Ion-Solvent Interaction. The Interactions of Some Amines with Tertiary Ammonium Salts in Low Dielectric Solvents

1964 ◽  
Vol 86 (22) ◽  
pp. 4783-4791 ◽  
Author(s):  
Earl K. Ralph ◽  
W. R. Gilkerson
Keyword(s):  
Ammonium Salts ◽  
Solvent Interaction ◽  
Low Dielectric

The solubility of water in low-dielectric solvents

1976 ◽  
Vol 54 (24) ◽  
pp. 3909-3916 ◽  
Author(s):  
Jitka Kirchnerová ◽  
Genille C. B. Cave
Keyword(s):  
Formation Constants ◽  
Solvent Interaction ◽  
Low Dielectric ◽  
Polar Species ◽  
Nonpolar Solvents ◽  
Water Solvent ◽  
Species Formation ◽  
Dispersion Component ◽  
Benzene Toluene ◽  
Polar Interactions

The solubility of water has been measured in several low-dielectric solvents at 25 °C, and the values in the nonpolar solvents are treated by using a modification of the Scatchard–Hildebrand equation. The water–solvent interaction parameter in this equation is represented by a new relationship involving the separate contributions due to dispersion and polar interactions. A new method is given for calculation of the dispersion component of the solubility parameter of a polar species. Formation constants are reported for 1:1 water–solvent complexes in carbon tetrachloride, benzene, toluene, and p-xylene.

Modification of Low ĸ Materials for ULSI Multilevel Interconnects by Ion Implantation

2002 ◽  
Vol 716 ◽  
Author(s):  
Alok Nandini ◽  
U. Roy ◽  
A. Mallikarjunan ◽  
A. Kumar ◽  
J. Fortin ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Ion Implantation ◽  
Dielectric Materials ◽  
Dramatic Improvement ◽  
Force Microscopy ◽  
Low Dielectric ◽  
Quantitative Measurements ◽  
Hardness Increase ◽  
Xerogel Films ◽  
Ion Species

AbstractThin films of low dielectric constant (κ) materials such as Xerogel (ĸ=1.76) and SilkTM (ĸ=2.65) were implanted with argon, neon, nitrogen, carbon and helium with 2 x 1015 cm -2 and 1 x 1016 cm -2 dose at energies varying from 50 to 150 keV at room temperature. In this work we discuss the improvement of hardness as well as elasticity of low ĸ dielectric materials by ion implantation. Ultrasonic Force Microscopy (UFM) [6] and Nano indentation technique [5] have been used for qualitative and quantitative measurements respectively. The hardness increased with increasing ion energy and dose of implantation. For a given energy and dose, the hardness improvement varied with ion species. Dramatic improvement of hardness is seen for multi-dose implantation. Among all the implanted ion species (Helium, Carbon, Nitrogen, Neon and Argon), Argon implantation resulted in 5x hardness increase in Xerogel films, sacrificing only a slight increase (∼ 15%) in dielectric constant.

Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 19-27 ◽  
Author(s):  
Wei William Lee ◽  
Paul S. Ho
Keyword(s):  
Packing Density ◽  
Propagation Delay ◽  
Single Chip ◽  
Crosstalk Noise ◽  
Metal Line ◽  
Total Delay ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
Interconnect Delay ◽  
Interconnect Technology

Continuing improvement of microprocessor performance historically involves a decrease in the device size. This allows greater device speed, an increase in device packing density, and an increase in the number of functions that can reside on a single chip. However higher packing density requires a much larger increase in the number of interconnects. This has led to an increase in the number of wiring levels and a reduction in the wiring pitch (sum of the metal line width and the spacing between the metal lines) to increase the wiring density. The problem with this approach is that—as device dimensions shrink to less than 0.25 μm (transistor gate length)—propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant due to increased wiring capacitance, especially interline capacitance between the metal lines on the same metal level. The smaller line dimensions increase the resistivity (R) of the metal lines, and the narrower interline spacing increases the capacitance (C) between the lines. Thus although the speed of the device will increase as the feature size decreases, the interconnect delay becomes the major fraction of the total delay and limits improvement in device performance.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILD) as well as alternative architectures have been proposed to replace the current Al(Cu) and SiO2 interconnect technology.

Access to Fe(II) Bis(σ-B-H) Aminoborane Complexes via Protonation of a Borohydride Complex and Dehydrogenation of Amine-Boranes

2019 ◽  
Author(s):  
Nikolaus Gorgas ◽  
Berthold Stöger ◽  
Luis F. Veiros ◽  
Karl Kirchner
Keyword(s):  
Structural Characterization ◽  
Ammonium Salts ◽  
Iron Based ◽  
Amine Boranes

We report on the first synthesis and structural characterization of the iron based aminoborane complexes. These species are formed upon protonation of a borohydride complex by ammonium salts.<br>

Protein Solvent Interaction: Transition of Protein-solvent Interaction Concept from Basic Research into Solvent Manipulation of Chromatography

2018 ◽  
Vol 20 (1) ◽  
pp. 34-39 ◽  
Author(s):  
Tsutomu Arakawa ◽  
Yoshiko Kita
Keyword(s):  
Column Chromatography ◽  
Rapid Development ◽  
Academic Research ◽  
Basic Research ◽  
Protein Stabilization ◽  
Special Issue ◽  
Solvent Interaction ◽  
Protein Formulations ◽  
Solvent Additive ◽  
Downstream Processes

Previously, we have reviewed in this journal (Arakawa, T., Kita, Y., Curr. Protein Pept. Sci., 15, 608-620, 2014) the interaction of arginine with proteins and various applications of this solvent additive in the area of protein formulations and downstream processes. In this special issue, we expand the concept of protein-solvent interaction into the analysis of the effects of solvent additives on various column chromatography, including mixed-mode chromatography. Earlier in our research, we have studied the interactions of such a variety of solvent additives as sugars, salts, amino acids, polymers and organic solvents with a variety of proteins, which resulted in mechanistic understanding on their protein stabilization and precipitation effects, the latter known as Hofmeister series. While such a study was then a pure academic research, rapid development of genetic engineering technologies and resultant biotechnologies made it a valuable knowledge in fully utilizing solvent additives in manipulation of protein solution, including column chromatography.

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