Laser and Thermal Vapor Deposition of Metal Sulfide (NiS, PdS) Films and in Situ Gas-Phase Luminescence of Photofragments from M(S2COCHMe2)2

1997 ◽  
Vol 9 (5) ◽  
pp. 1208-1212 ◽  
Author(s):  
Jinwoo Cheon ◽  
David S. Talaga ◽  
Jeffrey I. Zink
1995 ◽  
Vol 142 (7) ◽  
pp. 2357-2362 ◽  
Author(s):  
S. Jonas ◽  
W. S. Ptak ◽  
W. Sadowski ◽  
E. Walasek ◽  
C. Paluszkiewicz

2015 ◽  
Vol 93 (1) ◽  
pp. 82-90 ◽  
Author(s):  
Rim Toukabri ◽  
Yujun Shi

The effect of source gas pressure on the gas-phase reaction chemistry of dimethylsilane (DMS) and monomethylsilane (MMS) in the hot-wire chemical vapor deposition process has been studied by examining the secondary gas-phase reaction products in a reactor using a soft laser ionization source coupled with mass spectrometry. For DMS, the increase in sample pressure has resulted in the formation of small hydrocarbons, including ethene, acetylene, propene, and propyne. This leads to a switch from silylene dominant chemistry to a free radical dominant one with the pressure increase at low filament temperatures of 1200 and 1300 °C. At the lower pressure of 0.12 Torr, the formation of 1,1,2,2-tetramethyldisilane by dimethylsilylene insertion reaction into the Si–H bond in DMS is favored over trimethylsilane produced from a free radical recombination reaction for a short reaction time. However, when the pressure is increased by 10 times, the gas-phase chemistry becomes dominated by the formation of trimethylsilane. We have demonstrated that trapping of the corresponding active intermediates by the small hydrocarbons produced in situ is responsible for the observed switch. In the study with MMS, the gas-phase chemistry is dominated by the formation of 1,2-dimethyldisilane and 1,3-disilacyclobutane at both pressures of 0.48 and 1.2 Torr. Unlike DMS, the gas-phase reaction chemistry with MMS does not involve free radicals, which are the precursors to produce small hydrocarbons. The absence of small hydrocarbons formed in situ with MMS explains the preservation in chemistry upon the increase in pressure when MMS is used as a source gas.


1990 ◽  
Vol 204 ◽  
Author(s):  
Kwok-L. Ho ◽  
Klavs F. Jensen ◽  
Jen-W. Hwang ◽  
John F. Evans ◽  
Wayne L. Gladfelter

ABSTRACTGaN thin films have been deposited on Si and sapphire substrates by metalorganic chemical vapor deposition (MOCVD) using diethylgalliumazide and ammonia. Films were grown in the temperature range of 500-750°C. Growth rates were monitored in situ using laser interferometry. The addition of ammonia enhanced the growth rate significantly. At high temperatures, gas-phase depletion of the precursor reduced the growth rate of GaN. Films grown on (0001)-oriented sapphire substrates at temperatures above 650°C were highly textured with smooth surface morphology. Optical and electrical properties of the films are discussed and compared to those of films grown using conventional Ga and N sources.


1996 ◽  
Vol 429 ◽  
Author(s):  
G. Rittier ◽  
B Tillack ◽  
D. Wolansky

AbstractIn the paper presented the memory effect of boron (B), phosphorus (P), and germanium (Ge) have been studied during the chemical vapor deposition of homoepitaxial Sifilms and heteroepitaxial SiGe- layers in different RTCVD equipment. The CVDprocesses were controlled by surface kinetics on Si substrates from H2, SiH4, GeH4, PH3, and B2H6 at the pressure of 2 mbar in the temperature range of 500°cC–700°C. T1e aufodoping effect from the wafer has been separated from the loading effect of the reactor. The memory effect has been shown to be small for Ge in Si and for B in Si and SiGe. However, a remarkable high memory effect has been found for P, especially in SiGe-films. There are different methods reducing the memory effect in RTCVD-reactors. In-situ gas phase etching by HCI or NF3 gives the best results in the reactors studied here. Based on the obtained results the opportunities and limitations of integrated processing of different Si and SiGe-films (e.g. complete stacks for Si/SiGe-HBT) in the same reaction chamber have been discussed.


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