 10% silane in helium in this cell at 20 Torr produced silicon-containing cathodic thin films that were subsequently examined with the use of Raman and x-ray fluorescence spectroscopy. A pulsed dye laser-excited optogalvanic detection technique was used to monitor the presence of a transient molecular intermediate—silicon hydride—in this decomposition plasma. An optogalvanic spectrum of the SiH A2δ -X2τ transition near 420 nm is presented. This electronic absorption technique complements other spectroscopic methods for mechanistic studies and optimization of glow discharge CVD plasmas that are currently used for the commercial preparation of technologically important thin film materials such as hydrogenated amorphous silicon. It will be particularly useful for detection of nonluminescent plasma intermediates.

In situ study of electron beam-induced chemical vapor deposition of Au in an environmental TEM

1995 ◽  
Vol 53 ◽  
pp. 256-257
Author(s):  
J. Drucker ◽  
R. Sharma ◽  
J. Kouvetakis ◽  
K.H.J. Weiss
Keyword(s):  
Electron Beam ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Quantum Effect ◽  
Line Drawing ◽  
Chemical Vapor ◽  
Environmental Cell ◽  
Engineering Changes ◽  
Kinetics Of

Patterning of metals is a key element in the fabrication of integrated microelectronics. For circuit repair and engineering changes constructive lithography, writing techniques, based on electron, ion or photon beam-induced decomposition of precursor molecule and its deposition on top of a structure have gained wide acceptance Recently, scanning probe techniques have been used for line drawing and wire growth of W on a silicon substrate for quantum effect devices. The kinetics of electron beam induced W deposition from WF6 gas has been studied by adsorbing the gas on SiO2 surface and measuring the growth in a TEM for various exposure times. Our environmental cell allows us to control not only electron exposure time but also the gas pressure flow and the temperature. We have studied the growth kinetics of Au Chemical vapor deposition (CVD), in situ, at different temperatures with/without the electron beam on highly clean Si surfaces in an environmental cell fitted inside a TEM column.

The relaxation of compressive biaxial strains in SOS via microtwins

1989 ◽  
Vol 47 ◽  
pp. 608-609
Author(s):  
M. E. Twigg ◽  
E. D. Richmond ◽  
J. G. Pellegrino
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Molecular Beam Epitaxy ◽  
Compressive Stress ◽  
Vapor Deposition ◽  
Partial Dislocation ◽  
Molecular Beam ◽  
Volume Fraction ◽  
Chemical Vapor ◽  
Silicon Thin Film

For heteroepitaxial systems, such as silicon on sapphire (SOS), microtwins occur in significant numbers and are thought to contribute to strain relief in the silicon thin film. The size of this contribution can be assessed from TEM measurements, of the differential volume fraction of microtwins, dV/dν (the derivative of the microtwin volume V with respect to the film volume ν), for SOS grown by both chemical vapor deposition (CVD) and molecular beam epitaxy (MBE).In a (001) silicon thin film subjected to compressive stress along the [100] axis , this stress can be relieved by four twinning systems: a/6[211]/( lll), a/6(21l]/(l1l), a/6[21l] /( l1l), and a/6(2ll)/(1ll).3 For the a/6[211]/(1ll) system, the glide of a single a/6[2ll] twinning partial dislocation draws the two halves of the crystal, separated by the microtwin, closer together by a/3.

Coating of continuous carbon fibers with double layers by chemical vapor deposition

2001 ◽  
Vol 11 (PR3) ◽  
pp. Pr3-885-Pr3-892 ◽  
Author(s):  
N. Popovska ◽  
S. Schmidt ◽  
E. Edelmann ◽  
V. K. Wunder ◽  
H. Gerhard ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Carbon Fibers ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Double Layers
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