The Reaction of Zinc with Copper Sulfate in Aqueous Solution

1939 ◽  
Vol 61 (7) ◽  
pp. 1798-1804 ◽  
Author(s):  
F. W. van. Straten ◽  
W. F. Ehret
Keyword(s):  
Aqueous Solution ◽  
Copper Sulfate

scholarly journals Molluscicide activity of the "Avelós" plant (Euphorbia tirucalli, L. ) on Biomphalaria glabrata, the mollusc vector of schistosomiasis

1985 ◽  
Vol 80 (4) ◽  
pp. 423-427 ◽  
Author(s):  
Pedro Jurberg ◽  
Januário Bispo Cabral Neto ◽  
Virgínia T. Schall
Keyword(s):  
Aqueous Solution ◽  
Copper Sulfate ◽  
Active Substance ◽  
Simple Procedure ◽  
Biomphalaria Glabrata ◽  
Wide Distribution ◽  
Euphorbia Tirucalli ◽  
Promising Agent

An aqueous solution of the latex of Euphorbia tirucalli collected at sites receiving large amounts of sunlight showed molluscicide action on Biomphalaria glabrata, with LD50 obtained at the concentration of 28,0 ppm and LD90 at the concentration of 85,0 ppm. The toxicity of the product for fish was similar to that of Bayluscide and of copper sulfate used for comparison. However, the wide distribution of the plant, its easy propagation and the simple procedure for extraction of the active substance, which is biodegradable, favor "avelós" as a promising agent in the control of schistosomiasis.

Circuit Pattern cu Deposition on Polyimide Surface Using ArF Excimer Laser

1998 ◽  
Vol 546 ◽  
Author(s):  
M. Tomita ◽  
M. Murahara
Keyword(s):  
Thin Film ◽  
Aqueous Solution ◽  
Excimer Laser ◽  
Copper Sulfate ◽  
Electroless Plating ◽  
Atmospheric Pressure ◽  
Hydrogen Atoms ◽  
Arf Excimer Laser ◽  
Cu Thin Film ◽  
Copper Substitution

AbstractCircuit patterned nucleation of copper atoms onto polyimide surface was demonstrated by using ArF excimer laser (λ =193nm) and copper sulfate aqueous solution at an atmospheric pressure. Photo-excited C-H bonds of the polyimide surface were effectively dehydrated with hydrogen atoms which were photodissociated from the water. The dangling bonds of the dehydrated hydrogen atoms were combined with the oxygen and the copper atoms which were photodissociated by copper-sulfate aqueous solution. Thus, C-O-Cu bonds were formed on the surface. After this copper substitution, it was carried out onto the nucleated parts by usual electroless plating at 70°C. In this process, the conductive circuit pattern Cu thin film was deposited on polyimide surface.

Velocity and Morphology Transition in Dendritic Growth

1991 ◽  
Vol 237 ◽  
Author(s):  
E. Raz ◽  
A. Chait
Keyword(s):  
Aqueous Solution ◽  
Transition Temperature ◽  
Copper Sulfate ◽  
Growth Velocity ◽  
Dendritic Growth ◽  
Equilibrium Temperature ◽  
Growth Direction ◽  
Interface Temperature ◽  
Sulfate Concentration ◽  
Shape Changes

ABSTRACTThe growth velocity and morphology of crystals growing in a supercooled aqueous solution of ammonium chloride (28 wt%) with small amounts of copper sulfate (0.05 to-1 wt%) have been examined. For the [100] growth direction at low supercooling and for the [110] direction at greater supercooling the crystals start to grow slowly with a faceted interface. As the supercooling is continuously increased, the growth direction becomes [111]. Dendrites with pointed tips develop but continue to grow slowly. With further increase in supercooling, the velocity increases 20- to 40-fold and the tip shape changes from a cusp to a thin and almost paraboloid interface while the growth direction remains [111]. The velocity transition is gradual when the concentration is below 0.1 wt% but is sharper at higher concentrations. The transition temperature decreases with increasing copper sulfate concentration.We postulate that the observed transition indicates a dynamic roughening phenomenon, where the supercooling; is sufficiently high to create many nucleation islands on the faceted interface. In this case the interface behaves as an atomically rough surface and dendrite growth occurs at an interface temperature that is below the equilibrium temperature.

Quenching characteristics of bathocuproinedisulfonic acid, disodium salt in aqueous solution and copper sulfate plating solution

2018 ◽  
Vol 57 (4S) ◽  
pp. 04FL04 ◽  
Author(s):  
Toshiaki Koga ◽  
Chieko Hirakawa ◽  
Michinori Takeshita ◽  
Nao Terasaki
Keyword(s):  
Aqueous Solution ◽  
Copper Sulfate ◽  
Disodium Salt ◽  
Plating Solution

Growth of Metal Nucleus on Polyimide Surface with Photochemical Reaction

1999 ◽  
Vol 585 ◽  
Author(s):  
M. Tomita ◽  
M. Murahara
Keyword(s):  
Thin Film ◽  
Aqueous Solution ◽  
Excimer Laser ◽  
Copper Sulfate ◽  
Electroless Plating ◽  
Atmospheric Pressure ◽  
Photochemical Reaction ◽  
Nickel Sulfate ◽  
Hydrogen Atoms ◽  
Arf Excimer Laser

AbstractCircuit patterned nucleation of copper or nickel atoms onto polyimide surface was demonstrated by using ArF excimer laser (λ=193nm) and copper sulfate aqueous solution (CuSO4.5H2O+nH2O), or nickel sulfate aqueous solution (NiSO4–6H2O+nH2O) in an atmospheric pressure. Photo-excited C-H bonds of the polyimide surface were effectively dehydrated with hydrogen atoms which were photodissociated from the water. The dangling bonds of the dehydrated hydrogen atoms were combined with the oxygen and the copper or nickel atoms that were photodissociated by CuSO4 solution or NiSO4 solution. Thus, C-O-Cu bonds or C-O-Ni bonds were formed on the surface. After this copper and nickel substitution, it was carried out onto the nucleated parts by usual electroless plating at 70 °C. In this process, the conductive circuit patterned copper or nickel thin film was deposited on polyimide surface.

Removal of copper sulfate from aqueous solution by air-gap membrane distillation process

2018 ◽  
Vol 73 (3) ◽  
pp. 543-554
Author(s):  
Chao-Huan Yang ◽  
Ya-Jing Zhao ◽  
Lan Cheng ◽  
Ping-Li Li ◽  
Ying-Dong Li ◽  
...  
Keyword(s):  
Aqueous Solution ◽  
Copper Sulfate ◽  
Membrane Distillation ◽  
Air Gap ◽  
Distillation Process ◽  
Air Gap Membrane Distillation

Magnetic Field Effects on Copper Metal Deposition from Copper Sulfate Aqueous Solution

2014 ◽  
Vol 118 (18) ◽  
pp. 4889-4894 ◽  
Author(s):  
Chikako Udagawa ◽  
Aya Maeda ◽  
Akio Katsuki ◽  
Syou Maki ◽  
Shotaro Morimoto ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Aqueous Solution ◽  
Copper Sulfate ◽  
Metal Deposition ◽  
Magnetic Field Effects ◽  
Copper Metal ◽  
Field Effects
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